EP3109 High temperature resistant epoxy potting adhesive
EP 3109A/B is a two-component solventless, room temperature curing epoxy potting material, which is suitable for packaging and protection of products with high thermal conductivity requirements in automotive electronics, and has excellent adhesion and temperature resistance.
When reliability is non-negotiable and extreme temperatures are part of the equation,
EP 3109 High Temperature Resistant Epoxy Potting Adhesive stands as the ultimate solution for encapsulating and protecting critical electronic components. Engineered to deliver exceptional performance in harsh conditions, this versatile adhesive is trusted by engineers across industries where failure is not an option.
EP 3109 has the following properties after curing:
- Good toughness and high hardness
- Excellent adhesion and cracking resistance
- Excellent electrical insulation and stability
- High thermal conductivity, low coefficient of expansion
- High Tg point, can be used for a long time at -60℃-230℃
- Good water and moisture resistance, very low water absorption
EP 3109 is trusted in a wide range of critical applications where high temperature resistance and reliability are essential:
- Industrial Electronics: Encapsulating power supplies, transformers, and motor control units in manufacturing and processing equipment.
- Automotive: Protecting engine sensors, ignition modules, and electronic control units (ECUs) under the hood.
- Aerospace and Defense: Ensuring the reliability of avionics, satellite components, and military equipment in extreme environments.
- Renewable Energy: Encapsulating solar inverters, wind turbine converters, and energy storage systems.
Packing Specifications
EP 3109 A/B high temperature resistant epoxy glue
Order code: 2KEP6150/2KEP6151
- Component A: 4kg/ bucket (plastic bucket)
- Component B: 1kg/ bottle
EP 3109 High Temperature Resistant Epoxy Potting Adhesive is the ideal choice for engineers seeking a reliable, high-performance solution for encapsulating critical components in extreme environments. Its unmatched thermal stability, exceptional mechanical and electrical properties, and versatile curing options make it a trusted partner across industries where failure is not an option.
If you need to understand the step-by-step curing process for specific applications or customize the formulation to meet unique performance requirements, I can help you dive deeper into the technical details. Would you like me to provide more specific guidance?
EP3109 High temperature resistant epoxy potting adhesive
Test items
Test standard
EP 3109 A
EP 3109 B
Color
Visual
Light yellow transparent liquid
Colorless clear liquid
Viscosity 25℃, Pa·s
GB/T 2794-2022
13,000±2,000
20±3
Density 25℃, g/cm3
GB/T 13354-1992
1.15±0.05
0.93±0.05
Mixing Ratio A:B
Mass ratio
100:25
Mixing viscosity 25℃, Pa·s
GB/T 2794-2022
1500±500
Operating time 25℃, mins
GB/T 10247-2008
75±15
Gel time 25 ° C, hr
GB/T 10247-2008
6
Hardness Shore D
GB/T 531.1-2008
85±5
Thermal conductivity W/mK
GB/T 10297-1998
0.27
Coefficient of expansion μm/ (m, ° C)
GB/T 20673-2006
210
Glass transition temperature C
DSC
155
Water absorption rate (%)
GB/T 1034-2008
≤0.2
Shear strength Mpa, iron/iron
GB 7124-2008
≥8
Dielectric strength kV/mm (25 ° C)
GB/T 1693-2007
≥20
Loss factor (1MHz) (25 ° C)
GB/T 1693-2007
0.09
Dielectric constant (1MHz) (25 ° C)
GB/T 1693-2007
2.9
Volume resistance DC500V,Ω.cm
GB/T 1692-92
2.00E +15
