Maxtech SI8135 Two Component Silicone Adhesives for Potting Electronics
∎Product Description
SI8135 A/B is suitable for potting protection of various components. It can be deep-cured, and the two components have good fluidity after mixing. The operating time can be adjusted according to the temperature of the curing agent. There is no need to use other primers before use, it has a good bonding effect to most materials, and is suitable for fixing accessories, waterproofing, dust proofing, and preventing leakage.
∎Key Features
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●Two-component liquid silicone rubber, condensation and dealcoholization type
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●Low viscosity, easy processing, strong operability
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●Low hardening shrinkage, no corrosion and stress
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●Excellent high-temperature electrical insulation and stability
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●Excellent adhesion
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●Good waterproof and moisture resistance
Maxtech potting and encapsulation compounds for electronics components, free samples, silicone , epoxy and pu
Maxtech potting and encapsulation compounds for electronics components, free samples, silicone , epoxy and pu
Thermally Conductive Silicone Potting
Maxtech potting and encapsulation compounds for electronics components, free samples, silicone , epoxy and pu
∎Typical Applications
●Automotive electronics, modules
●Various sensors
●Power control module
● solar junction box
●LED to shoot the light, wall wash lights, strip lights, LED fluorescent lamp
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∎Technical Data Table
TESTING ITEM TESTING STANDARD Part A Part A Part B(B1) Part B(B2)
Composition A+B A1+B1 A1+B2
Color Visual inspection black fluid Colorless fluid
Viscosity, cps , 25℃ GB/T 10247-2008 5000±1000 100
Density,g/cm3, 25℃ GB/T 15223-1994 1.35±0.05 0.98
Curing agent A with B B1 B2
Mixture ratio Weight Ratio A：B = 100：10
Viscosity of mixture,4#rotor,cps , 25℃ <