Ep6102Flame Retardant Epoxy Potting Compound

Ep6102 is two-component solvent-free type room temperature curing epoxy potting adhesive.

Ep6102 is For general electronic components potting and circuit board closure. Room temperature can be cured, curing process exothermic temperature is low, low shrinkage.

∎Typical Applications

●For protection sealing of power capacitors, filters, sensors, automotive electronics and opto electronic LED.

∎Key Features

Good toughness, high hardness
Excellent adhesion, anti-cracking property
Excellent electrical insulating properties, and stability
Good waterproof, moisture resistance, very low water absorption
Good temperature resistance, resistance temperature of 150°C in 1-hour short time

∎Packing Specification

Part A：25 kg/ drum

Part B：5 kg/ drum

Other size required should be quoted.

∎Directions for Use1. Mix the glue: the glue component in the original packaging after the full mixing (no filler can not stir), the A and B components according to the provisions of the quality ratio of mixing (see the table above the mixing ratio), stir even after potting, The time available after mixing is shown in the table above. More than the available time, glue viscosity will be high, no longer suitable for perfusion. So each time with the amount of plastic should not be too much, otherwise it will cause a waste.2. Curing: Cure conditions See table above. Curing speed and temperature-related, high temperature fast curing, winter temperature is low, curing time will be extended, a variety of plastic can be used curing curing method, at 80 ℃ under the conditions of curing 2 to 3 hours. After the hardening of the glue can be assembled, the test generally need to cure 24 to 48 hours after the mixing

We supply OEM & ODM service, You are welcome to test the samples!

As a manufacturer, we would like to share with you what we have learned about the different types of potting compounds and their characteristics.
The potting compounds on the market vary in viscosity, requirements for cure conditions, among other factors. Compounds such as polyurethane, silicone, and epoxy are widely used in a variety of applications.
Silicone Potting Compounds are soft and flexible, silicone potting compounds and encapsulating materials possess a good level of elongation.Silicone potting compound can also withstand a wide range of temperatures. Most silicone materials are able to operate at temperatures between -40°C and 200°C.
Epoxy potting compounds generally perform as a better adhesive, high-temperature resistance, and chemical resistance and have better adhesion to a wide variety of substrates and typically do not need primers.
Polyurethane Potting Compounds generally have better flexibility, elongation, and abrasion resistance.
Acrylic Potting Compounds are UV and heat-hardening materials, with fast hardening, adequate chemical resistance, and clear appearance.

Ep6102Flame Retardant Epoxy Potting Compound

$3.50

$105.00 per 30 Kilograms

Color: Black

Quantity

PROPERTY   STANDARD/UNITS   Ep6102 Black   Ep6102 White
----   ----   PART A   PART B   PART A   PART B
Appearance   Visual inspection   Black thick liquid   Brown liquid   White thick liquid   Colorless liquid
Viscosity   25°C, cps   20000 ～30000   100~200   20000 ～30000   100~200
Density   25°C, g/cm3   1.85±0.05   1.05±0.05   1.85±0.05   1.05±0.05
Mixture ratio   Mass ratio   A:B=100:20
Viscosity of mixture   25°C, cps   1000~1500
Mixture density   25°C, g/cm3   1.65±0.10
Operation time   25°C, min   60
Preliminary Cured   25°C, hours   4~6
Cure condition   RTV/HEAT   25°C/ 24 hour; 80°C/ 2~3 hour
Curing shrinkage rate   %   ＜2
Hardness   Shore D   ＞85
Water absorption   25°C, 24hrs, %   ＜0.3
Thermal conductivity   W/mK   0.35
Dielectric strength   kV/mm, 25°C   ≥30
Dielectric constant   1.2MHz, 25°C   3.1±0.1
Volume resistance   DC500V, ohm-cm   2.8×1015
Shear strength   Fe-Fe, MPa   ＞10
Application temperature   °C   -40~120
Mixing: Because the filler contained in component A will precipitate with the time of placement, it is necessary to mix component A in the original package before use, and then weigh component A and component B according to the weight ratio of 100:8, and then potting can be done after mixing evenly.

Component B in the storage process may appear crystallization or agglomeration (belongs to the normal situation), if the crystallization needs to be placed in the 80℃ oven to melt it before use, and then cold to room temperature after use, this will not affect its performance.

Exposed in the air, component B will react with moisture to produce hydrolysis, and the hydrolysis product is a white powdery substance. Try to avoid pouring white material when weighing.

If necessary, the potting device can continue to be vacuumed, which is conducive to increasing the electrical performance of the device.

Curing condition: 25℃*24 hours. For better performance, please follow the curing process of 100℃*2 hours or 80℃*3 hours.

If you need to use glue filling equipment, please consult our Marketing Department.
l This product should be stored in A cool and    dry environment below 25℃ , and the storage period of A/B below 25℃ is 1 year.

l The products that exceed the storage period should be tested to confirm whether there is  any abnormality before use.

l Such products are classified as     non-dangerous goods and can be

transported as general chemicals. Be careful of leaks during transportation!
As a manufacturer, we would like to share with you what we have learned about the different types of potting compounds and their characteristics.
The potting compounds on the market vary in viscosity, requirements for cure conditions, among other factors. Compounds such as polyurethane, silicone, and epoxy are widely used in a variety of applications.
Silicone Potting Compounds are soft and flexible, silicone potting compounds and encapsulating materials possess a good level of elongation.Silicone potting compound can also withstand a wide range of temperatures. Most silicone materials are able to operate at temperatures between -40°C and 200°C.
Epoxy potting compounds generally perform as a better adhesive, high-temperature resistance, and chemical resistance and have better adhesion to a wide variety of substrates and typically do not need primers.
Polyurethane Potting Compounds generally have better flexibility, elongation, and abrasion resistance.
Acrylic Potting Compounds are UV and heat-hardening materials, with fast hardening, adequate chemical resistance, and clear appearance.

Ep6102Flame Retardant Epoxy Potting Compound

∎Technical Data Table

Precautions

Storage and Transportation

Order & Shipping

Different potting materials