Waterproof 1:1 Two-Component High Thermal Conductivity Silicone Potting Compound For Circuit Board Connector Potting Factory
∎Product Description
SI8230 is a two-component silicone based thermal conductive potting adhesive. It has a good fluidity after mixing, can vulcanize to a deep layer in room temperature. The operation time can be adjusted according to the temperature. Used to potting protection of varied heat dissipation and temperature resistance components. Fully compliant with RoHS and SVHC REACH standards.
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∎Typical Applications
●Used for encapsulation of various modules, automotive module, LED Power driver modules, Solar panel junction box, EV charging column module, Lithium battery pack, Capacitor banks, Magnetic induction coils, Power inverters, etc.
∎Key Features
- Two-part 1:1 mixture addition type silicone adhesive
- Low hardening shrinkage
- Excellent electrical insulation in high temperature and stability
- Good waterproof and moisture resistance
- Excellent flame-resistance, UL No: E340199
∎Packing Specification
●SI8230W white thermal conductivity silicone potting sealant
●SI8230B black thermal conductivity silicone potting sealant
●SI8230G gray thermal conductivity silicone potting sealant
- Part A:20 kg/plastic drum
Part B:20 kg/plastic drum
- Part A:250 kg/plastic drum
Plat B:250 kg/plastic drum
∎Transport &Storage
● When stored at or below 35°C in the original unopened containers, this product has a usable life of 12 months from the date of production. Sampling test is necessary for products which exceed shelf life before taking use. During storage may have little settlement stratification, stirring evenly when use, does not affect performance.
It’s non-dangerous goods, can be transported as normal chemicals, CAUTION leakage during transport.
.∎Directions for Use
- Mixing uniformity in the packing before using, as there’s part of filler sedimentation happens during storage. - Mix Part A and Part B by 1:1 mass ratio, after evenly mixed, pouring directly into the components or modules as per requirements. It’s recommended to slowly pour along the walls of the implements, so as to reduce the bubbles happens. - Still the potted component to let out the bubbles. Can be cured by heat, about 30 minutes in 80°C. If cured under room temperature, about 4 hours. 
- Vacuum defoaming can improve the performance of cured product.
- Seal the remaining products tightly after use.
- Low temperature will slow the curing speed, overheating will lead to curing speed too fast. Keep the constant temperature in workshop is recommended.
- It's hard for SI8230 to cure if contact with sulfur, amine, organotin and unsaturated hydrocarbon plasticizer. Common substances like rosin, natural rubber. For these should do test before application.
For the orders, normally we do shipping by sea. delivery time is 15-25days.
For the samples, we will ship by air through Fedex, UPS or DHL, delivery time is 2-3days.
Any inquiry, please contact us directly by email or whatsapp +18321208486.
Please don't place the order direcetly , we need to evaluate the shipping way and freight, thanks a lot.
Waterproof 1:1 Two-Component High Thermal Conductivity Silicone Potting Compound
- TESTING ITEM - ESTING STANDARD - Part A - Part B - Color - Visual inspection - White / black viscous liquid - White viscous liquid - Viscosity, cps , 25℃ - GB/T 10247-2008 - 2500±500 - 2300±500 - Density,,g/cm3, 25℃ - GB/T 15223-1994 - 1.52±0.03 - 1.52±0.03 - Mixture ratio - Weight Ratio - A:B = 100:100 - Viscosity of mixture,4#rotor,cps , 25℃ - GB/T 10247-2008 - 2500±500 - Operation time,mins , 25℃ - GB/T 10247-2008 - 50±10 - Tack free, mins, 25℃ - GB/T 10247-2008 - 90±20 - Cure condition - GB/T 10247-2008 - 25℃/3-5 hr or 80℃/ 30mins - Characteristics after curing - Cured appearance - Visual inspection - Gray, white or black elastomer - Hardness, Shore A - GB/T 531-2008 - 55±5 - Thermal conductivity,W/mK - GB/T 10297-1998 - 0. 65±0.03 - Linear expansion,K-1,ppm - HGT 2625-1994 - 230 - Dielectric strength ,kV/mm, 25℃ - GB/T 1695-2005 - ≥15 - Volume resistance,DC 500V, Ω·CM - GB/T 1692-92 - 1.1×1015 - Loss factor(1 MHz) - GB/T 1693-2007 - 0.009 - Dielectric constant(1 MHz) - GB/T 1693-2007 - 3.00 - Application temperature, ℃ - GBT 20028-2005 - - 60 ∽ 200 - Flame resistance - UL-94 - V-0 
- For the orders, normally we do shipping by sea. - For the samples, we will ship by air through Fedex, UPS or DHL. - Any inquiry, please contact us directly by email or whatsapp, please don't place the order, we need to evaluate the shipping way and freight, thanks a lot. 
