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Maxtech SI8230-3 Low-Stress Thermal Potting Compound Silicone Gel Encapsulant

Product Description

SI8230-3 Low Stress Encapsulant has a very low hardness and viscosity to minimize internal stress generation, fill small gaps, and improve manufacturing speed for complex and high volume electronic devices. Excellent flame resistance and protection against water ingress that improve the safety and reliability under harsh outdoor environments.

∎Key Features

  1. ●Soft, low durometer

  2. ●Low viscosity

  3. ●Room temperature or accelerated  heat cure

  4. ●Good thermal conductivity

  5. ●Mix ratio 1 to 1

  6. ●Low internal stress during thermal cycling

  7. ●Highly flowable for filling small gaps and fast processing

  8. ●Good heat dissipation

  9. ●Prevents water ingress

  10. ●Electrically insulative

  11. ●Low total cost of ownership

∎Typical Applications

Used for encapsulation of Power Conversion Devices (Inverters, Converters, Driver), Junction Boxes, Automotive Electronics Modules

Potting electrical circuits

Marine and automotive use

Making molds for low-melt metals like tin and pewter

Vibration and moisture protection

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∎Technical Data Table

PROPERTY       STANDARD/UNITS                     VALUE of SI8230-3

     ----                           ----                                PART A                            PART B

Material                        ----                               Polysiloxane                      Hydrogen polysiloxane

Color                     Visual inspection               Black viscous liquid       Off-White viscous liquid

Viscosity                25°C, cps                             3500±500                                     3500±500

Density                  25°C, g/cm3                          1.62±0.05                                    1.62±0.05

Mixture/mass ratio     ----                                               A:B=100:100

Viscosity of mixture   25°C, cps                                       3500±500

Operation time           25°C, min                                        40±10

Cure condition               ----                                         25℃/4 hr or  80℃/ 30mins

Cured appearance          ----                                            Drak Gray elastomer to Black

Hardness                      Shore00                                                40±10

Thermal conductivity,W/mK                                               0. 75

Linear expansion,K-1,ppm                                                300

Dielectric strength ,kV/mm, 25℃                                             ≥20

Volume resistance,DC 500V, Ω·CM                                      1.1×1014

Loss factor(1 MHz)                                                                     0.6

Dielectric constant(1 MHz)                                                       3.00

Application temperature    °C                                                  -60~260

Flame resistance                                                                       V-0

 

Note:All above data were tested under standardized conditions or tested by further experiments.

How to use ?
  1. Mixing uniformity in the packing before using, as there’s part of filler sedimentation happens during storage.

  2. Mix Par