Ep3301 flexible epoxy potting compound Epoxy gel
We supply OEM & ODM service, You are welcome to test the samples!
Description
EP 3301 is a two-component solvent-free, room temperature curing epoxy potting adhesive used fortwo-component sealing, filling and other fields. The raw material does not contain heavy metals, greenenvironmental protection, wide process operability, high physical properties of the finished product, and good adhesion to the substrate. It can be cured at room temperature or by heating, and can be deeply cured, with less heat release and low shrinkage during curing. Excellent flexibility after curing. Excellent adhesion and cracking resistance Excellent electrical insulation and thermal stability Low water absorption, good water and moisture resistance
Product Packaging
EP 3301 two-component epoxy pottingOrder Code: Components A and B should be kept away fromlight and heat and sealed. The storage period is 12 months. After opening, the plastic drum should be sealedand stored in a cool and dry place. Component A: 16kg/ iron drum; ComponentB :16kg/ iron drum This product is not dangerous goods and can betransported and stored in accordance withnon-dangerous goodsOperation technology Mixing: The A and B components are weighed according to the weight ratio of 100:100, and can be potting after mixing evenly. The amount of glue mixed according to the difference in the operation and use time of themixing amount is different, for example, the mixing 1kg of glue must be used up within 15mins, and 500g of glue must be used up within 25mins to ensure that the filling of glue produces as few bubbles as possible and better filling performance of the filling device. If necessary, the potting device can continue to be vacuumed, which is conducive to increasingthe electrical performance of the device. Curing conditions: 25℃*24 hours or 80℃*2 hours
We supply OEM & ODM service, You are welcome to test the samples!
As a manufacturer, we would like to share with you what we have learned about the different types of potting compounds and their characteristics.
The potting compounds on the market vary in viscosity, requirements for cure conditions, among other factors. Compounds such as polyurethane, silicone, and epoxy are widely used in a variety of applications.
Silicone Potting Compounds are soft and flexible, silicone potting compounds and encapsulating materials possess a good level of elongation.Silicone potting compound can also withstand a wide range of temperatures. Most silicone materials are able to operate at temperatures between -40°C and 200°C.
Epoxy potting compounds generally perform as a better adhesive, high-temperature resistance, and chemical resistance and have better adhesion to a wide variety of substrates and typically do not need primers.
Polyurethane Potting Compounds generally have better flexibility, elongation, and abrasion resistance.
Acrylic Potting Compounds are UV and heat-hardening materials, with fast hardening, adequate chemical resistance, and clear appearance.
Ep3301 flexible epoxy potting compound Epoxy gel
Testitem Colour
Teststandard
Visual
Unit
---
A
Lightyellow
transparentliquid
B
Colorlesstoyellow
transparentliquid
Viscosity
GB/T2794-201325℃,mPa·s25,000±3,500
100±15
Density
GB/T13354-199225℃,g/cm31.05±0.05
1.05±0.05
MixingratioMassratioRatio=A:B100:100MixedviscosityGB/T2794-201325℃,100g,mPa·s750±100OperatingtimeGB/T10247-200825℃,min30-40GeltimeGB/T10247-200825℃,hr1.5hrHardnessGB/T531-2008ShoreA25℃,40±5ShearstrengthGB/T7124-2008Mpa,iron-iron≥1.5LossfactorGB/T1693-2007(1MHz)(25℃)0.08DielectricconstantGB/T1693-2007(1MHz)(25℃)3.6VolumeresistanceGB/T1692-92DC500V,Ω·cm1.0E+13Servicetemperature--℃-50-120