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Maxtech SI8230-1  Low stress Flame Retardant Silicone Potting Adhesive 

Product Description

SI8230-1 low-stress encapsulant has a very low hardness and viscosity to minimize internal stress generation, fill small gaps, and improve manufacturing speed for complex and high volume electronic devices. Excellent flame resistance and protection against water ingress that improves the safety and reliability under harsh outdoor environments, It is a two-component silicone-based thermal conductive potting adhesive. It has a good fluidity after mixing, can vulcanize to a deep layer at room temperature. The operation time can be adjusted according to the temperature. Used to potting protection of varied heat dissipation and temperature resistance components. Fully compliant with RoHS and SVHC REACH standards.

∎Key Features

  1. Two-part 1:1 mixture addition type silicone adhesive

  2. Low hardening shrinkage

  3. Excellent electrical insulation in high temperature and stability

  4. Good waterproof and moisture resistance 

  5. Excellent flame-resistance, UL No: E340199

∎Typical Applications

Used for encapsulation of various modules, automotive module, LED Power driver modules, Solar panel junction box, EV charging column module, Lithium battery pack, Capacitor banks, Magnetic induction coils, Power inverters, etc.

Thermally Conductive Silicone Potting
silicone elctronic potting compounds silicone
Potting Compounds and Encapsulants
Thermally Conductive Encapsulants & Potting Compounds
Two part Thermal conductive silicone potting material
Thermally Conductive Silicone Encapsulants
Thermally Conductive Potting Compounds
Two part Thermal conductive silicone potting material
Thermally Conductive Silicone Encapsulating
Thermally Conductive Adhesives
Thermally Conductive Silicones - Adhesive
Thermally Conductive Encapsulants & Potting Compounds
Thermally Conductive Potting Compounds
Thermally Conductive Silicone Encapsulants
Thermally Conductive Silicone Adhesives & Potting Compounds
Thermal Potting Compound
Thermally Conductive Cure-in-Place Potting
thermally conductive silicone encapsulant
thermally conductive silicone potting compound for electronics
Thermally Conductive Silicone - Electronic Devices & Potting
Grey Thermally Conductive Silicone Encapsulant
Silicone Thermally Conductive Encapsulants
Thermally Conductive Potting Compounds

∎Technical Data Table

PROPERTY       STANDARD/UNITS                     VALUE of SI8230-1

     ----                           ----                                PART A                            PART B

Material                        ----                               Polysiloxane                      Hydrogen polysiloxane

Color                     Visual inspection               Black viscous liquid       Off-White viscous liquid

Viscosity                25°C, cps                             4500±500                                     4500±500

Density                  25°C, g/cm3                          1.5±0.05                                    1.5±0.05

Mixture/mass ratio     ----                                               A:B=100:100

Viscosity of mixture   25°C, cps                                       4500±500

Operation time           25°C, min                                        15±5

Cure condition               ----                                         25℃/4 hr or  80℃/ 30mins

Cured appearance          ----                                            Drak Gray elastomer

Hardness                      Shore00                                                35±5

Thermal conductivity,W/mK                                               0. 60

Linear expansion,K-1,ppm                                                300

Dielectric strength ,kV/mm, 25℃                                             ≥20

Volume resistance,DC 500V, Ω·CM                                      1.1×1014

Loss factor(1 MHz)                                                                     0.6

Dielectric constant(1 MHz)                                                       3.00

Application temperature    °C                                                  -60~260

Flame resistance                                                                       V-0


Note:All above data were tested under standardized conditions or tested by further experiments.

How to use ?
  1. Mixing uniformity in the packing before using, as there’s part of filler sedimentation happens during storage.

  2. Mix Part A and Part B by 1:1 mass ratio, after evenly mixed, pouring directly into the components or modules as per requirements. It’s recommended to slowly pour along the walls of the implements, so as to reduce the bubbles happens.

  3. Still the potted component to let out the bubbles. Can be cured by heat, about 30 minutes in 80°C. If cured under room temperature, about 4 hours.

  1. Vacuum defoaming can improve the performance of the cured products.

  2. Seal the remaining products tightly after use.

  3. The low temperature will slow the curing speed, overheating will lead to curing speed too fast. Keep a constant temperature in the workshop is recommended.

  4. It's hard for SI8230 to cure if contact with sulfur, amine, organotin, and unsaturated hydrocarbon plasticizer. Common substances like rosin, natural rubber. For these should do a test before application.


Packing Specification

  1. ● SI8230-1, Drak Gray Silicone Potting Sealant

  2. Part A,25kg/Drum

  3. Part B,25kg/Drum

∎Transport &Storage

When stored at or below -5~30°C in the original unopened containers, this product has a usable life of 12 months from the date of production. Sampling test is necessary for products which exceed shelf life before taking use. Beyond this date, Maxtech Chemical no longer guarantees that the products meet sales specifications.


It’s non-dangerous goods, can be transported as normal chemicals, CAUTION leakage during transport.

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