EP 3115 High Thermal Conductivity epoxy potting compound
 
EP 3115A/B is a spatial structure potting resin for high and low temperature impact requirements, in accordance with 100: 15 Weight ratio weighing and mixing, through the potting equipment supporting automatic production line, through preheating, mixing, gluing, vacuuming and heating or room temperature curing, to form a good bonding of metals and common polar plastics, and can withstand the equivalent environmental high and low temperature impact test, as well as constant temperature and humidity after the verification of physical characteristics and chemical properties. The product meets the flame retardant rating requirements of UL 94 V-0 and has considerable thermal conductivity.
 
Excellent adhesion and cracking resistance
Low CTE linear expansion coefficient
Can be cured at room temperature or by heating
Excellent electrical insulation and stability
Good permeability after preheating
Suitable for space filling of various sizes
 
Application
Power module, high voltage DC contactor
Permanent magnet motor stator, high voltage power supply
Tank type reactor, high voltage capacitor
Power tools, instruments and other packaging protection
 
Operation processMixing: Because the filler contained in component A will precipitate with the time of placement, component A will be stirred evenly in the original package before use, and then component A and B will be weighed according to the weight ratio of 100:15, and can be potting after being mixed evenly.The amount of glue mixed according to the difference in the operation and use time of the mixing amount is different, for example, the mixing 1kg of glue must be used up within 15mins, and 500g of glue must be used up within 25mins to ensure that the filling of glue produces as few bubbles as possible and better filling performance of the filling device.If necessary, the potting device can continue to be vacuumed, which is conducive to increasing the electrical performance of the device.Curing conditions: 25℃*24 hours or 80℃*2 hours.If you need to use glue filling equipment, please consult our Marketing Department.Packaging and storageCode: A:2KEP6095, B:2KEP6096Components A and B should be protected from light, heat and sealed (can be transported and stored as non-dangerous goods); The storage period is one year.A Component :25kg/ plastic bucket; B Component: 3.75kg/ can.

  We supply OEM & ODM service, You are welcome to test the samples!
As a manufacturer, we would like to share with you what we have learned about the different types of potting compounds and their characteristics.
The potting compounds on the market vary in viscosity, requirements for cure conditions, among other factors. Compounds such as polyurethane, silicone, and epoxy are widely used in a variety of applications.
Silicone Potting Compounds are soft and flexible, silicone potting compounds and encapsulating materials possess a good level of elongation.Silicone potting compound can also withstand a wide range of temperatures. Most silicone materials are able to operate at temperatures between -40°C and 200°C.
Epoxy potting compounds generally perform as a better adhesive, high-temperature resistance, and chemical resistance and have better adhesion to a wide variety of substrates and typically do not need primers.
Polyurethane Potting Compounds generally have better flexibility, elongation, and abrasion resistance.
Acrylic Potting Compounds are UV and heat-hardening materials, with fast hardening, adequate chemical resistance, and clear appearance.