Maxtech SI8135W Two Component Silicone Potting Adhesive
∎Product Description
SI8135W A/B is suitable for potting protection of various components. It can be deep-cured, and the two components have good fluidity after mixing. The operating time can be adjusted according to the temperature of the curing agent. There is no need to use other primers before use, it has a good bonding effect to most materials, and is suitable for fixing accessories, waterproofing, dust proofing and preventing leakage.
∎Key Features
-
●Two-component liquid silicone rubber, condensation and dealcoholization type
-
●Low viscosity, easy processing, strong operability
-
●Low hardening shrinkage, no corrosion and stress
-
●Excellent high-temperature electrical insulation and stability
-
●Excellent adhesion
-
●Good waterproof and moisture resistance
Maxtech potting and encapsulation compounds for electronics components, free samples, silicone , epoxy and pu Encapsulation
Maxtech potting and encapsulation compounds for electronics components, free samples, silicone , epoxy and pu Encapsulation
Thermally Conductive Silicone Potting
Maxtech potting and encapsulation compounds for electronics components, free samples, silicone , epoxy and pu Encapsulation
 |
|---|
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
∎Technical Data Table
PROPERTY STANDARD/UNITS VALUE of SI8135W
---- ---- PART A PART B
Material ---- Polysiloxane Hydrogen polysiloxane
Color Visual inspection White liquid Colorless or light yellow transparent
Viscosity 25°C, cps 1100 ± 300 80 ± 20
Density 25°C, g/cm3 1.10 ± 0.05 0.98 ± 0.02
Mixture/mass ratio ---- A:B=100:18
The viscosity of mixture 25°C, cps 900
The density of mixture,g/cm3(25℃) 30
Operation time 25°C, min 60
Cured appearance ---- White soft elastomer
Hardness Shore00 14
Tensile strength, Mpa 0.8
Shear strength,MPa,Fe-Fe，MPa 0.5
Linear expansion coefficient，ppm 230
Dielectric strength ,kV/mm, 25℃ ≥22
Volume resistance,DC 500V， Ω·CM 1.0×1014
Loss factor(1 MHz) 0.008
Dielectric constant(1 MHz) 3.00
Application temperature °C -60~260
Note：All above data were tested under standardized conditions or tested by further experiments.
How to use ?
-
Mixing uniformity in the packing before using, as there’s part of filler sedimentation happens during storage.
-
Mix Part A and Part B by 100:18 mass ratio, after evenly mixed, pouring directly into the components or modules as per requirements. It’s recommended to slowly pour along the walls of the implements, so as to reduce the bubbles happens.
-
Still the potted component to let out the bubbles. If possible, customers can vacuum and degas the mixed glue before potting. It can be cured directly at room temperature, usually within 3-4hr, the glue layer is elastic and can be turned over or handled.
-
Vacuum defoaming can improve the performance of the cured products.
-
Seal the remaining products tightly after use.
-
The low temperature will slow the curing speed, overheating will lead to curing speed too fast. Keep a constant temperature in the workshop is recommended.
-
It's hard for SI8135W to cure if contact with sulfur, amine, organotin.
∎Packing Specification
-
Part A：20kg/drum；
-
Part B： 5kg/pot
-
Part A：200kg/drum；
-
Part B： 20kg/drum
-
Customized Packing
∎Transport &Storage
● When stored at or below -5~30°C in the original unopened containers, this product has a usable life of 12 months from the date of production. Sampling test is necessary for products which exceed shelf life before taking use. Beyond this date, Maxtech Chemical no longer guarantees that the products meet sales specifications.
It’s non-dangerous goods, can be transported as normal chemicals, CAUTION leakage during transport.
∎Remark
● THERMAL POTTING COMPOUND
High thermal conductivity potting compound is used to create a protective barrier around high-heat electrical appliances, components, and motors to prevent overheating. Thermal potting compounds are also used for potting electrical circuits and filling voids to protect fragile components from corrosive agents, water, moisture, vibration, shock, and chemicals.
High thermal conductivity potting compounds are used for a variety of high-temperature applications. Electronics potting and encapsulating compounds by Maxtech are formulated for consistent material performance, with excellent dielectric properties, electrical insulation resistance, thermal conductivity, thermal shock resistance, mechanical strength, adhesion, hardness, cure speed, and chemical resistance.
High thermal potting compounds for electrical equipment that may generate a lot of heat. For example, motors can overheat and cause damage to the rest of an electrical or mechanical device. Thermal potting compounds have a wide operating temperature range, which can prevent motors from overheating.
