Maxtech SI8230ZN High Thermal Conductivity Flame Retardant Silicone Potting Adhesive
∎Product Description
SI8230ZN is two-component silicone-based thermal conductive potting adhesive. It has a good fluidity after mixing, can vulcanize to a deep layer at room temperature. The operation time can be adjusted according to the temperature. Used to potting protection of varied heat dissipation and temperature resistance components. Fully compliant with RoHS and SVHC REACH standards.
∎Key Features
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Two-part 1:1 mixture addition type silicone adhesive
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Low hardening shrinkage
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Excellent electrical insulation in high temperature and stability
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Good waterproof and moisture resistance
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Excellent flame-resistance, UL No: E340199

We offer epoxy, polyurethane, and silicone potting compounds used in a variety of electronic packaging applications. Common applications include potting transformers, capacitors, coil windings, RFI filters, and PCB components. We offer several high temperature resistant potting compounds as well as several UL 94-V0 approved products for flame retardant capabilities.

We offer epoxy, polyurethane, and silicone potting compounds used in a variety of electronic packaging applications. Common applications include potting transformers, capacitors, coil windings, RFI filters, and PCB components. We offer several high temperature resistant potting compounds as well as several UL 94-V0 approved products for flame retardant capabilities.

Thermally Conductive Silicone Potting

We offer epoxy, polyurethane, and silicone potting compounds used in a variety of electronic packaging applications. Common applications include potting transformers, capacitors, coil windings, RFI filters, and PCB components. We offer several high temperature resistant potting compounds as well as several UL 94-V0 approved products for flame retardant capabilities.
∎Typical Applications
●Used for encapsulation of various modules, automotive module, LED Power driver modules, Solar panel junction box, EV charging column module, Lithium battery pack, Capacitor banks, Magnetic induction coils, Power inverters, etc.
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∎Technical Data Table
PROPERTY STANDARD/UNITS VALUE of SI8230ZN
---- ---- PART A PART B
Material ---- Polysiloxane Hydrogen polysiloxane
Color Visual inspection White / black viscous liquid White viscous liquid
Viscosity 25°C, cps 3500±1000 3500±1000
Density 25°C, g/cm3 1.52±0.03 1.52±0.03
Mixture/mass ratio ---- A:B=100:100
Viscosity of mixture 25°C, cps 3500±1000
Operation time 25°C, min 40±10
Tack Free time 23°C, min 90±10
Cure condition ---- 25℃/8 hr or 70℃/ 50mins/80℃/ 30mins
Cured appearance ---- Gray elastomer
Hardness Shore00 50±5
Thermal conductivity,W/mK 1.2
Linear expansion,K-1,ppm 170
Dielectric strength ,kV/mm, 25℃ ≥18
Volume resistance,DC 500V, Ω·CM 1.1×1014
Loss factor(1 MHz) 0.01
Dielectric constant(1 MHz) 3.00
Application temperature °C -60~260
Flame resistance V-0
Note:All above data were tested under standardized conditions or tested by further experiments.