Ep3115(3517)Black flexible epoxy potting compound

EP 3115 (3517) A/B is a two-component solvent-free epoxy potting compound that cures at room temperature. It is suitable for the encapsulation and protection of products with high thermal conductivity requirements in motors, automotive electronics, power tools, reactors, and instruments, and has good adhesion and insulation performance.

Black flexible epoxy potting compound is a versatile two-part epoxy resin system designed to encapsulate, insulate, and protect electronic components and assemblies from environmental factors, mechanical stress, and electrical hazards. Its unique combination of flexibility, thermal stability, and electrical insulation properties makes it an ideal choice for a wide range of applications across industries.

The EP 3115 (3517) A/B has the following characteristics:
* Excellent adhesion and crack resistance
* It has a relatively high thermal conductivity
* Excellent electrical insulation and stability
* It can be used within the temperature range of -50℃ to 200℃
* It has a low water absorption rate and excellent water and moisture resistance
* It has excellent adhesion to metals (iron, aluminium and copper)
* UL 94 V-0

Applications Across Industries

Black flexible epoxy potting compound is widely used in various industries where protection, flexibility, and electrical insulation are critical:

Packaging and storage

EP 3115 (3517) Black flexible epoxy potting compound

l Components A and B should be stored away from light, heat and in a sealed container (they can be transported and stored as non-hazardous materials). The storage period is one year.

Component A :20kg/ plastic drum; Component B :4kg/ iron drum

Black flexible epoxy potting compound is a versatile and reliable solution for protecting electronic components and assemblies from mechanical stress, environmental factors, and electrical hazards. Its unique combination of flexibility, electrical insulation, thermal stability, and chemical resistance makes it an ideal choice for a wide range of applications across industries. By selecting the right product for your specific needs, you can enhance the reliability, performance, and lifespan of your electronic devices and systems.

If you need help comparing specific product specifications or selecting the best black flexible epoxy potting compound for your application, I can assist you in evaluating key factors and identifying the ideal solution. Would you like me to help with that

Ep3115(3517)Black flexible epoxy potting compound

$22.00

$660.00 per 30 Kilograms

Color: Clear Yellow

Quantity

Test items   Test standard   Unit   Part A   Part B

Colour
Visual
---
Black plasma   Colorless or pale yellow transparent
Viscosity   GB/T 2794-2022   25℃ , mPa ·s   25,000±5,000   50±20
Density   GB/T 13354-1992   25℃ , g/cm3   1.65±0.05   1.0±0.05
Mixing ratio   Mass ratio   Ratio=A:B   100：20
Mixed viscosity   GB/T 2794-2022   150g,mPa ·s   25℃   2,000±500
Operation time   GB/T 2794-2022   A+B= 150g, min   40-80
Gel time   GB/T 2794-2022   25℃ , hr   ≥5
Hardness   GB/T 531-2008   Shore D   30-50
Thermal conductivity   GB/T 10297-2015   W/（m·K）   0.7
Shear strength   GB/T 7124-2008   Mpa, Iron-Iron   ≥2.5
Curing shrinkage rate   HG/T 2625-1994   %   ≤1.2
Dielectric strength   GB/T 1693-2007   kV/mm（25℃)   ≥14
Loss factor   GB/T 1693-2007   （1MHz）(25℃)   ≤0.005
Dielectric constant   GB/T 1693-2007   （1MHz）(25℃)   ≤2.8
Volume resistance   GB/T 1692-2008   DC500V,Ω · cm   ≥1.0E +11
Operation process
l Mixing: Due to sedimentation of fillers in Component A over time, stir Component A thoroughly in its original container before use. Weigh Components A and B in a 100:20 weight ratio, mix uniformly, and proceed with potting.
l Component B may crystallize or form lumps during storage (normal behavior). If crystallization occurs, melt it in an 80°C oven before use, then cool to room temperature. This does not affect its performance.
l Component B reacts with moisture in the air, producing a white powdery residue (hydrolysis byproduct). Avoid introducing this residue during weighing.
l Mixing may entrap air bubbles. Perform vacuum defoaming to enhance the electrical performance of the final product.
l If Component A is too viscous, preheat it at 40°C before mixing with Component B (100:20 ratio).
l Initial curing conditions: 25℃ for 24 hours or curing at 80℃ for 2 hours as designed after potting.
l Customers can adjust the curing temperature and time according to the actual size and dimensions of the potting object. The smaller the size, the shorter the curing time.
l For machine potting, consult our marketing department.
l Heat Components A and B separately in tanks to reduce viscosity, improving flow and penetration during potting.
l The amount of Component B in the curing agent—whether higher or lower than the normal ratio—will reduce the product's hardness at elevated temperatures.
l The greater the difference in the addition amount of component B of the curing agent, the greater the hardness change of the colloid and the worse its temperature resistance.
Packaging and storage
EP 3115 (3517) Black flexible epoxy potting compound
l Components A and B should be stored away from light, heat and in a sealed container (they can be transported and stored as non-hazardous materials). The storage period is one year.
Component A :20kg/ plastic drum; Component B :4kg/ iron drum
Packaging and storage

EP 3115 (3517) Black flexible epoxy potting compound

l Components A and B should be stored away from light, heat and in a sealed container (they can be transported and stored as non-hazardous materials). The storage period is one year.

Component A :20kg/ plastic drum; Component B :4kg/ iron drum
As a manufacturer, we would like to share with you what we have learned about the different types of potting compounds and their characteristics.
The potting compounds on the market vary in viscosity, requirements for cure conditions, among other factors. Compounds such as polyurethane, silicone, and epoxy are widely used in a variety of applications.
Silicone Potting Compounds are soft and flexible, silicone potting compounds and encapsulating materials possess a good level of elongation.Silicone potting compound can also withstand a wide range of temperatures. Most silicone materials are able to operate at temperatures between -40°C and 200°C.
Epoxy potting compounds generally perform as a better adhesive, high-temperature resistance, and chemical resistance and have better adhesion to a wide variety of substrates and typically do not need primers.
Polyurethane Potting Compounds generally have better flexibility, elongation, and abrasion resistance.
Acrylic Potting Compounds are UV and heat-hardening materials, with fast hardening, adequate chemical resistance, and clear appearance.
Applications Across Industries
Black flexible epoxy potting compound is widely used in various industries where protection, flexibility, and electrical insulation are critical:

🚗 Automotive and Transportation
Engine Components: Protecting sensors, actuators, and control modules under the hood from vibration, heat, and chemicals.
Infotainment Systems: Encapsulating printed circuit boards (PCBs) in car audio systems, navigation devices, and dashboard electronics.
Battery Management Systems (BMS): Protecting electronic components in EV and HEV battery packs from mechanical stress and thermal fluctuations.
🏭 Industrial Automation
Sensors and Transmitters: Encapsulating pressure sensors, temperature sensors, and flow transmitters used in process control applications.
Motor Controls: Protecting motor starters, drives, and variable frequency drives (VFDs) from dust, moisture, and vibration.
Power Supplies: Encapsulating AC-DC power supplies, DC-DC converters, and battery chargers for industrial equipment.
📱 Consumer Electronics
LED Lighting: Encapsulating LED drivers, controllers, and modules in lighting fixtures, providing protection and improving thermal management.
Wearable Devices: Protecting PCBs in smartwatches, fitness trackers, and other wearable electronics from moisture, dust, and mechanical stress.
Audio Equipment: Encapsulating amplifiers, speakers, and audio components in headphones, portable speakers, and home theater systems.
🛰️ Aerospace and Defense
Avionics: Protecting navigation systems, communication devices, and flight control components in aircraft and spacecraft.
Military Electronics: Encapsulating radar systems, guidance systems, and communication equipment for military applications, ensuring reliability in harsh environments.
Satellite Components: Protecting electronic assemblies in satellites from extreme temperatures, vacuum, and radiation.

Ep3115(3517)Black flexible epoxy potting compound

∎Technical Data Table

Precautions

Storage and Transportation

Order & Shipping

Different potting materials

Application