P 3102 A/B Epoxy Potting of electronic and electrical components
 
EP 3102 A/B is a two-component solventless room temperature curing epoxy potting-sealing material, which is suitable for the packaging and protection of the products with thermal conductivity requirements in motors, automotive electronics, power tools, reactors and meters, and most of the plastic and metal substrates have excellent adhesion and temperature resistance.
 
 
Application
Power module, high voltage DC contactor
Permanent magnet motor stator, high voltage power supply
Tank type reactor, high voltage capacitor
Power tools, instruments and other packaging protection
 
Operation Matters
 
Component A needs to be stirred evenly in the original package before use (precipitation may occur after a long time, and the performance will not be affected after the use of stirring evenly).
Affected by temperature, there are certain differences in the curing speed of glue in different seasons, and the curing time is longer in winter. All of the above glues can be heated to accelerate curing. You can also choose to use MAXTECH winter formula.
 
The A and B components of some products may crystallize and caking under low temperature conditions, which is a normal phenomenon; Before use, put it in the oven at 80℃ to melt it, and put it to room temperature for normal use, without affecting the properties of the glue.
During the mixing process, pay attention to the glue on the inner wall of the container and stir it back to ensure the uniformity of mixing.
Use the process
 
Gluing: Stir the glue component A fully in the original package, take the A and B components according to the specified mass ratio (see the table above), mix and stir well, and then potting and sealing. The operating time after mixing is shown in the table above. After the operating time is exceeded, the glue will become sticky and no longer suitable for pouring. Therefore, the amount of glue should not be too much each time to avoid waste.
Curing: curing conditions refer to the table above. The curing speed of glue is related to temperature, and the higher the temperature, the shorter the curing time. In winter, the temperature is low, the curing time will be extended, can be heated curing method, heating for 2 hours under the condition of 80℃. The glue can be assembled after curing and hardening. It is recommended to proceed to the next step after curing for 24 hours.
 
Packaging Specifications
1 EP 3102 Black 
Order code: A: 2KEP6000; B: 2KEP6006
Component A: 25kg/ barrel
Component B: 5kg/ pot
 

  We supply OEM & ODM service, You are welcome to test the samples!
As a manufacturer, we would like to share with you what we have learned about the different types of potting compounds and their characteristics.
The potting compounds on the market vary in viscosity, requirements for cure conditions, among other factors. Compounds such as polyurethane, silicone, and epoxy are widely used in a variety of applications.
Silicone Potting Compounds are soft and flexible, silicone potting compounds and encapsulating materials possess a good level of elongation.Silicone potting compound can also withstand a wide range of temperatures. Most silicone materials are able to operate at temperatures between -40°C and 200°C.
Epoxy potting compounds generally perform as a better adhesive, high-temperature resistance, and chemical resistance and have better adhesion to a wide variety of substrates and typically do not need primers.
Polyurethane Potting Compounds generally have better flexibility, elongation, and abrasion resistance.
Acrylic Potting Compounds are UV and heat-hardening materials, with fast hardening, adequate chemical resistance, and clear appearance.