Maxtech SI8295 RTV / Heat Cured Flame retardant Silicone Potting Adhesive
∎Product Description
S8295A/B is a two-component addition cured silicone potting compound that can be cured at room temperature and heating. After curing, it will form an insulating soft and elastic rubber elastomer, which can protect circuit boards, electronic appliances or other potting Sealing and protecting objects, stable use in harsh environments, resistance to high temperature and moisture, and continuous protection of thermal conductivity and flame retardant insulation.
∎Key Features
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●Two-component addition type silicone rubber
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●Low curing shrinkage
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●Excellent high-temperature electrical insulation and stability
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●Good adhesion after heating and curing, the longer the heat curing, the better the adhesion
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●Good waterproof and moisture resistance
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● Good Flame retardant
We produce thermally conductive Silicone potting compound for electronics. widely used in LED, Sensor, Automotive, Motor, Solar, Household, Connector, Junction box.
We produce thermally conductive Silicone potting compound for electronics. widely used in LED, Sensor, Automotive, Motor, Solar, Household, Connector, Junction box.
Thermally Conductive Silicone Potting
We produce thermally conductive Silicone potting compound for electronics. widely used in LED, Sensor, Automotive, Motor, Solar, Household, Connector, Junction box.
∎Technical Data Table
PROPERTY STANDARD/UNITS VALUE of SI8295
---- ---- PART A PART B
Material ---- Polysiloxane Hydrogen polysiloxane
Color Visual inspection White viscous liquid Red viscous liquid
Viscosity 25°C, cps 7500 1000
Density 25°C, g/cm3 1.58 1.28
Mixture/mass ratio ---- A:B=100:10
Viscosity of mixture 25°C, cps 4000
Density of mixture,g/cm3(25℃) 1.45
Operation time 25°C, min 50-60
Tack Free time 25°C, min 100-150
Cure condition ---- 100℃/60mins
Cured appearance ---- Red elastomer
Hardness Shore00 45±5
Shear strength,MPa,Fe-Fe，MPa 1.5
Thermal conductivity，W/mK 0.45
Dielectric strength ,kV/mm, 25℃ ≥20
Volume resistance,DC 500V， Ω·CM 1.1×1015
Loss factor(1 MHz) 0.008
Dielectric constant(1 MHz) 3.00
Application temperature °C -60~260
Note：All above data were tested under standardized conditions or tested by further experiments.
How to use ?
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Mixing uniformity in the packing before using, as there’s part of filler sedimentation happens during storage.
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Mix Part A and Part B by 10:1 mass ratio, after evenly mixed, pouring directly into the components or modules as per requirements. It’s recommended to slowly pour along the walls of the implements, so as to reduce the bubbles happens.
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Still the potted component to let out the bubbles. Can be cured by heat, about 30 minutes in 120°C. If cured under room temperature, about 8 hours.
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The adhesive force cured at room temperature is weak; the adhesive force cured at 80°C is slightly better; in order to obtain a good bonding effect, it is recommended that the heating temperature should not be lower than 100°C, preferably above 120°C.
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Recommended curing conditions: 100℃ for 1 hour.
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Please test the bonding of the substrate before use.
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Vacuum defoaming can improve the performance of cured product.
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Seal the remaining products tightly after use.
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Low temperature will slow the curing speed, overheating will lead to curing speed too fast. Keep the constant temperature in workshop is recommended.
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It's hard for SI8295 to cure if contact with sulfur, amine, organotin and unsaturated hydrocarbon plasticizer. Common substances like rosin, natural rubber. For these should do test before application.
∎Packing Specification
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●Part A: 5kg/drum
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●Part B:0.5kg per bottle
∎Transport &Storage
● When stored at or below -5~30°C in the original unopened containers, this product has a usable life of 12 months from the date of production. Sampling test is necessary for products which exceed shelf life before taking use. Beyond this date, Maxtech Chemical no longer guarantees that the products meet sales specifications.
It’s non-dangerous goods, can be transported as normal chemicals, CAUTION leakage during transport.
∎Remark
● THERMAL POTTING COMPOUND
High thermal conductivity potting compound is used to create a protective barrier around high-heat electrical appliances, components, and motors to prevent overheating. Thermal potting compounds are also used for potting electrical circuits and filling voids to protect fragile components from corrosive agents, water, moisture, vibration, shock, and chemicals.
High thermal conductivity potting compounds are used for a variety of high-temperature applications. Electronics potting and encapsulating compounds by Maxtech are formulated for consistent material performance, with excellent dielectric properties, electrical insulation resistance, thermal conductivity, thermal shock resistance, mechanical strength, adhesion, hardness, cure speed, and chemical resistance.
High thermal potting compounds for electrical equipment that may generate a lot of heat. For example, motors can overheat and cause damage to the rest of an electrical or mechanical device. Thermal potting compounds have a wide operating temperature range, which can prevent motors from overheating.
