EP3115(#8) High Thermal Conductivity/High-Temperature Epoxies Potting Compound

EP 3115(8#) A/B is a two-component, solvent-free, room-temperature curing epoxy potting compound suitable for encapsulating and protecting products with high thermal conductivity requirements, such as motors, automotive electronics, power tools, reactors, and instruments. It also has excellent adhesion and insulation properties. High thermal conductivity, high-temperature epoxy potting compounds offer efficient heat dissipation and protection against extreme heat (>150∘𝐶), thermal shock, and chemicals, crucial for power electronics.

EP 3115(#8)A/B has the following characteristics:

Excellent adhesion and crack resistance
High thermal conductivity
Excellent electrical insulation and stability
Use in a temperature range of -50℃ to 200℃
Extremely low water absorption, providing good waterproof and moisture-proof properties
Excellent adhesion to metals (iron, aluminum, and copper)
Typical Applications
Automotive and Aerospace electronics.
Power Supplies and Transformers.
LED Assembly and Heat Sinks.
Motors and Sensors requiring high-temperature durability
High thermal conductivity/high-temperature epoxy potting compounds are essential in a wide range of industries where performance and reliability are critical:
🚗 Automotive and Transportation
Electric Vehicle (EV) Components: Encapsulating battery management systems (BMS), motor controllers, and power electronics in EVs and hybrid electric vehicles (HEVs), ensuring reliable operation under extreme temperatures.
Engine Control Units (ECUs): Protecting engine sensors, ignition modules, and fuel injection systems in traditional and hybrid vehicles, providing resistance to heat, vibration, and chemicals.
🔋 Renewable Energy
Solar Inverters: Encapsulating power electronics and semiconductor devices in solar inverters, ensuring efficient heat dissipation and protection against environmental factors.
Wind Turbine Components: Protecting pitch control systems, converter modules, and sensor assemblies in wind turbines, withstanding extreme temperatures, vibration, and moisture.
🛠️ Industrial Automation
Power Supplies and Drives: Encapsulating high-power components in industrial power supplies, variable frequency drives (VFDs), and servo drives, ensuring reliable performance in harsh factory environments.
Sensors and Instrumentation: Protecting sensors, transmitters, and control devices used in process industries, providing resistance to heat, chemicals, and mechanical stress.
🛰️ Aerospace and Defense
Avionics and Satellite Systems: Encapsulating electronic components in aircraft, satellites, and space vehicles, ensuring reliable operation in extreme temperatures and vacuum environments.
Military Electronics: Protecting communication systems, radar modules, and guidance systems in military applications, providing resistance to shock, vibration, and harsh environmental conditions.
💡 LED Lighting
High-Power LED Modules: Encapsulating LED chips and driver circuits in high-power LED lighting systems, ensuring efficient heat dissipation and protection against moisture and environmental factors.
Outdoor and Industrial Lighting: Protecting LED drivers and power supplies in outdoor and industrial lighting applications, providing resistance to temperature extremes, UV radiation, and moisture.
Packing and Storage
EP 3115(#8)
Component A: 10kg/ barrel;
Component B: 1.05kg/ barrel
High thermal conductivity/high-temperature epoxy potting compounds are indispensable for protecting critical electronic components in demanding applications. Their exceptional thermal management capabilities, wide temperature range, and superior mechanical and electrical properties ensure reliable performance and extended service life, even in the most extreme environments. By choosing the right compound for your application, you can enhance the performance, reliability, and durability of your products, reducing downtime and maintenance costs.
If you need help comparing specific product specifications or optimizing the selection process for your application, I can assist you in evaluating key factors and identifying the ideal high thermal conductivity/high-temperature epoxy potting compound. Would you like me to help with that?

EP3115(#8) High Thermal Conductivity/High-Temperature Epoxies Potting

$22.00

$660.00 per 30 Kilograms

Color: Clear Yellow

Quantity

Test items   Test standard   unit   A   B
Color   Visual   ---   Black    Colorless or pale yellow transparent liquid
Viscosity   GB/T 2794-2022   25℃，mPa·s   35,000±35,000   50±20
Density   GB/T 13354-1992   25℃，g/cm3   1.80±0.05   1.05±0.05
Mixing ratio   Mass ratio   Ratio=A:B   100:10.5
Mixing viscosity   GB/T 2794-2022   mPa·s ,25℃   15,000±5,000
       mPa·s ,60℃   2,000±500
Operating time   GB/T 10247-2008   A+B=150g, hr   ＞5h
Gel time   GB/T 10247-2008   25℃, hr   ＞7h
Hardness   GB/T 531.1-2008   Shore D，25℃   90±5
Glass transition temperature   DSC   ℃   140 (80℃1.5h+120℃2h)
Glass transition temperature   DSC   ℃   160 (80℃1.5h+150℃2h)
Thermal conductivity   GB/T 10297-1998   W/m.k   0.7
Shear strength   GB/T 7124-2008   Mpa   ≥13 Mpa, iron-iron
≥10 Mpa, copper-copper
Cure shrinkage rate   HG/T 2625-1994
   %   ≥1.2
Water absorption   GB/T 8810-2005   24h，25℃，%   0.1
Dielectric strength   GB/T 1693-2007   kV/mm（25℃）   ≥18
Dielectric loss   GB/T 1693-2007   （1MHz）(25℃)   ≤0.005
Dielectric constant   GB/T 1693-2007   （1MHz）(25℃)   ≤2.8
Volume resistance   GB/T 1692-2008   DC500V,Ω· cm   1.0E +15
Because the filler in component A will precipitate over time, before use, stir component A thoroughly in its original packaging. Then, weigh and mix components A and B at a weight ratio of 100:10.5, ensuring thorough mixing before potting.

Component B may crystallize or clump during storage (this is normal). If crystallization occurs, place it in an 80℃ oven to melt it before use, then cool to room temperature. This will not affect its performance.

Component B exposed to air will react with moisture and undergo hydrolysis, producing a white powdery substance. Avoid adding this white substance during weighing.

Many air bubbles will be trapped during mixing of components A and B. Vacuum degassing is necessary to improve the electrical performance of the device.

Component A has a higher viscosity and can be pre-dried at 40℃ before mixing with component B at a weight ratio of 100:10.5.

Preliminary curing conditions: 25℃ for 24 hours to achieve a Tg of 70℃. To achieve higher temperature resistance and greater toughness, cure at room temperature and then heat to 130°C for 1 hour; or design a curing process of 80°C * 2 hours + 130°C * 2 hours after potting.

Customers can adjust the curing temperature and time according to the actual size of the object to be potted; smaller sizes require shorter curing times.

For information on using potting equipment, please consult our marketing department.

When using equipment for potting, the A and B cylinders need to be heated separately to reduce viscosity. Lower viscosity after mixing improves penetration into the potted object.

Adding more or less curing agent component B than the normal ratio will reduce the product's hardness at high temperatures.

The greater the difference in the amount of curing agent component B added, the greater the change in the hardness of the colloid and the worse the temperature resistance.
Components A and B should be kept away from light and heat and sealed (can be transported and stored as non-dangerous goods); The storage period is one year.

B component exposed in the air will react with moisture to hydrolysis, and the hydrolysis product is a white powdery substance.

Try to avoid pouring white material when weighing.
As a manufacturer, we would like to share with you what we have learned about the different types of potting compounds and their characteristics.
The potting compounds on the market vary in viscosity, requirements for cure conditions, among other factors. Compounds such as polyurethane, silicone, and epoxy are widely used in a variety of applications.
Silicone Potting Compounds are soft and flexible, silicone potting compounds and encapsulating materials possess a good level of elongation.Silicone potting compound can also withstand a wide range of temperatures. Most silicone materials are able to operate at temperatures between -40°C and 200°C.
Epoxy potting compounds generally perform as a better adhesive, high-temperature resistance, and chemical resistance and have better adhesion to a wide variety of substrates and typically do not need primers.
Polyurethane Potting Compounds generally have better flexibility, elongation, and abrasion resistance.
Acrylic Potting Compounds are UV and heat-hardening materials, with fast hardening, adequate chemical resistance, and clear appearance.
High thermal conductivity/high-temperature epoxy potting compounds are essential in a wide range of industries where performance and reliability are critical:

🚗 Automotive and Transportation

Electric Vehicle (EV) Components: Encapsulating battery management systems (BMS), motor controllers, and power electronics in EVs and hybrid electric vehicles (HEVs), ensuring reliable operation under extreme temperatures.

Engine Control Units (ECUs): Protecting engine sensors, ignition modules, and fuel injection systems in traditional and hybrid vehicles, providing resistance to heat, vibration, and chemicals.

🔋 Renewable Energy

Solar Inverters: Encapsulating power electronics and semiconductor devices in solar inverters, ensuring efficient heat dissipation and protection against environmental factors.

Wind Turbine Components: Protecting pitch control systems, converter modules, and sensor assemblies in wind turbines, withstanding extreme temperatures, vibration, and moisture.

🛠️ Industrial Automation

Power Supplies and Drives: Encapsulating high-power components in industrial power supplies, variable frequency drives (VFDs), and servo drives, ensuring reliable performance in harsh factory environments.

Sensors and Instrumentation: Protecting sensors, transmitters, and control devices used in process industries, providing resistance to heat, chemicals, and mechanical stress.

🛰️ Aerospace and Defense

Avionics and Satellite Systems: Encapsulating electronic components in aircraft, satellites, and space vehicles, ensuring reliable operation in extreme temperatures and vacuum environments.

Military Electronics: Protecting communication systems, radar modules, and guidance systems in military applications, providing resistance to shock, vibration, and harsh environmental conditions.

💡 LED Lighting

High-Power LED Modules: Encapsulating LED chips and driver circuits in high-power LED lighting systems, ensuring efficient heat dissipation and protection against moisture and environmental factors.

Outdoor and Industrial Lighting: Protecting LED drivers and power supplies in outdoor and industrial lighting applications, providing resistance to temperature extremes, UV radiation, and moisture.

EP3115(#8) High Thermal Conductivity/High-Temperature Epoxies Potting

∎Technical Data Table

Precautions

Storage and Transportation

Order & Shipping

Different potting materials

Application