Two-Component 2.0~3.0W/Mk Power Supply PCB CPU New Energy Sealing Potting Compouds
Two Component 3.0 W/m.K High Thermally Conductive Silicone Potting and Encapsulation Adhesive Sealant
∎Product Description
●SI8230 is two-component silicone based thermal conductive potting adhesive. It is with Thermally Conductive, two parts, low viscosity potting compound that cures at room temperature to a soft pliable rubber. Will cure in deep sections. Designed to achieve primerless adhesion to many substrates, including metals, plastics, and ceramics.
It has a good fluidity after mixing, can vulcanize to deep layer in room temperature. The operation time can be adjusted according to the temperature. Used to potting protection of varied heat dissipation and temperature resistance components. Fully compliant with RoHS and SVHC REACH standard.
8230 thermally conductive silicone encapsulants can be used in potting applications to dissipate heat away from a component to a suitable heat sink. They also provide protection from harsh environments, vibration and thermal shock. Addition cure silicones provide deep section cure allowing for complete encapsulation for environmental protection whilst maintaining an effective heat path.
∎Application
●Used for encapsulation of various modules, automotive module, LED Power driver modules, Solar panel junction box, EV charging column module, Lithium battery pack, Capacitor banks, Magnetic induction coils, Power inverters, etc.
∎Technical Data Table
TESTING ITEM ESTING STANDARD Part A Part B
Color Visual inspection White viscous liquid White viscous liquid
Viscosity, cps , 25℃ GB/T 10247-2008 11000±3000 8000±2000
Density,,g/cm3, 25℃ GB/T 15223-1994 3.03±0.2 3.038±0.2
Mixture ratio Weight Ratio A：B = 100：100
Viscosity of mixture,4#rotor,cps , 25℃ GB/T 10247-2008 9000±3000
Operation time,mins , 25℃ GB/T 10247-2008 30-70
Initial Setting time, hrs GB/T 10247-2008 5±2
Cure condition GB/T 10247-2008 25℃/24 hr or , 80℃/ 30mins
Characteristics after curing
Cured appearance Visual inspection White elastomer
Hardness, Shore A GB/T 531-2008 35±10 (80±10 shore 00)
Thermal conductivity，W/mK GB/T 10297-1998 3.0±0.2
Linear expansion，K-1，ppm HGT 2625-1994 130
Dielectric strength ,kV/mm, 25℃ GB/T 1695-2005 ≥13
Volume resistance,DC 500V， Ω·CM GB/T 1692-92 1.2×1013
Loss factor(1 MHz) GB/T 1693-2007 0.01
Dielectric constant(1 MHz) GB/T 1693-2007 5.8
Application temperature, ℃ GBT 20028-2005 - 60 ∽ 200
Flame resistance UL-94 1.5mm V-0(E547224)
For the sealant, any inquiry, please feel free to contact us directly, and don't place the order directly
Whatsapp: +8618321208486 Email: maxtech@shmaxtech.com
Two-Component 3.0W/Mk Power Supply PCB CPU New Energy Silicone Potting Compound
For the orders, normally we do shipping by sea.
For the samples, we will ship by air through Fedex, UPS or DHL.
Any inquiry, please contact us directly by email or whatsapp, please don't place the order, we need to evaluate the shipping way and freight, thanks a lot.
