Maxtech SI8230-3 Low-Stress Thermal Potting Compound Silicone Gel Encapsulant
∎Product Description
SI8230-3 Low Stress Encapsulant has a very low hardness and viscosity to minimize internal stress generation, fill small gaps, and improve manufacturing speed for complex and high volume electronic devices. Excellent flame resistance and protection against water ingress that improve the safety and reliability under harsh outdoor environments.
∎Key Features
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●Soft, low durometer
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●Low viscosity
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●Room temperature or accelerated heat cure
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●Good thermal conductivity
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●Mix ratio 1 to 1
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●Low internal stress during thermal cycling
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●Highly flowable for filling small gaps and fast processing
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●Good heat dissipation
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●Prevents water ingress
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●Electrically insulative
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●Low total cost of ownership
Electrical Potting and Encapsulating Compounds
Thermally Conductive Potting Compounds for Used for encapsulation of various modules, automotive module, LED Power driver modules, Solar panel junction box
Thermally Conductive Silicone Potting
Electrical Potting and Encapsulating Compounds
∎Typical Applications
●Used for encapsulation of Power Conversion Devices (Inverters, Converters, Driver), Junction Boxes, Automotive Electronics Modules
●Potting electrical circuits
●Marine and automotive use
●Making molds for low-melt metals like tin and pewter
●Vibration and moisture protection
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∎Technical Data Table
PROPERTY STANDARD/UNITS VALUE of SI8230-3
---- ---- PART A PART B
Material ---- Polysiloxane Hydrogen polysiloxane
Color Visual inspection Black viscous liquid Off-White viscous liquid
Viscosity 25°C, cps 3500±500 3500±500
Density 25°C, g/cm3 1.62±0.05 1.62±0.05
Mixture/mass ratio ---- A:B=100:100
Viscosity of mixture 25°C, cps 3500±500
Operation time 25°C, min 40±10
Cure condition ---- 25℃/4 hr or 80℃/ 30mins
Cured appearance ---- Drak Gray elastomer to Black
Hardness Shore00 40±10
Thermal conductivity，W/mK 0. 75
Linear expansion，K-1，ppm 300
Dielectric strength ,kV/mm, 25℃ ≥20
Volume resistance,DC 500V， Ω·CM 1.1×1014
Loss factor(1 MHz) 0.6
Dielectric constant(1 MHz) 3.00
Application temperature °C -60~260
Flame resistance V-0
Note：All above data were tested under standardized conditions or tested by further experiments.
How to use ?
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Mixing uniformity in the packing before using, as there’s part of filler sedimentation happens during storage.
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Mix Par