EP3115(#2) 1.5W/MK High Thermal Conductivity epoxy potting compound Glue Sealant
 
EP 3115(2#)A/B is a two-component solvent-free environmental curing epoxy potting-sealing material that can also be cured by temperature. It is suitable for the packaging and protection of motors, automotive electronics, power tools, reactors, meters and other products with high thermal conductivity requirements, and has excellent adhesion and temperature resistance.
Excellent adhesion, cracking resistance
Low CTE linear expansion coefficient
Has high thermal conductivity 1.5W/M.K. 
Excellent electrical insulation and stability
It is used in the temperature range of -50℃-200℃ 
Water absorption is very low, good water and moisture resistance
 
 
Application
Power module, high voltage DC contactor
Permanent magnet motor stator, high voltage power supply
Tank type reactor, high voltage capacitor
Power tools, instruments and other packaging protection
 
Operation process
 
Glue: Because the filler contained in component A will precipitate with the passage of time, before use, after stirring component A in the original package, weigh component A and component B according to the weight ratio of 100:5, and then potting can be performed after mixing evenly.
Component B is exposed to the air and hydrolyzed by reaction with water, and the hydrolyzed product is a white powdery substance. Try to avoid pouring white material when weighing.
If necessary, you can continue to vacuum the potting device, which is conducive to improving the electrical performance of the device.
Curing conditions :25°C*24 hours. For best performance, follow a curing process of 10°C*2 hours or 80°C*3 hours.
If you need to use glue filling equipment, please consult our Marketing Department.
Precautions
The amount of B component in the curing agent is greater than or less than the normal proportion will reduce the hardness of the product at high temperature.
The greater the difference in the amount of B component added to the curing agent, the greater the change in colloidal hardness and the worse the temperature resistance.
Packaging and Storage
Code: A:2KEP3080, B:2KEP3081
Components A and B should be protected from light, heat and sealed (can be transported and stored as non-dangerous goods); The storage period is one year.
A Component :10kg/ plastic bucket; B Component: 0.5kg/ can.

  We supply OEM & ODM service, You are welcome to test the samples!
As a manufacturer, we would like to share with you what we have learned about the different types of potting compounds and their characteristics.
The potting compounds on the market vary in viscosity, requirements for cure conditions, among other factors. Compounds such as polyurethane, silicone, and epoxy are widely used in a variety of applications.
Silicone Potting Compounds are soft and flexible, silicone potting compounds and encapsulating materials possess a good level of elongation.Silicone potting compound can also withstand a wide range of temperatures. Most silicone materials are able to operate at temperatures between -40°C and 200°C.
Epoxy potting compounds generally perform as a better adhesive, high-temperature resistance, and chemical resistance and have better adhesion to a wide variety of substrates and typically do not need primers.
Polyurethane Potting Compounds generally have better flexibility, elongation, and abrasion resistance.
Acrylic Potting Compounds are UV and heat-hardening materials, with fast hardening, adequate chemical resistance, and clear appearance.