Maxtech SI8230ZN  High Thermal Conductivity Flame Retardant Silicone Potting Adhesive

Product Description

SI8230ZN is two-component silicone-based thermal conductive potting adhesive. It has a good fluidity after mixing, can vulcanize to a deep layer at room temperature. The operation time can be adjusted according to the temperature. Used to potting protection of varied heat dissipation and temperature resistance components. Fully compliant with RoHS and SVHC REACH standards.

∎Key Features

  1. Two-part 1:1 mixture addition type silicone adhesive

  2. Low hardening shrinkage

  3. Excellent electrical insulation in high temperature and stability

  4. Good waterproof and moisture resistance 

  5. Excellent flame-resistance, UL No: E340199

Thermally Conductive Adhesives
Thermally Conductive Adhesives

We offer epoxy, polyurethane, and silicone potting compounds used in a variety of electronic packaging applications. Common applications include potting transformers, capacitors, coil windings, RFI filters, and PCB components. We offer several high temperature resistant potting compounds as well as several UL 94-V0 approved products for flame retardant capabilities.

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thermal potting compound
thermal potting compound

We offer epoxy, polyurethane, and silicone potting compounds used in a variety of electronic packaging applications. Common applications include potting transformers, capacitors, coil windings, RFI filters, and PCB components. We offer several high temperature resistant potting compounds as well as several UL 94-V0 approved products for flame retardant capabilities.

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Thermally Conductive Silicone Potting
Thermally Conductive Silicone Potting

Thermally Conductive Silicone Potting

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Thermally Conductive Adhesives
Thermally Conductive Adhesives

We offer epoxy, polyurethane, and silicone potting compounds used in a variety of electronic packaging applications. Common applications include potting transformers, capacitors, coil windings, RFI filters, and PCB components. We offer several high temperature resistant potting compounds as well as several UL 94-V0 approved products for flame retardant capabilities.

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∎Typical Applications

Used for encapsulation of various modules, automotive module, LED Power driver modules, Solar panel junction box, EV charging column module, Lithium battery pack, Capacitor banks, Magnetic induction coils, Power inverters, etc.

Thermally Conductive Silicone Potting
silicone elctronic potting compounds silicone
Thermally Conductive Encapsulants & Potting Compounds
Two part Thermal conductive silicone potting material
Thermally Conductive Potting Compounds
Thermally Conductive Silicone Encapsulants
Flexible potting compound
Thermally Conductive Silicone Encapsulating
Thermally Conductive Adhesives
Thermally Conductive Silicones - Adhesive
Thermally Conductive Encapsulants & Potting Compounds
Thermally Conductive Potting Compounds
Thermally Conductive Silicone Encapsulants
Thermally Conductive Silicone Adhesives & Potting Compounds
Thermal Potting Compound
Thermally Conductive Cure-in-Place Potting
thermally conductive silicone encapsulant
thermally conductive silicone potting compound for electronics
Grey Thermally Conductive Silicone Encapsulant
Silicone Thermally Conductive Encapsulants
Thermally Conductive Potting Compounds
Potting Compound
Thermally Conductive Silicone - Electronic Devices & Potting

∎Technical Data Table

PROPERTY       STANDARD/UNITS                     VALUE of SI8230ZN

     ----                           ----                                PART A                            PART B

Material                        ----                               Polysiloxane                      Hydrogen polysiloxane

Color                     Visual inspection                White / black viscous liquid      White viscous liquid

Viscosity                25°C, cps                             3500±1000                                    3500±1000

Density                  25°C, g/cm3                          1.52±0.03                                    1.52±0.03

Mixture/mass ratio     ----                                               A:B=100:100

Viscosity of mixture   25°C, cps                                       3500±1000

Operation time           25°C, min                                      40±10

Tack Free time            23°C, min                                       90±10

Cure condition               ----                                         25℃/8 hr or  70℃/ 50mins/80℃/ 30mins

Cured appearance          ----                                            Gray elastomer

Hardness                      Shore00                                                50±5

Thermal conductivity,W/mK                                               1.2

Linear expansion,K-1,ppm                                                170

Dielectric strength ,kV/mm, 25℃                                             ≥18

Volume resistance,DC 500V, Ω·CM                                      1.1×1014

Loss factor(1 MHz)                                                                     0.01

Dielectric constant(1 MHz)                                                       3.00

Application temperature    °C                                                  -60~260

Flame resistance                                                                       V-0

 

Note:All above data were tested under standardized conditions or tested by further experiments.

How to use ?
  1. Mixing uniformity in the packing before using, as there’s part of filler sedimentation happens during storage.

  2. Mix Part A and Part B by 1:1 mass ratio, after evenly mixed, pouring directly into the components or modules as per requirements. It’s recommended to slowly pour along the walls of the implements, so as to reduce the bubbles happens.

  3. Still the potted component to let out the bubbles. Can be cured by heat, about 30 minutes in 80°C. If cured under room temperature, about 8 hours.

  1. Vacuum defoaming can improve the performance of the cured products.

  2. Seal the remaining products tightly after use.

  3. The low temperature will slow the curing speed, overheating will lead to curing speed too fast. Keep a constant temperature in the workshop is recommended.

  4. It's hard for SI8230ZN to cure if contact with sulfur, amine, organotin, and unsaturated hydrocarbon plasticizer. Common substances like rosin, natural rubber. For these should do a test before application.

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Packing Specification

  1. ●SI8230ZN,Gray Silicone Potting Sealant

  2. Product code:

  3. Part A, 0104014,25kg/Drum

  4. Part B, 0105015,25kg/Drum

∎Transport &Storage

When stored at or below -5~30°C in the original unopened containers, this product has a usable life of 12 months from the date of production. Sampling test is necessary for products which exceed shelf life before taking use. Beyond this date, Maxtech Chemical no longer guarantees that the products meet sales specifications.

 

It’s non-dangerous goods, can be transported as normal chemicals, CAUTION leakage during transport.