Maxtech SI8300R RTV / Heat Cured Red Silicone Potting Adhesive
∎Product Description
SI8300R is two-component red color silicone potting adhesive. The mixture has a good fluidity, can vulcanize to a deep layer in room temperature. The operation time can be adjusted according to the temperature. Used to potting protection of varied components.
∎Key Features
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Two-part addition type silicone adhesive
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Low hardening shrinkage
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Excellent electrical insulation in high temperature and stability
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Excellent adhesion, cured the longer, the better adhesion
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Good waterproof and moisture resistance
Maxtech Potting is Used for encapsulation of various modules, automotive module, LED Power driver modules, Solar.
Maxtech Potting is Used for encapsulation of various modules, automotive module, LED Power driver modules, Solar.
Thermally Conductive Silicone Potting
Maxtech Potting is Used for encapsulation of various modules, automotive module, LED Power driver modules, Solar.
∎Typical Applications
●●Used for encapsulation of various modules, automotive module, LED Power driver modules, Solar panel junction box, Magnetic induction coils, Ceramic
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∎Technical Data Table
PROPERTY STANDARD/UNITS VALUE of SI8300R
---- ---- PART A PART B
Material ---- Polysiloxane Hydrogen polysiloxane
Color Visual inspection White viscous liquid Red viscous liquid
Viscosity 25°C, cps 7500 1400
Density 25°C, g/cm3 1.58 1.28
Mixture/mass ratio ---- A:B=100:10
Viscosity of mixture 25°C, cps 5000
Density of mixture,g/cm3(25℃) 1.40
Operation time 25°C, min 30
Tack Free time 25°C, min 60
Cure condition ---- 25℃/6 hr or 80℃/ 30mins
Cured appearance ---- Red elastomer
Hardness Shore00 45
Shear strength,MPa,Fe-Fe，MPa 2.0
Thermal conductivity，W/mK 0. 8
Dielectric strength ,kV/mm, 25℃ ≥22
Volume resistance,DC 500V， Ω·CM 1.1×1015
Loss factor(1 MHz) 0.008
Dielectric constant(1 MHz) 3.00
Application temperature °C -60~260
Note：All above data were tested under standardized conditions or tested by further experiments.
How to use ?
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Mixing uniformity in the packing before using, as there’s part of filler sedimentation happens during storage.
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Mix Part A and Part B by 10:1 mass ratio, after evenly mixed, pouring directly into the components or modules as per requirements. It’s recommended to slowly pour along the walls of the implements, so as to reduce the bubbles happens.
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Still the potted component to let out the bubbles. Can be cured by heat, about 30 minutes in 80°C. If cured under room temperature, about 6 hours.
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Vacuum defoaming can improve the performance of cured product.
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Seal the remaining products tightly after use.
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Low temperature will slow the curing speed, overheating will lead to curing speed too fast. Keep the constant temperature in workshop is recommended.
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It's hard for SI8300 to cure if contact with sulfur, amine, organotin.
∎Packing Specification
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SI8300W,White A：10kg/drum , B： 1kg/drum
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SI8300G,Gray， A： 10kg/drum. B： 1kg/drum
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SI8300RRed， A： 5kg/drum ； B：0.5kg/drum
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Customized Packing
∎Transport &Storage
● When stored at or below -5~30°C in the original unopened containers, this product has a usable life of 12 months from the date of production. Sampling test is necessary for products which exceed shelf life before taking use. Beyond this date, Maxtech Chemical no longer guarantees that the products meet sales specifications.
It’s non-dangerous goods, can be transported as normal chemicals, CAUTION leakage during transport.
∎Remark
● THERMAL POTTING COMPOUND
High thermal conductivity potting compound is used to create a protective barrier around high-heat electrical appliances, components, and motors to prevent overheating. Thermal potting compounds are also used for potting electrical circuits and filling voids to protect fragile components from corrosive agents, water, moisture, vibration, shock, and chemicals.
High thermal conductivity potting compounds are used for a variety of high-temperature applications. Electronics potting and encapsulating compounds by Maxtech are formulated for consistent material performance, with excellent dielectric properties, electrical insulation resistance, thermal conductivity, thermal shock resistance, mechanical strength, adhesion, hardness, cure speed, and chemical resistance.
High thermal potting compounds for electrical equipment that may generate a lot of heat. For example, motors can overheat and cause damage to the rest of an electrical or mechanical device. Thermal potting compounds have a wide operating temperature range, which can prevent motors from overheating.
