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Maxtech SI8715 Two Component Dielectric Insulation Liquid Silicone Gel

Product Description

SI8715 is two-component transparent self-healing silicone gel, after cured it will become quite elastic material with buffer and self-recovery. Used to isolate moisture and another noxious pollutant from contacting the circuit board, also used as a dielectric of high voltage. The other usage is a stress relief for protecting circuits and components from high temperatures and mechanical stress.

∎Key Features

  1. 1:1 addition type, good adhesive strength and self-healing 

  2. High elongation, excellent flexibility for mechanical stress relieving

  3. Low oil penetration after cured, good anti-poisoning property

  4. Good dielectric in high temperature for high voltage protection 

  5. Excellent aging resistance and weatherability 

  6. Excellent waterproof, corrosion prevention, moisture-proof and chemical media resistance

∎Typical Applications

Used for encapsulation of various modules, semi-conductor, IGBT, automotive ECU module, IC chip, weighing sensor, waterproof connector.

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∎Technical Data Table

PROPERTY       STANDARD/UNITS                     VALUE of SI8715

     ----                           ----                                PART A                   PART B

Material                        ----                               Polysiloxane             Hydrogen polysiloxane

Color                     Visual inspection                 Colorless Liquid        Colorless Liquid

Viscosity                25°C, cps                                 800                                 700

Density                  25°C, g/cm3                             0.99                                0.99

Mixture/mass ratio     ----                                               A:B=100:100

Viscosity of mixture   25°C, cps                                           750

Operation time           25°C, min                                           60

Fixture Time              25°C, hour                                           5

Cure condition               ----                                          25°C/24hour, 80°C/30min

Cured appearance          ----                                               Transparent gel

Needle penetration      1/10 mm                                             75

Dielectric strength        KV/mm                                             25

Volume resistance        DC500V, ohm-cm                            1.0×1015

Loss factor                    1 MHz                                              <0.001

Dielectric constant        1 MHz                                                  2.8

Application temperature    °C                                                  -60~260


Note:All above data were tested under standardized condition, or tested by further experiments.

How to use ?
  1. Mix Part A and Part B by 1:1 mass ratio, after evenly mixed, pouring directly into the components or modules as per requirements.

  2. Still the potted component to let out the bubbles. It can be heat cured, about 30mins in 80°C. It needs about 4-5hours cured under room temperature. Require 24 hours to achieve surface without obvious oil layer.

  1. Vacuum defoaming can improve the performance of cured product.

  2. Seal the remaining products tightly after use.

  3. Low temperature will slow the curing speed; heat curing is recommended.

  4. It's hard for SI8715 to cure if contact with sulfur, amine or Sn


Packing Specification

  1. ●Part A—10 KG/Bucket

  2. ●Part B—10 KG/ Bucket

∎Transport &Storage

● When stored at or below 25°C in the original unopened containers, this product has a usable life of 12 months from the date of production. A sampling test is necessary for products that exceed shelf life before taking use.

It’s non-dangerous goods, can be transported as normal chemicals, CAUTION leakage during transport.

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