EP 3090 High Performance Electronic Epoxy structure adhesive
EP 3090 epoxy adhesive is a two-component room temperature curing epoxy resin. Designed for bonding ceramic, metal, glass, plastic, rubber, paper, cloth and other materials.
A and B components are thoroughly mixed 1:1 (weight ratio or volume ratio) after use, the product has a 40 min operation time, after curing to form a transparent hard protective layer, and there is a black version.
The cured adhesive has the following characteristics:
- Resistance to moisture, dirt, and other atmospheric components
- High strength, excellent adhesion
- Good pollution resistance, low surface pretreatment requirements
- No solvent, no curing byproducts
- Stable mechanical and electrical properties between -50 and 120℃
- It has good adhesion to plastic PC, glass fiber cloth and steel plate
At Maxtech, the EP 3090 High Performance Electronic Epoxy structure adhesive delivers exceptional bonding strength and durability for demanding maintenance applications. Designed to withstand harsh environments, this epoxy ensures reliable electronic component protection and structural integrity. As a leading supplier of PU Adhesive Sealant, Silicone Sealant, MS polymer sealant, Waterproofing coating, Waterproofing tape, and lubricating grease, Maxtech provides solutions that meet the highest industry standards. Trust EP 3090 for a high-performance adhesive that supports your critical repairs with lasting results. Maxtech’s commitment to quality and service guarantees optimal performance for your maintenance needs.
EP 3090 High Performance Electronic Epoxy structure adhesive
Epoxy Structure Adhesive
Test items Test standard Unit Black Clear
A Appearance Visual --- Black slurry Colorless or light yellow transparent liquid
Viscosity GB/T 2794-1995 mPa·s(25℃) 13,000±2,500 13,000±2,000
Density GB/T 13354-1992 g/cm3(25℃) 1.15±0.05 1.10±0.05
B Appearance Visual --- Colorless transparent Colorless transparent
Viscosity GB/T 2794-1995 mPa·s(25℃) 15,000±5,000 15,000±5,000
Density GB/T 13354-1992 g/cm3(25℃) 1.06±0.05 1.06±0.05
Property before cured
Item - Unit or condition EP 3090 black EP 3090 crear
Mixing ratio - Weight ratio 100:100 100:100
Mixing ratio - Volume ratio 100:100 100:100
Mixing density - g/cm3(25℃) 1.15±0.05 1.15±0.05
Tack frees time - min(25℃) 37±8 13±5
Initial curing time - 25℃/mins 120 120
Property after cured
Item - Unit or condition EP 3090 black EP 3090 crear
Hardness GB/T531-2008 Shore D 85±5 85±5
Shear strength GB/T 7124-2008 Mpa,Al/Al 13 13
Shear strength GB/T 7124-2008 Mpa,Fe/ Fe ≥10 ≥6
Shear strength GB/T 7124-2008 Mpa,Fe/ Fe,
After grinding 20 20
Coefficient expansion GB/T20673-2006 μm/(m,℃) 100 100
Water absorption GB/T8810-2005 24h,25℃,% <0.3 <0.3
Dielectric strength GB/T1693-2007 kV/m(25℃) >20 >20
Loss factor GB/T1693-2007 (1MHz)(25℃) 0.014 0.014
Dielectric constant GB/T1693-2007 (1MHz)(25℃) 3.53 3.53
Volume resistance GB/T1692-92 (DC500V)Ω· cm 1.2×1015 1.2×1015

