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Maxtech SI8300 RTV / Heat Cured Silicone Potting Adhesive 

Product Description

SI8300 is two-component white color silicone potting adhesive. The mixture has a good fluidity, can vulcanize to deep layer in room temperature. The operation time can be adjusted according to the temperature. Used to potting protection of varied components.

∎Key Features

  1. Two-part addition type silicone adhesive

  2. Low hardening shrinkage

  3. Excellent electrical insulation in high temperature and stability

  4. Excellent adhesion, cured the longer, the better adhesion

  5. Good waterproof and moisture resistance 

∎Typical Applications

Used for encapsulation of various modules, automotive module, LED Power driver modules, Solar

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∎Technical Data Table

PROPERTY       STANDARD/UNITS                     VALUE of SI8300

     ----                           ----                                PART A                            PART B

Material                        ----                               Polysiloxane                      Hydrogen polysiloxane

Color                     Visual inspection               White/Gray viscous liquid       Red/Transparent viscous liquid

Viscosity                25°C, cps                           9500                                          750

Density                  25°C, g/cm3                          1.55                                         0.98

Mixture/mass ratio     ----                                               A:B=100:10

Viscosity of mixture   25°C, cps                                      4300

Density of mixture,g/cm3(25℃)                                      1.40

Operation time           25°C, min                                        60

Cure condition               ----                                         25℃/6 hr or  80℃/ 30mins

Cured appearance          ----                                           Red/White elastomer

Hardness                      Shore00                                               55

Shear strength,MPa,Fe-Fe,MPa                                             1.4

Thermal conductivity,W/mK                                               0. 8