Maxtech SI8300R RTV / Heat Cured Red Silicone Potting Adhesive 

Product Description

SI8300R is two-component red color silicone potting adhesive. The mixture has a good fluidity, can vulcanize to a deep layer in room temperature. The operation time can be adjusted according to the temperature. Used to potting protection of varied components.

∎Key Features

  1. Two-part addition type silicone adhesive

  2. Low hardening shrinkage

  3. Excellent electrical insulation in high temperature and stability

  4. Excellent adhesion, cured the longer, the better adhesion

  5. Good waterproof and moisture resistance 

electrical potting compound
electrical potting compound

Maxtech Potting is Used for encapsulation of various modules, automotive module, LED Power driver modules, Solar.

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silicone potting material
silicone potting material

Maxtech Potting is Used for encapsulation of various modules, automotive module, LED Power driver modules, Solar.

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Thermally Conductive Silicone Potting
Thermally Conductive Silicone Potting

Thermally Conductive Silicone Potting

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electrical potting compound
electrical potting compound

Maxtech Potting is Used for encapsulation of various modules, automotive module, LED Power driver modules, Solar.

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∎Typical Applications

●Used for encapsulation of various modules, automotive module, LED Power driver modules, Solar panel junction box, Magnetic induction coils, Ceramic

Red Silicone Potting Compound
red encapsulation potting resin
HEAT RESISTANT SEALANT SILICONE RED
Potting Compounds & Encapsulants
electronic potting silicone rubber
Thermally Conductive Silicone Potting
silicone elctronic potting compounds silicone
Potting Compounds and Encapsulants
Thermally Conductive Encapsulants & Potting Compounds
Two part Thermal conductive silicone potting material
Thermally Conductive Silicone Encapsulants
Thermally Conductive Potting Compounds
Two part Thermal conductive silicone potting material
Thermally Conductive Silicone Encapsulating
Thermally Conductive Adhesives
Thermally Conductive Silicones - Adhesive
Thermally Conductive Encapsulants & Potting Compounds
Thermally Conductive Potting Compounds
Thermally Conductive Silicone Encapsulants
Thermally Conductive Silicone Adhesives & Potting Compounds
Thermal Potting Compound
Thermally Conductive Cure-in-Place Potting
thermally conductive silicone encapsulant
thermally conductive silicone potting compound for electronics
Thermally Conductive Silicone - Electronic Devices & Potting
Grey Thermally Conductive Silicone Encapsulant
Silicone Thermally Conductive Encapsulants
Thermally Conductive Potting Compounds
white pouring sealant
Potting compound manufacturers
silicone rubber universal sealant white potting
Potting Silicone
White Silicone Sealant Paste for Potting
white potting materials
Silicone sealant white
Potting Compounds & Encapsulants
potting & encapsulating compound
electronic components potting silicone sealant
White Silicone Potting Compound ...
WHITE POTTING FOR LED of silicone & epoxy
Potting and Encapsulation Applications
Potting Compound for Electronics
Silicone Red Potting Compound Seal
red color potting sealant
Encapsulating / Potting Silicone Adhesives
red encapsulation potting resin_wps图片11.
CIRCUIT BOARD PROTECTION sealanthisco-rtvs-3-95-2-image
Casting & Potting Materials

∎Technical Data Table

PROPERTY       STANDARD/UNITS                     VALUE of SI8300R

     ----                           ----                                PART A                            PART B

Material                        ----                               Polysiloxane                      Hydrogen polysiloxane

Color                     Visual inspection               White viscous liquid       Red viscous liquid

Viscosity                25°C, cps                           7500                                         1400

Density                  25°C, g/cm3                          1.58                                        1.28

Mixture/mass ratio     ----                                               A:B=100:10

Viscosity of mixture   25°C, cps                                      5000

Density of mixture,g/cm3(25℃)                                      1.40

Operation time           25°C, min                                        30

Tack Free time           25°C, min                                        60

Cure condition               ----                                         25℃/6 hr or  80℃/ 30mins

Cured appearance          ----                                           Red elastomer

Hardness                      Shore00                                               45

Shear strength,MPa,Fe-Fe,MPa                                             2.0

Thermal conductivity,W/mK                                               0. 8

Dielectric strength ,kV/mm, 25℃                                             ≥22

Volume resistance,DC 500V, Ω·CM                                      1.1×1015

Loss factor(1 MHz)                                                                     0.008

Dielectric constant(1 MHz)                                                       3.00

Application temperature    °C                                                  -60~260

 

Note:All above data were tested under standardized conditions or tested by further experiments.

How to use ?
  1. Mixing uniformity in the packing before using, as there’s part of filler sedimentation happens during storage.

  2. Mix Part A and Part B by 10:1 mass ratio, after evenly mixed, pouring directly into the components or modules as per requirements. It’s recommended to slowly pour along the walls of the implements, so as to reduce the bubbles happens.

  3. Still the potted component to let out the bubbles. Can be cured by heat, about 30 minutes in 80°C. If cured under room temperature, about 6 hours.

  4. Vacuum defoaming can improve the performance of cured product.

  5. Seal the remaining products tightly after use.

  6. Low temperature will slow the curing speed, overheating will lead to curing speed too fast. Keep the constant temperature in workshop is recommended.

  7. It's hard for SI8300 to cure if contact with sulfur, amine, organotin.

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Packing Specification

  1. SI8300W,White   A:10kg/drum ,   B: 1kg/drum

  2. SI8300G,Gray,  A: 10kg/drum.  B: 1kg/drum

  3. SI8300RRed,  A: 5kg/drum ; B:0.5kg/drum

  4. Customized Packing

∎Transport &Storage

When stored at or below -5~30°C in the original unopened containers, this product has a usable life of 12 months from the date of production. Sampling test is necessary for products which exceed shelf life before taking use. Beyond this date, Maxtech Chemical no longer guarantees that the products meet sales specifications.

 

It’s non-dangerous goods, can be transported as normal chemicals, CAUTION leakage during transport.

∎Remark

THERMAL POTTING COMPOUND

High thermal conductivity potting compound is used to create a protective barrier around high-heat electrical appliances, components, and motors to prevent overheating. Thermal potting compounds are also used for potting electrical circuits and filling voids to protect fragile components from corrosive agents, water, moisture, vibration, shock, and chemicals.

High thermal conductivity potting compounds are used for a variety of high-temperature applications. Electronics potting and encapsulating compounds by Maxtech are formulated for consistent material performance, with excellent dielectric properties, electrical insulation resistance, thermal conductivity, thermal shock resistance, mechanical strength, adhesion, hardness, cure speed, and chemical resistance.

High thermal potting compounds for electrical equipment that may generate a lot of heat. For example, motors can overheat and cause damage to the rest of an electrical or mechanical device. Thermal potting compounds have a wide operating temperature range, which can prevent motors from overheating.