Ep6105 Two Component Thermally Conductive Epoxy Adhesive
Ep6105 is two-component solvent-free room temperature curing epoxy potting adhesive with excellent adhesion and heat resistance.
∎Typical Applications
●For potting protection of high-power electronic components, modules and circuits boards which require high thermal conductivity.
∎Key Features
- Good toughness, high hardness
- Excellent adhesion, anti-cracking property
- Excellent electrical insulating properties, and stability
- Good waterproof, moisture resistance, very low water absorption
- Good temperature resistance, with 0.9 W/mK thermal conductivity
∎Packing Specification
- Part A：25 kg/ drum
Part B：5 kg/ Pot
Other size required should be quoted.
∎Transport &Storage
● When stored at or below25°C in the original unopened containers, this product has a usable life of 12 months from the date of production. Sampling test is necessary for products which exceed shelf life before taking use. During storage may have little settlement stratification, stirring evenly when use, does not affect performance.
It’s non-dangerous goods, can be transported as normal chemicals, CAUTION leakage during transport.
∎Directions for Use
Stirring A component evenly before taking use.
Mix A, B two components with 5:1 mass ratio, stir well and do vacuum defoaming before potting to components.
If necessary, continue to vacuum defoaming for components which been potted, help to increase the electrical performance of the device.
Curing conditions: Preliminary curing time is 8 hours at room temperature, completely cured need 24 hours; also can be heat curing, in 80°C for 2~3 hours.
The above tests are measured under 120g mixture of adhesive.
We supply OEM & ODM service, You are welcome to test the samples!
As a manufacturer, we would like to share with you what we have learned about the different types of potting compounds and their characteristics.
The potting compounds on the market vary in viscosity, requirements for cure conditions, among other factors. Compounds such as polyurethane, silicone, and epoxy are widely used in a variety of applications.
Silicone Potting Compounds are soft and flexible, silicone potting compounds and encapsulating materials possess a good level of elongation.Silicone potting compound can also withstand a wide range of temperatures. Most silicone materials are able to operate at temperatures between -40°C and 200°C.
Epoxy potting compounds generally perform as a better adhesive, high-temperature resistance, and chemical resistance and have better adhesion to a wide variety of substrates and typically do not need primers.
Polyurethane Potting Compounds generally have better flexibility, elongation, and abrasion resistance.
Acrylic Potting Compounds are UV and heat-hardening materials, with fast hardening, adequate chemical resistance, and clear appearance.
Ep6105 Two Component Thermally Conductive Epoxy Adhesive
PROPERTY
STANDARD/UNITS
VALUE of Ep6105
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PART A
PART B
Appearance
Visual inspection
Black ropy fluid
Brown liquid
Viscosity
25°C, cps
12,000~18,000
500~800
Density
25°C, g/cm3
1.85±0.05
1.15±0.05
Mixture ratio
Mass ratio
A:B=100:20
Viscosity of mixture
25°C, cps
3,000
Mixture density
25°C, g/cm3
1.55±0.05
Operation time
25°C, min
60
Preliminary Cured
25°C, hours
6~8
Cure condition
RTV/HEAT
25°C/ 24 hour; 80°C/ 2~3 hour
Curing shrinkage rate
%
＜2
Hardness
Shore D
＞85
Water absorption
25°C, 24hrs, %
＜0.3
Thermal conductivity
W/mK
0.9
Dielectric strength
kV/mm, 25°C
≥30
Flame resistance
UL 94
V-2
Volume resistance
DC500V, ohm-cm
1.5×1015
Application temperature
°C
-40~120
