Maxtech SI8230-3 Low-Stress Thermal Potting Compound Silicone Gel Encapsulant
∎Product Description
SI8230-3 Low Stress Encapsulant has a very low hardness and viscosity to minimize internal stress generation, fill small gaps, and improve manufacturing speed for complex and high volume electronic devices. Excellent flame resistance and protection against water ingress that improve the safety and reliability under harsh outdoor environments.
∎Key Features
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●Soft, low durometer
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●Low viscosity
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●Room temperature or accelerated heat cure
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●Good thermal conductivity
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●Mix ratio 1 to 1
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●Low internal stress during thermal cycling
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●Highly flowable for filling small gaps and fast processing
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●Good heat dissipation
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●Prevents water ingress
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●Electrically insulative
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●Low total cost of ownership
Electrical Potting and Encapsulating Compounds
Thermally Conductive Potting Compounds for Used for encapsulation of various modules, automotive module, LED Power driver modules, Solar panel junction box
Thermally Conductive Silicone Potting
Electrical Potting and Encapsulating Compounds
∎Typical Applications
●Used for encapsulation of Power Conversion Devices (Inverters, Converters, Driver), Junction Boxes, Automotive Electronics Modules
●Potting electrical circuits
●Marine and automotive use
●Making molds for low-melt metals like tin and pewter
●Vibration and moisture protection
∎Technical Data Table
PROPERTY STANDARD/UNITS VALUE of SI8230-3
---- ---- PART A PART B
Material ---- Polysiloxane Hydrogen polysiloxane
Color Visual inspection Black viscous liquid Off-White viscous liquid
Viscosity 25°C, cps 3500±500 3500±500
Density 25°C, g/cm3 1.62±0.05 1.62±0.05
Mixture/mass ratio ---- A:B=100:100
Viscosity of mixture 25°C, cps 3500±500
Operation time 25°C, min 40±10
Cure condition ---- 25℃/4 hr or 80℃/ 30mins
Cured appearance ---- Drak Gray elastomer to Black
Hardness Shore00 40±10
Thermal conductivity，W/mK 0. 75
Linear expansion，K-1，ppm 300
Dielectric strength ,kV/mm, 25℃ ≥20
Volume resistance,DC 500V， Ω·CM 1.1×1014
Loss factor(1 MHz) 0.6
Dielectric constant(1 MHz) 3.00
Application temperature °C -60~260
Flame resistance V-0
Note：All above data were tested under standardized conditions or tested by further experiments.
How to use ?
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Mixing uniformity in the packing before using, as there’s part of filler sedimentation happens during storage.
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Mix Part A and Part B by 1:1 mass ratio, after evenly mixed, pouring directly into the components or modules as per requirements. It’s recommended to slowly pour along the walls of the implements, so as to reduce the bubbles happens.
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Still the potted component to let out the bubbles. Can be cured by heat, about 30 minutes in 80°C. If cured under room temperature, about 8 hours.
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Vacuum defoaming can improve the performance of cured product.
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Seal the remaining products tightly after use.
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Low temperature will slow the curing speed, overheating will lead to curing speed too fast. Keep a constant temperature in the workshop is recommended.
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It's hard for SI8230-3 to cure if contact with sulfur, amine, organotin and unsaturated hydrocarbon plasticizer. Common substances like rosin, natural rubber. For these should do test before application.
∎Packing Specification
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● SI8230-3, Drak Gray Silicone Potting Sealant
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Part A，25kg/Drum
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Part B，25kg/Drum
∎Transport &Storage
● When stored at or below -5~30°C in the original unopened containers, this product has a usable life of 12 months from the date of production. Sampling test is necessary for products which exceed shelf life before taking use. Beyond this date, Maxtech Chemical no longer guarantees that the products meet sales specifications.
It’s non-dangerous goods, can be transported as normal chemicals, CAUTION leakage during transport.
∎Remark
● THERMAL POTTING COMPOUND
High thermal conductivity potting compound is used to create a protective barrier around high-heat electrical appliances, components, and motors to prevent overheating. Thermal potting compounds are also used for potting electrical circuits and filling voids to protect fragile components from corrosive agents, water, moisture, vibration, shock, and chemicals.
High thermal conductivity potting compounds are used for a variety of high-temperature applications. Electronics potting and encapsulating compounds by Maxtech are formulated for consistent material performance, with excellent dielectric properties, electrical insulation resistance, thermal conductivity, thermal shock resistance, mechanical strength, adhesion, hardness, cure speed, and chemical resistance.
High thermal potting compounds for electrical equipment that may generate a lot of heat. For example, motors can overheat and cause damage to the rest of an electrical or mechanical device. Thermal potting compounds have a wide operating temperature range, which can prevent motors from overheating.
