2.0 W/M K Thermal Conductivity PCB Thermal Conductive Silicone Gel Potting Compound Glue
Two Component 3.0 W/m.K High Thermally Conductive Silicone Potting and Encapsulation Adhesive Sealant
∎Product Description
●SI8230 is two-component silicone based thermal conductive potting adhesive. It is with Thermally Conductive, two parts, low viscosity potting compound that cures at room temperature to a soft pliable rubber. Will cure in deep sections. Designed to achieve primerless adhesion to many substrates, including metals, plastics, and ceramics.
It has a good fluidity after mixing, can vulcanize to deep layer in room temperature. The operation time can be adjusted according to the temperature. Used to potting protection of varied heat dissipation and temperature resistance components. Fully compliant with RoHS and SVHC REACH standard.
8230 thermally conductive silicone encapsulants can be used in potting applications to dissipate heat away from a component to a suitable heat sink. They also provide protection from harsh environments, vibration and thermal shock. Addition cure silicones provide deep section cure allowing for complete encapsulation for environmental protection whilst maintaining an effective heat path.
∎Application
●Used for encapsulation of various modules, automotive module, LED Power driver modules, Solar panel junction box, EV charging column module, Lithium battery pack, Capacitor banks, Magnetic induction coils, Power inverters, etc.
∎Technical Data Table
TESTING ITEM ESTING STANDARD Part A Part B
Color Visual inspection Gray viscous liquid White viscous liquid
Viscosity, cps , 25℃ GB/T 10247-2008 6000±1000 5000±1000
Density,,g/cm3, 25℃ GB/T 15223-1994 2.65±0.05 2.65±0.05
Mixture ratio Weight Ratio A：B = 100：100
Viscosity of mixture,4#rotor,cps , 25℃ GB/T 10247-2008 5000±1000
Operation time,mins , 25℃ GB/T 10247-2008 30-50
Initial Setting time, hrs GB/T 10247-2008 3-5
Cure condition GB/T 10247-2008 25℃/12 hr or 70℃/ 60mins, 80℃/ 30mins
Characteristics after curing
Cured appearance Visual inspection Gray elastomer
Hardness, Shore A GB/T 531-2008 32 （ Shore 0085）
Thermal conductivity，W/mK GB/T 10297-1998 2.0±0.1
Tensile strength , Mpa GB/T 528-1998 >0.3
Elongation , % GB/T 528-1998 >50
Linear expansion，K-1，ppm HGT 2625-1994 150
Dielectric strength ,kV/mm, 25℃ GB/T 1695-2005 ≥15
Volume resistance,DC 500V， Ω·CM GB/T 1692-92 1.2×1013
Loss factor(1 MHz) GB/T 1693-2007 0.01
Dielectric constant(1 MHz) GB/T 1693-2007 5.8
Application temperature, ℃ GBT 20028-2005 - 60 ∽ 200
A 2.0 W/m·K silicone potting sealant is a high-performance thermal interface material (TIM) that efficiently transfers heat from electronic components, offering excellent electrical insulation, environmental protection, and flexibility for applications in automotive electronics, power supplies, sensors, and LED lighting, often in two-component liquid or gel forms for easy dispensing and reworkability.
For the sealant, any inquiry, please feel free to contact us directly, and don't place the order directly
Whatsapp: +8618321208486 Email: maxtech@shmaxtech.com
2.0 W/M K Thermal Conductivity PCB Thermal Conductive Silicone Gel Potting Glue
For the orders, normally we do shipping by sea.
For the samples, we will ship by air through Fedex, UPS or DHL.
Any inquiry, please contact us directly by email or whatsapp, please don't place the order, we need to evaluate the shipping way and freight, thanks a lot.
