Maxtech SI8230-1 Low stress Flame Retardant Silicone Potting Adhesive
∎Product Description
SI8230-1 low-stress encapsulant has a very low hardness and viscosity to minimize internal stress generation, fill small gaps, and improve manufacturing speed for complex and high volume electronic devices. Excellent flame resistance and protection against water ingress that improves the safety and reliability under harsh outdoor environments, It is a two-component silicone-based thermal conductive potting adhesive. It has a good fluidity after mixing, can vulcanize to a deep layer at room temperature. The operation time can be adjusted according to the temperature. Used to potting protection of varied heat dissipation and temperature resistance components. Fully compliant with RoHS and SVHC REACH standards.
∎Key Features
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Two-part 1:1 mixture addition type silicone adhesive
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Low hardening shrinkage
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Excellent electrical insulation in high temperature and stability
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Good waterproof and moisture resistance
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Excellent flame-resistance, UL No: E340199
Electrical Potting and Encapsulating Compounds
Thermally Conductive Potting Compounds for Used for encapsulation of various modules, automotive module, LED Power driver modules, Solar panel junction box
Thermally Conductive Silicone Potting
Electrical Potting and Encapsulating Compounds
∎Technical Data Table
PROPERTY STANDARD/UNITS VALUE of SI8230-1
---- ---- PART A PART B
Material ---- Polysiloxane Hydrogen polysiloxane
Color Visual inspection Black viscous liquid Off-White viscous liquid
Viscosity 25°C, cps 4500±500 4500±500
Density 25°C, g/cm3 1.5±0.05 1.5±0.05
Mixture/mass ratio ---- A:B=100:100
Viscosity of mixture 25°C, cps 4500±500
Operation time 25°C, min 15±5
Cure condition ---- 25℃/4 hr or 80℃/ 30mins
Cured appearance ---- Drak Gray elastomer
Hardness Shore00 35±5
Thermal conductivity，W/mK 0. 60
Linear expansion，K-1，ppm 300
Dielectric strength ,kV/mm, 25℃ ≥20
Volume resistance,DC 500V， Ω·CM 1.1×1014
Loss factor(1 MHz) 0.6
Dielectric constant(1 MHz) 3.00
Application temperature °C -60~260
Flame resistance V-0
Note：All above data were tested under standardized conditions or tested by further experiments.
How to use ?
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Mixing uniformity in the packing before using, as there’s part of filler sedimentation happens during storage.
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Mix Part A and Part B by 1:1 mass ratio, after evenly mixed, pouring directly into the components or modules as per requirements. It’s recommended to slowly pour along the walls of the implements, so as to reduce the bubbles happens.
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Still the potted component to let out the bubbles. Can be cured by heat, about 30 minutes in 80°C. If cured under room temperature, about 4 hours.
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Vacuum defoaming can improve the performance of the cured products.
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Seal the remaining products tightly after use.
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The low temperature will slow the curing speed, overheating will lead to curing speed too fast. Keep a constant temperature in the workshop is recommended.
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It's hard for SI8230 to cure if contact with sulfur, amine, organotin, and unsaturated hydrocarbon plasticizer. Common substances like rosin, natural rubber. For these should do a test before application.
∎Packing Specification
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● SI8230-1, Drak Gray Silicone Potting Sealant
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Part A，25kg/Drum
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Part B，25kg/Drum
∎Transport &Storage
● When stored at or below -5~30°C in the original unopened containers, this product has a usable life of 12 months from the date of production. Sampling test is necessary for products which exceed shelf life before taking use. Beyond this date, Maxtech Chemical no longer guarantees that the products meet sales specifications.
It’s non-dangerous goods, can be transported as normal chemicals, CAUTION leakage during transport.
