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Maxtech SI8230-3 Low-Stress Thermal Potting Compound Silicone Gel Encapsulant

Product Description

SI8230-3 Low Stress Encapsulant has a very low hardness and viscosity to minimize internal stress generation, fill small gaps, and improve manufacturing speed for complex and high volume electronic devices. Excellent flame resistance and protection against water ingress that improve the safety and reliability under harsh outdoor environments.

∎Key Features

  1. ●Soft, low durometer

  2. ●Low viscosity

  3. ●Room temperature or accelerated  heat cure

  4. ●Good thermal conductivity

  5. ●Mix ratio 1 to 1

  6. ●Low internal stress during thermal cycling

  7. ●Highly flowable for filling small gaps and fast processing

  8. ●Good heat dissipation

  9. ●Prevents water ingress

  10. ●Electrically insulative

  11. ●Low total cost of ownership

∎Typical Applications

Used for encapsulation of Power Conversion Devices (Inverters, Converters, Driver), Junction Boxes, Automotive Electronics Modules

Potting electrical circuits

Marine and automotive use

Making molds for low-melt metals like tin and pewter

Vibration and moisture protection

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∎Technical Data Table

PROPERTY       STANDARD/UNITS                     VALUE of SI8230-3

     ----                           ----                                PART A                            PART B

Material                        ----                               Polysiloxane                      Hydrogen polysiloxane

Color                     Visual inspection               Black viscous liquid       Off-White viscous liquid

Viscosity                25°C, cps                             3500±500                                     3500±500

Density                  25°C, g/cm3                          1.62±0.05                                    1.62±0.05

Mixture/mass ratio     ----                                               A:B=100:100

Viscosity of mixture   25°C, cps                                       3500±500

Operation time           25°C, min                                        40±10

Cure condition               ----                                         25℃/4 hr or  80℃/ 30mins

Cured appearance          ----                                            Drak Gray elastomer to Black

Hardness                      Shore00                                                40±10

Thermal conductivity,W/mK                                               0. 75

Linear expansion,K-1,ppm                                                300

Dielectric strength ,kV/mm, 25℃                                             ≥20

Volume resistance,DC 500V, Ω·CM                                      1.1×1014

Loss factor(1 MHz)                                                                     0.6

Dielectric constant(1 MHz)                                                       3.00

Application temperature    °C                                                  -60~260

Flame resistance                                                                       V-0


Note:All above data were tested under standardized conditions or tested by further experiments.

How to use ?
  1. Mixing uniformity in the packing before using, as there’s part of filler sedimentation happens during storage.

  2. Mix Part A and Part B by 1:1 mass ratio, after evenly mixed, pouring directly into the components or modules as per requirements. It’s recommended to slowly pour along the walls of the implements, so as to reduce the bubbles happens.

  3. Still the potted component to let out the bubbles. Can be cured by heat, about 30 minutes in 80°C. If cured under room temperature, about 8 hours.

  4. Vacuum defoaming can improve the performance of cured product.

  5. Seal the remaining products tightly after use.

  6. Low temperature will slow the curing speed, overheating will lead to curing speed too fast. Keep a constant temperature in the workshop is recommended.

  7. It's hard for SI8230-3 to cure if contact with sulfur, amine, organotin and unsaturated hydrocarbon plasticizer. Common substances like rosin, natural rubber. For these should do test before application.


Packing Specification

  1. ● SI8230-3, Drak Gray Silicone Potting Sealant

  2. Part A,25kg/Drum

  3. Part B,25kg/Drum

∎Transport &Storage

When stored at or below -5~30°C in the original unopened containers, this product has a usable life of 12 months from the date of production. Sampling test is necessary for products which exceed shelf life before taking use. Beyond this date, Maxtech Chemical no longer guarantees that the products meet sales specifications.


It’s non-dangerous goods, can be transported as normal chemicals, CAUTION leakage during transport.



High thermal conductivity potting compound is used to create a protective barrier around high-heat electrical appliances, components, and motors to prevent overheating. Thermal potting compounds are also used for potting electrical circuits and filling voids to protect fragile components from corrosive agents, water, moisture, vibration, shock, and chemicals.

High thermal conductivity potting compounds are used for a variety of high-temperature applications. Electronics potting and encapsulating compounds by Maxtech are formulated for consistent material performance, with excellent dielectric properties, electrical insulation resistance, thermal conductivity, thermal shock resistance, mechanical strength, adhesion, hardness, cure speed, and chemical resistance.

High thermal potting compounds for electrical equipment that may generate a lot of heat. For example, motors can overheat and cause damage to the rest of an electrical or mechanical device. Thermal potting compounds have a wide operating temperature range, which can prevent motors from overheating.

Electronic Sealant

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