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Maxtech SI8125 A/B 10:1 condensation type low viscosity silicone potting material

Product Description

●SI8125A/B is used in potting protection of varied components. It can vulcanize to deep layer. The two components have a good fluidity after mixing. The operation time can be adjusted with the proportion of hardener part B. It can bond well with most materials without using any primer. It can be used to fix the accessories to resist water, dust and leakage of electricity.

∎Key Features

●Two-component high transparency liquid silicone rubber, condensation dealcoholization type

●Low viscosity, easy to process and operate

●Low hardening condensation, no corrosion and stressless

●Excellent electric insulativity and stability in high temperature 

●Excellent bonding ability, good water-proof and moisture-proof property

Two Component Silicone Potting Adhesive
Two Component Silicone Potting Adhesive

Sealants for Potting and Encapsulation,Maxtech products for Power control modules, Solar modules, Junction box, LED spotlight, Wall washer light, Strip lights, LED fluorescent lamp

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Encapsulating and Potting Compound for Electronics
Encapsulating and Potting Compound for Electronics

Sealants for Potting and Encapsulation,Maxtech products for Power control modules, Solar modules, Junction box, LED spotlight, Wall washer light, Strip lights, LED fluorescent lamp

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Potting Electronics With Silicone
Potting Electronics With Silicone

Primarily designed for the manufacture of optical device modules, and can be used for injection molding an optical lens and an optical wave guide coupling reduces scattering loss.

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Two Component Silicone Potting Adhesive
Two Component Silicone Potting Adhesive

Sealants for Potting and Encapsulation,Maxtech products for Power control modules, Solar modules, Junction box, LED spotlight, Wall washer light, Strip lights, LED fluorescent lamp

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∎Typical Applications

 • Used for Automotive electronics, modules like Power control modules, Solar modules, Junction box, LED spotlight, Wall washer light, Strip lights, LED fluorescent lamp, etc.

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Potting compound - for potting and encapsulation
electrical potting and sealing compound
Electronic Potting & Sealing Compounds
Waterproof Electrical Potting Compound Sealant
Potting Adhesives
waterproof electronic potting compound
General Use Silicone Encapsulants & Potting Compounds
Potting Electronics With Silicone
Electrical Potting
Optically Clear Silicone Potting Compound
Optically Clear Polymer LED Encapsulants
Encapsulating and Potting Compound for Electronics
clear silicone potting compound
Clear Potting Compounds
Clear silicone potting compound
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Transparent Silicone Potting Compound
clear silicone potting compound
Optically Clear polyer LED Encapsulants
Clear LED Potting
Clear Silicone Potting Compound Gel For IGBT Module
Potting Electronics With Silicone

∎Technical Data Table

TESTING ITEM                     ESTING STANDARD                                                               Part A                                                                                                                                              Part B

 

                                                                                                          8125T                          8125M                               8125W           8125 W-1                                                        8125B                8125T                 8125

Color                                    Visual inspection                    Colorless transparent fluid   Matte transparent white fluid   White fluid    White low viscosity fluid                                 Black fluid       Colorless fluid      Colorless fluid

Viscosity, cps , 25℃          GB/T 10247-2008                                    1,300                                  1,800                              3,500            2,100                                                             2,100                      50                    50

Density,,g/cm3, 25℃           GB/T 15223-1994                                  1.02                                    1.03                                 1.18              1.18                                                                1.18                     0.98                0.98

Corresponding curing agent (Part B)                                             2225T                                2225T                               2225             2225                                                               2225                       ---                      ---

Mixture ratio                                  Weight Ratio                                                                                                             A:B=100: (10±3)

Viscosity of mixture,25°C, cps    GB/T 10247-2008                      1,000                                    1,000                                 2,300            1,500                                                               1,500                     ---                      ---

Operation time,mins , 25℃      GB/T 10247-2008                            40                                        40                                      40                    50                                                                    40                     ---                      ---

 

 

                                                                                                                                                                         The operation time can be adjusted with the proportion of hardener part B.

Surface hardening time, min    GB/T 10247-2008                                                                                                                                                         70~180mins

Characteristics after curing

 

Cured appearance                     Visual inspection            Colorless transparent elastomer       Matte white elastomer   White elastomer   White elastomer                                Black elastomer                ---                    ---

Hardness, Shore A                        GB/T 531-2008                             21                                           21                                    28                    15                                                           12                              ---                     ---

Tensile strength,Mpa                    GB/T 528-2009                              1.0                                         1.0                                   1.2                     1.2                                                          1.2                            ---                      ---

Shear strength,Mpa                      GB/T 7124-2008                             0.3                                        0.3                                   0.7                      0.7                                                          0.7                           ---                      ---

Loss factor (1 MHz)                      GB/T 1693-2007                                                                                                                                                <0.008

Dielectric strength,kV/mm,25℃    GB/T 1695-2005                                                                                                                                                  ≥20

Volume resistance  DC 500V , Ω·CM   GB/T 1692-92                                                                                                                                            1.1×1015

Dielectric constant(1 MHz)           GB/T 1693-2007                                                                                                                                               <3.00

Long-term apply temperature,°C      GBT 20028-2005                                                                                                                                         -50~150

Note:Above operation time was resulted based on 110g mixture, all data of cured state were tested after 7 days curing under 25°C, 55%RH.

 

 

How to use ?
  1. Mix Part A and Part B by 100:10 mass ratio, after evenly mixed, pouring directly into the components or modules as per requirements. It’s recommended to slowly pour along the walls of the implements, so as to reduce the bubbles happens.

  2. Still the potted component to let out the bubbles. Vacuum defoaming process of the mixture before potting can improve the performance.

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Packing Specification

  1. SI8125T,Transparent,code:0104020    Part A:10kg/drum  ; Part B: 1kg/pot

  2. SI8125M, Matte transparent white,code:0104050    Part A:10kg/drum  ; Part B: 1kg/pot

  3. SI8125B , black,code:0104000    Part A:10kg/drum  ; Part B: 1kg/pot

  4. SI8125W, white,code:0104010    Part A:10kg/drum  ; Part B: 1kg/pot 

  5. SI8125W-1,White low viscosity,code:0104040  Part A:10kg/drum  ; Part B: 1kg/pot

  6. Customized packing

∎Transport &Storage

When stored at or below -5~30°C in the original unopened containers, this product has a usable life of 12 months from the date of production. Sampling test is necessary for products which exceed shelf life before taking use. Beyond this date, Maxtech Chemical no longer guarantees that the products meet sales specifications.

 

It’s non-dangerous goods, can be transported as normal chemicals, CAUTION leakage during transport.

∎Remark

THERMAL POTTING COMPOUND

High thermal conductivity potting compound is used to create a protective barrier around high-heat electrical appliances, components, and motors to prevent overheating. Thermal potting compounds are also used for potting electrical circuits and filling voids to protect fragile components from corrosive agents, water, moisture, vibration, shock, and chemicals.

High thermal conductivity potting compounds are used for a variety of high-temperature applications. Electronics potting and encapsulating compounds by Maxtech are formulated for consistent material performance, with excellent dielectric properties, electrical insulation resistance, thermal conductivity, thermal shock resistance, mechanical strength, adhesion, hardness, cure speed, and chemical resistance.

High thermal potting compounds for electrical equipment that may generate a lot of heat. For example, motors can overheat and cause damage to the rest of an electrical or mechanical device. Thermal potting compounds have a wide operating temperature range, which can prevent motors from overheating.