Maxtech SI8250 Optically Clear Silicone Rubber Encapsulant Transparent Potting Compound
∎Product Description
SI8250 is high purity two-component heat curing silicone materials. Primarily designed for the manufacture of optical device modules, and can be used for injection molding an optical lens and an optical waveguide coupling reduces scattering loss. Resistance to environmental pollution, moisture, shock, vibration, etc., Maintain optical properties, mechanical properties, and electrical properties in a wide range of temperature, humidity, and harsh environmental conditions.
∎Key Features
1. High transparency
2. Excellent heat resistance
3. Long-term resistance to UV-A and UV-B
4. No yellowing
5. Fast curing and rapid demold
6. Extremely accurate molding effect
7. Lighter than glass
Primarily designed for the manufacture of optical device modules, and can be used for injection molding an optical lens and an optical wave guide coupling reduces scattering loss.
Optically Clear Potting Compounds for LEDs
Primarily designed for the manufacture of optical device modules, and can be used for injection molding an optical lens and an optical wave guide coupling reduces scattering loss.
Primarily designed for the manufacture of optical device modules, and can be used for injection molding an optical lens and an optical wave guide coupling reduces scattering loss.
∎Technical Data Table
PROPERTY STANDARD/UNITS VALUE of SI8250
---- ---- PART A PART B
Material ---- Polysiloxane Hydrogen polysiloxane
Color Visual inspection Colorless liquid Colorless liquid
Viscosity 25°C, cps 4000-6000 4000-6000
Density 25°C, g/cm3 0.99 0.99
Mixture/mass ratio ---- A:B=100:100
Operation time 25°C, min 100mins/25℃, 70mins/28℃,
Cure condition ---- 25℃/24 hr or 100℃/ 60mins
Cured appearance ---- Colorless
Hardness Shore00 50
Tensile strength MPa 5.5
Elongation % 100
Shear strength N/mm2 3
Index of refraction 25°C 1.4120
Light Transmission 450nm@1mm,% > 90
Volume resistance ohm.cm 2×1015
Dielectric constant 1MHz 3.8
Dielectric loss 1MHz 0.04
Note：All above data were tested under standardized conditions or tested by further experiments.
How to use ?
-
1. The substrate surface should be clean and dry. The substrate can be heated to remove surface moisture. Using naphtha, methyl ethyl ketoxime (MEK) or other suitable solvent to clean surface of the substrate. It should not use the solvent which dissolve or corrode to the substrate, should not use residual solvent.
-
2. Please keep accurate weigh to a clean glass container and mix thoroughly. When using high speed mixing equipment, heat will generate and the work time will reduce.
-
3. Under 10mmHg vacuum extrusion bubble. Usually prolapse bubbles before dispensing packaging material.
-
4. In most cases, the polysiloxane is suitable for working long hours at -45°C to 200°C, the maximum short-term resistant to 350°C, the specific use, it is best to test the actual requirements.
-
5. Before the uncured material, containing not touch N \ P \ S and other organic matter, cannot touch Sn \ Pb \ Hg \ Bi \ As the ionic compound, etc., cannot touch the acetylene-containing \ active vinyl compound, peroxide cannot touch not touch the water gas and alcohols. These substances will hinder curing material reaches a certain concentration, the specific performance of three phenomena: the flow has been in a state completely cured, and the substrate base surface with thin fluid or in Las state, the contact surface and the substrate smiling bubbles. Fully test before use.
-
6. Should be cured by heating using a hot air oven ventilation to prevent the accumulation of trace amounts of hydrogen generated in the curing process to produce an explosion hazard.
∎Packing Specification
-
Part A: 0.5kg/Pot, Part B:0.5kg/Pot;
-
Part A:5kg/Pot, Part B:5kg/Pot.
∎Transport &Storage
● When stored at or below -5~30°C in the original unopened containers, this product has a usable life of 12 months from the date of production. Sampling test is necessary for products which exceed shelf life before taking use. Beyond this date, Maxtech Chemical no longer guarantees that the products meet sales specifications.
It’s non-dangerous goods, can be transported as normal chemicals, CAUTION leakage during transport.
∎Remark
● THERMAL POTTING COMPOUND
High thermal conductivity potting compound is used to create a protective barrier around high-heat electrical appliances, components, and motors to prevent overheating. Thermal potting compounds are also used for potting electrical circuits and filling voids to protect fragile components from corrosive agents, water, moisture, vibration, shock, and chemicals.
High thermal conductivity potting compounds are used for a variety of high-temperature applications. Electronics potting and encapsulating compounds by Maxtech are formulated for consistent material performance, with excellent dielectric properties, electrical insulation resistance, thermal conductivity, thermal shock resistance, mechanical strength, adhesion, hardness, cure speed, and chemical resistance.
High thermal potting compounds for electrical equipment that may generate a lot of heat. For example, motors can overheat and cause damage to the rest of an electrical or mechanical device. Thermal potting compounds have a wide operating temperature range, which can prevent motors from overheating.
