Maxtech SI8125 A/B 10:1 condensation type low viscosity silicone potting material
∎Product Description
●SI8125A/B is used in potting protection of varied components. It can vulcanize to deep layer. The two components have a good fluidity after mixing. The operation time can be adjusted with the proportion of hardener part B. It can bond well with most materials without using any primer. It can be used to fix the accessories to resist water, dust and leakage of electricity.
∎Key Features
●Two-component high transparency liquid silicone rubber, condensation dealcoholization type
●Low viscosity, easy to process and operate
●Low hardening condensation, no corrosion and stressless
●Excellent electric insulativity and stability in high temperature
●Excellent bonding ability, good water-proof and moisture-proof property
Sealants for Potting and Encapsulation,Maxtech products for Power control modules, Solar modules, Junction box, LED spotlight, Wall washer light, Strip lights, LED fluorescent lamp
Sealants for Potting and Encapsulation,Maxtech products for Power control modules, Solar modules, Junction box, LED spotlight, Wall washer light, Strip lights, LED fluorescent lamp
Primarily designed for the manufacture of optical device modules, and can be used for injection molding an optical lens and an optical wave guide coupling reduces scattering loss.
Sealants for Potting and Encapsulation,Maxtech products for Power control modules, Solar modules, Junction box, LED spotlight, Wall washer light, Strip lights, LED fluorescent lamp
∎Technical Data Table
TESTING ITEM ESTING STANDARD Part A Part B
8125T 8125M 8125W 8125 W-1 8125B 8125T 8125
Color Visual inspection Colorless transparent fluid Matte transparent white fluid White fluid White low viscosity fluid Black fluid Colorless fluid Colorless fluid
Viscosity, cps , 25℃ GB/T 10247-2008 1,300 1,800 3,500 2,100 2,100 50 50
Density,,g/cm3, 25℃ GB/T 15223-1994 1.02 1.03 1.18 1.18 1.18 0.98 0.98
Corresponding curing agent (Part B) 2225T 2225T 2225 2225 2225 --- ---
Mixture ratio Weight Ratio A:B=100: (10±3)
Viscosity of mixture,25°C, cps GB/T 10247-2008 1,000 1,000 2,300 1,500 1,500 --- ---
Operation time,mins , 25℃ GB/T 10247-2008 40 40 40 50 40 --- ---
The operation time can be adjusted with the proportion of hardener part B.
Surface hardening time, min GB/T 10247-2008 70~180mins
Characteristics after curing
Cured appearance Visual inspection Colorless transparent elastomer Matte white elastomer White elastomer White elastomer Black elastomer --- ---
Hardness, Shore A GB/T 531-2008 21 21 28 15 12 --- ---
Tensile strength,Mpa GB/T 528-2009 1.0 1.0 1.2 1.2 1.2 --- ---
Shear strength,Mpa GB/T 7124-2008 0.3 0.3 0.7 0.7 0.7 --- ---
Loss factor (1 MHz) GB/T 1693-2007 ＜0.008
Dielectric strength,kV/mm,25℃ GB/T 1695-2005 ≥20
Volume resistance DC 500V , Ω·CM GB/T 1692-92 1.1×1015
Dielectric constant(1 MHz) GB/T 1693-2007 ＜3.00
Long-term apply temperature,°C GBT 20028-2005 -50~150
Note：Above operation time was resulted based on 110g mixture, all data of cured state were tested after 7 days curing under 25°C, 55%RH.
How to use ?
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Mix Part A and Part B by 100:10 mass ratio, after evenly mixed, pouring directly into the components or modules as per requirements. It’s recommended to slowly pour along the walls of the implements, so as to reduce the bubbles happens.
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Still the potted component to let out the bubbles. Vacuum defoaming process of the mixture before potting can improve the performance.
∎Packing Specification
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SI8125T,Transparent，code：0104020 Part A：10kg/drum ； Part B： 1kg/pot
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SI8125M, Matte transparent white，code：0104050 Part A：10kg/drum ； Part B： 1kg/pot
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SI8125B , black，code：0104000 Part A：10kg/drum ； Part B： 1kg/pot
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SI8125W, white，code：0104010 Part A：10kg/drum ； Part B： 1kg/pot
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SI8125W-1,White low viscosity，code：0104040 Part A：10kg/drum ； Part B： 1kg/pot
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Customized packing
∎Transport &Storage
● When stored at or below -5~30°C in the original unopened containers, this product has a usable life of 12 months from the date of production. Sampling test is necessary for products which exceed shelf life before taking use. Beyond this date, Maxtech Chemical no longer guarantees that the products meet sales specifications.
It’s non-dangerous goods, can be transported as normal chemicals, CAUTION leakage during transport.
∎Remark
● THERMAL POTTING COMPOUND
High thermal conductivity potting compound is used to create a protective barrier around high-heat electrical appliances, components, and motors to prevent overheating. Thermal potting compounds are also used for potting electrical circuits and filling voids to protect fragile components from corrosive agents, water, moisture, vibration, shock, and chemicals.
High thermal conductivity potting compounds are used for a variety of high-temperature applications. Electronics potting and encapsulating compounds by Maxtech are formulated for consistent material performance, with excellent dielectric properties, electrical insulation resistance, thermal conductivity, thermal shock resistance, mechanical strength, adhesion, hardness, cure speed, and chemical resistance.
High thermal potting compounds for electrical equipment that may generate a lot of heat. For example, motors can overheat and cause damage to the rest of an electrical or mechanical device. Thermal potting compounds have a wide operating temperature range, which can prevent motors from overheating.
