PU 8110（15#） 1.5W/mk High Thermal conductive polyurethane potting sealant
 
Product features and applications
PU 8110(15#) A/B is a two-component solvent-free polyurethane potting-sealing adhesive with high thermal conductivity at room temperature or heat curing. It is used for two-component sealing and filling. The raw material does not contain heavy metals, green environmental protection, wide process operability, high physical properties of the finished product, and good adhesion to the substrate. The two components have good fluidity after mixing, which is applied to the pouring and posing of communication equipment, transformers, control power supplies, ignition controllers, electronic sensors, etc.
 
High thermal conductivity, low viscosity, strong operability
Excellent low temperature characteristics, excellent weather resistance
Excellent electrical insulation and stability
Good waterproof, moisture resistance, water absorption is very low
Good adhesion to most metals and plastics
Thermal conductivity ≥1.55W/m.k
 
Typical application
 
This product is often used in electronic capacitors, automotive electronic module potting;
Household appliances such as lampblack stove, microwave oven, rice cooker, washing machine, air conditioning control PCB board filling glue seal; 
Life smart toilet, induction toilet, metal induction garbage can circuit board and magnetic coil of moisture and waterproof potting protection
Process of use
 
Material extraction: Material A of this product contains functional filling powder, and there will be clear liquid on the upper layer of the glue. Before use, it is necessary to stir the original packaging glue evenly and then remove the material for use. After taking the material, seal the original package in time to prevent excessive contact with water. After the rubber material is exposed to air for a long time, it may lead to bubbling phenomenon after mixing AB material. If possible, the raw material A packaging can be placed in a constant temperature environment of 25℃.
Operation matters: Material B exposed to the atmosphere will absorb water and hydrolysis occurs, the phenomenon is cloudy until caked, material A also needs to be stored against the tide, so as not to generate too many bubbles during curing. The environment of the curing process should be controlled as low as possible, and the relative humidity should not exceed 60%.
Preheating: Please bake the poured device at 70~80℃ for 1~2 hours. The temperature can also be reduced and the heating time extended to remove device moisture. 8110(15#) At low temperatures, the viscosity will become high, and the material can be preheated to 30℃ ~50℃, which is easy to use.
Defoaming: Vacuum the A\B barrel respectively and stir at the same time to ensure that the A\B glue is vacuum-free before mixing.
Curing: It takes 3 days to fully cure at 25℃. The ambient humidity should be controlled at <70%, and the curing time should be extended when the temperature is low.