Ep3225(32a)High temperature heating curing epoxy potting material Compound

EP 3225(32a)A/B is a two-component solvent free heating and curing epoxy potting material with strong operation and excellent aging resistance at high and low temperatures.

A high-temperature heating curing epoxy potting compound is a two-part, thermosetting material designed to encapsulate, insulate, and protect electronic components, circuit boards, and mechanical assemblies. Unlike room-temperature curing epoxies, these compounds require controlled heat to initiate and complete the curing process, resulting in a rigid, chemically resistant, and thermally stable matrix.

EP 3225(32a)A/B has the following characteristics:

* Low coefficient of linear expansion

* Curing shrinkage

* High hardness and good toughness

*Excellent electrical insulation and thermal stability

* Low viscosity

* Temperature resistance Class H

*Temperature resistance range -50-200℃

* Good resistance to high and low temperature impact

Typical application

Reactor, pressure sensor, temperature sensor, industrial control module, motor stator, etc

High-temperature heating curing epoxy potting compounds are trusted in a wide range of critical applications:

Aerospace: Encapsulating avionics, satellite components, and engine sensors to withstand extreme temperatures and vibration.
Automotive: Protecting engine control units (ECUs), ignition modules, and sensor assemblies under the hood.
Electronics: Insulating power supplies, transformers, and high-temperature resistors in industrial and consumer electronics.
Industrial Manufacturing: Potting valves, pumps, and sensors in processing plants where exposure to high temperatures and chemicals is common.
High-temperature heating curing epoxy potting compounds are indispensable for protecting critical components in demanding environments. Their exceptional thermal resistance, electrical insulation, and mechanical durability make them the preferred choice for engineers and manufacturers across industries. Whether you’re designing aerospace electronics, automotive sensors, or industrial machinery, investing in a high-quality heating curing epoxy potting compound will ensure the reliability and longevity of your products.
If you need help selecting the perfect compound for your specific application, I can assist you in comparing key specifications of top-rated high-temperature epoxy potting compounds. Would you like me to help with that?

Ep3225(32a)High temperature heating curing epoxy potting material Compound

$11.50

$345.00 per 30 Kilograms

Color: Black

Quantity

Test items   Test standard   unit   A   B
Color   Visual   ---   Black or original color paste   Brown liquid
Viscosity   GB/T 2794-2022   25℃ , mPa·s   70,000±20,000
(64#/5rpm)   45±15
(64#/5rpm)
Density   GB/T 13354-1992   25℃ , g/cm3   1.80±0.05   1.21±0.05
Mixing ratio   Mass ratio   Ratio=A:B   100:20

Mixing viscosity

GB/T 2794-2022   mPa·s ,25℃   1500±500
       mPa·s ,40℃   700±100
       mPa·s ,60℃   300±50
       mPa·s ,80℃   120±50

Operating time
GB/T 10247-2008   25℃   2h
       40℃   95min
       60℃   70min
       80℃   50min
Hardness   GB/T 531.1-2008   Shore D ，25℃   90±5
Glass transition
temperature   DSC   ℃   140
Thermal conductivity   GB/T 10297-1998   W/m.k   0.7
Shear strength   GB/T 7124-2008   Mpa   10, Al-Al
Cure shrinkage rate   HG/T 2625-1994   %   0.90
Water absorption   GB/T 8810-2005   24h ，25℃ , %   0.1
Dielectric strength   GB/T 1693-2007   kV/mm（25℃)   ≥18
Dielectric loss   GB/T 1693-2007   （1MHz）(25℃)   0.002
Dielectric constant   GB/T 1693-2007   （1MHz）(25℃)   3.9
Preparation: A\B material will have layered settlement during storage, so before each use, put the package into the oven at 60 ° C for 1 hour, and then take it out and stir evenly, at this time the viscosity will be lower than the viscosity at room temperature, and weigh in the case of temperature.
Glue: The A and B components are weighed according to the weight ratio of 100:20.
Stir evenly and set aside after vacuum debubbling.
If necessary, the potting device can continue to be vacuumed, which is conducive to increasing the electrical performance of the device.
Curing conditions: 80℃*2h+130℃/2h.
If you need to use glue filling equipment, please consult our Marketing Department.
Packing and Storage
MDEP 3225(32a) Black epoxy potting compound Order code: A: 2KEP0005; B: 2KEP0002
MDEP 3225(32a) white epoxy potting compound Order code: A: 2KEP0001; B: 2KEP0002
l Components A and B should be kept away from light and heat and sealed (can be transported and stored as non-dangerous goods); The storage period is one year.
* Component A: 25kg/ barrel;
* Component B: 5kg/ barrel
l This product should be stored in A cool and    dry environment below 25℃ , and the storage period of A/B below 25℃ is 1 year.

l The products that exceed the storage period should be tested to confirm whether there is  any abnormality before use.

l Such products are classified as     non-dangerous goods and can be

transported as general chemicals. Be careful of leaks during transportation!
As a manufacturer, we would like to share with you what we have learned about the different types of potting compounds and their characteristics.
The potting compounds on the market vary in viscosity, requirements for cure conditions, among other factors. Compounds such as polyurethane, silicone, and epoxy are widely used in a variety of applications.
Silicone Potting Compounds are soft and flexible, silicone potting compounds and encapsulating materials possess a good level of elongation.Silicone potting compound can also withstand a wide range of temperatures. Most silicone materials are able to operate at temperatures between -40°C and 200°C.
Epoxy potting compounds generally perform as a better adhesive, high-temperature resistance, and chemical resistance and have better adhesion to a wide variety of substrates and typically do not need primers.
Polyurethane Potting Compounds generally have better flexibility, elongation, and abrasion resistance.
Acrylic Potting Compounds are UV and heat-hardening materials, with fast hardening, adequate chemical resistance, and clear appearance.

Ep3225(32a)High temperature heating curing epoxy potting material Compound

∎Technical Data Table

Precautions

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