Maxtech SI8230-1 Low stress Flame Retardant Silicone Potting Adhesive
∎Product Description
SI8230-1 low-stress encapsulant has a very low hardness and viscosity to minimize internal stress generation, fill small gaps, and improve manufacturing speed for complex and high volume electronic devices. Excellent flame resistance and protection against water ingress that improves the safety and reliability under harsh outdoor environments, It is a two-component silicone-based thermal conductive potting adhesive. It has a good fluidity after mixing, can vulcanize to a deep layer at room temperature. The operation time can be adjusted according to the temperature. Used to potting protection of varied heat dissipation and temperature resistance components. Fully compliant with RoHS and SVHC REACH standards.
∎Key Features
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Two-part 1:1 mixture addition type silicone adhesive
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Low hardening shrinkage
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Excellent electrical insulation in high temperature and stability
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Good waterproof and moisture resistance
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Excellent flame-resistance, UL No: E340199

Electrical Potting and Encapsulating Compounds

Thermally Conductive Potting Compounds for Used for encapsulation of various modules, automotive module, LED Power driver modules, Solar panel junction box

Thermally Conductive Silicone Potting

Electrical Potting and Encapsulating Compounds
∎Typical Applications
●Used for encapsulation of various modules, automotive module, LED Power driver modules, Solar panel junction box, EV charging column module, Lithium battery pack, Capacitor banks, Magnetic induction coils, Power inverters, etc.
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∎Technical Data Table
PROPERTY STANDARD/UNITS VALUE of SI8230-1
---- ---- PART A PART B
Material ---- Polysiloxane Hydrogen polysiloxane
Color Visual inspection Black viscous liquid Off-White viscous liquid
Viscosity 25°C, cps 4500±500 4500±500
Density 25°C, g/cm3 1.5±0.05 1.5±0.05
Mixture/mass ratio ---- A:B=100:100
Viscosity of mixture 25°C, cps 4500±500
Operation time 25°C, min 15±5
Cure condition ---- 25℃/4 hr or 80℃/ 30mins
Cured appearance ---- Drak Gray elastomer
Hardness Shore00 35±5
Thermal conductivity,W/mK 0. 60
Linear expansion,K-1,ppm 300
Dielectric strength ,kV/mm, 25℃ ≥20
Volume resistance,DC 500V, Ω·CM 1.1×1014
Loss factor(1 MHz) 0.6
Dielectric constant(1 MHz) 3.00
Application temperature °C -60~260
Flame resistance V-0
Note:All above data were tested under standardized conditions or tested by further experiments.