PU 8110(15#) Thermal conductive potting compound

Product features and applications

PU 8110(15#) A/B is a two-component solvent-free polyurethane potting-sealing adhesive with high thermal conductivity at room temperature or heat curing. It is used for two-component sealing and filling. The raw material does not contain heavy metals, green environmental protection, wide process operability, high physical properties of the finished product, and good adhesion to the substrate. The two components have good fluidity after mixing, which is applied to the pouring and posing of communication equipment, transformers, control power supplies, ignition controllers, electronic sensors, etc.

High thermal conductivity, low viscosity, strong operability

Excellent low temperature characteristics, excellent weather resistance

Excellent electrical insulation and stability

Good waterproof, moisture resistance, water absorption is very low

Good adhesion to most metals and plastics

Thermal conductivity ≥1.55W/m.k

Introducing our PU 8110(15#) Thermal conductive potting compound, the perfect solution for all of your potting sealant needs. This high-quality compound boasts a high thermal conductivity of ≥1.55W/m.k, making it an excellent choice for applications requiring effective heat dissipation. With its low viscosity and strong operability, it is easy to work with and provides excellent adhesion to most metals and plastics. In addition to its thermal properties, this potting compound also offers excellent low temperature characteristics and weather resistance, ensuring optimal performance in a variety of environmental conditions. Its electrical insulation and stability are second to none, making it a reliable choice for electronic components and devices. Furthermore, its good waterproof and moisture resistance, combined with very low water absorption, make it an ideal choice for outdoor or harsh environments. Trust in the quality of our PU 8110(15#) Thermal conductive potting compound for all of your potting sealant needs. Its exceptional performance and versatility make it the perfect choice for a wide range of applications.

PU 8110(15#) Thermal conductive potting compound

$0.00

$0.00 per 30 Kilograms

Color: Black

Quantity

Test items   Units and Conditions   Test standard   8110(15#)
Appearance   A   Visual   Visual   Black viscous liquid
   B       Visual   Brown viscous liquid
Viscosity   A   25℃ mPa·s   GB/T 2794-2022   30,000-55,000
       30℃ mPa·s   GB/T 2794-2022   10,000-25,000
       50℃ mPa·s   GB/T 2794-2022   3,000-6,000
   B   25℃ mPa·s   GB/T 2794-2022   20-50
   A+B   25℃ mPa·s   GB/T 2794-2022   3,500±500
       30℃ mPa·s   GB/T 2794-2022   2,000±500
       50℃ mPa·s   GB/T 2794-2022   1,000±500
Density   A   25℃ g/cm3   GB/T 13354-1992   2.22±0.05
   B       GB/T 13354-1992   1.23±0.05
   A+B       GB/T 13354-1992   2.1±0.05
Operation time   25℃ min 116g
Up to100,000mPa·s   GB/T 2794-2022   25-30 min
Mixed Ratio   Weight ratio   ----   A ：B=100：10
Curing conditions   25℃ min
70℃ hour   ----   72hrs
2hour
Post-cure characteristics
Colour   Units or conditions   Test standard   8110(15#)
Hardness   Shore D   GB/T 531.1-2008   80±5
Water absorption   24hrs, 25℃，%   GB 8810-2005   <0.2
Tensile strength   MPa   GB/T 528-2009   >20
Elongation   %   GB/T 528-2009   50
Shear strength   MPa, Fe-Fe   GB/T 7124-2008   ＞2.3
Shear strength   MPa, Al-Al   GB/T 7124-2008   >2.1
Thermal conductivity   W/m.K   GB/T 10297-2015   1.55±0.5
Glass transition temperature Tg   ℃   ISO11359 : 2002   -5
Volume Resistance   25℃，Ω·cm   GB/T 1692-2008   5.0*1014
Dielectric strength   25℃，kV/mm   GB/T 1695-2005   ＞20
Dielectric constant   50Hz，25℃   GB/T 1693-2007   6.0
Dielectric loss   50Hz，25℃   GB/T 1693-2007   0.012
Linear contraction   %   HGT 2625-1994   1.0
Linear thermal expansion   μm/（m，℃）   GB/T 1036-2008   <Tg, 55
>Tg, 120
Temperature of application   ℃   GBT 20028-2005   -50～130
Flame retardant   UL   UL94   V-0
* Note: The above performance data is the typical test data of the product at 70% humidity and 25℃ temperature, for cu
Material extraction: Material A of this product contains functional filling powder, and there will be clear liquid on the upper layer of glue. Before use, it is necessary to stir the original packaging glue evenly, and then take material for use. After the material is taken out, the original packaging should be sealed in time to prevent excessive contact with water. After the adhesive material is exposed to air for a long time, it may lead to bubbling phenomenon after mixing AB material. If possible, the raw packaging of A material can be placed in a constant temperature environment of 25℃.

Operation matters: Material B exposed to the atmosphere will absorb water and hydrolysis occurs, the phenomenon is turbidized until caked, material A also needs to be stored away from the tide, so as not to generate too many bubbles during curing. The environment of the curing process needs to control the humidity as low as possible, and the relative humidity should not exceed 60%.

Preheating: Please bake the poured device at 70~80℃ for 1~2 hours. It can also reduce the temperature and extend the heating time to remove the moisture of the device. At low temperature, the viscosity of MDPU 8110(8608) will become high, and the material can be preheated to 25 ° C ~45 ° C, which is easy to use.

Defoaming: Vacuum the A\B barrel respectively, and stir at the same time to ensure that the A\B rubber liquid is vacuum-free before mixing.

Pouring: the mixture is poured into the device through the static mixer, and the gel time is about 3hrs.

Curing: It takes 4d to fully cure at 25 ° C. The ambient humidity should be controlled at <70%, and the curing time should be extended when the temperature is low.
Unused raw materials should be stored in a well-sealed bucket to avoid moisture intrusion and affect the quality of raw materials. The opened materials should be kept sealed and used up as soon as possible.

It is recommended to store in a cool area, away from direct sunlight;

Storage temperature: 10-30℃, A material storage period of 12 months; Material B is 6 months.
As a manufacturer, we would like to share with you what we have learned about the different types of potting compounds and their characteristics.
The potting compounds on the market vary in viscosity, requirements for cure conditions, among other factors. Compounds such as polyurethane, silicone, and epoxy are widely used in a variety of applications.
Silicone Potting Compounds are soft and flexible, silicone potting compounds and encapsulating materials possess a good level of elongation.Silicone potting compound can also withstand a wide range of temperatures. Most silicone materials are able to operate at temperatures between -40°C and 200°C.
Epoxy potting compounds generally perform as a better adhesive, high-temperature resistance, and chemical resistance and have better adhesion to a wide variety of substrates and typically do not need primers.
Polyurethane Potting Compounds generally have better flexibility, elongation, and abrasion resistance.
Acrylic Potting Compounds are UV and heat-hardening materials, with fast hardening, adequate chemical resistance, and clear appearance.
8110(15#) A/B Polyurethane potting compound,

Part A: Packing 36 kg/ barrel,

Part B: Packing 3.6 kg/ pot

Other packaging to be made to order

This glue is not dangerous and can be transported as a general chemical

PU 8110(15#) Thermal conductive potting compound

∎Technical Data Table

Precautions

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Different potting materials

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