Ep3108 Clear epoxy potting AdhesiveSealant

EP3108 series Clear epoxy potting adhesive is a room temperature/heat curing epoxy resin adhesive. This two-component epoxy adhesive is designed for potting, protecting electronic products that require high strength or confidentiality.

The EP3108 series of epoxy potting adhesives cure without heat. After thoroughly mixing component A and component B by weight ratio, the product cures within a certain time to form protection.

The cured glue has the following properties:

This product is a transparent color epoxy potting material

Resistant to moisture, dirt and other atmospheric components

High strength, excellent adhesion, cracking resistance, toughness

With secret acting, no solvent, no curing byproducts

Stable mechanical and electrical properties at -45-90℃

Typical Applications

Suitable for hard light strip, display module, photoelectric sensor, smart water meter and other photoelectric display devices and products

Typical properties

Items	Testing Criteria	Units	3108
Colors	Eye tests	--	Colorless and transparent
Hardness	GB/T 531.1-2008	ShoreD	75±5
Shear strength	GB/T 7124-2008	Mpa, Fe-Fe	≥7
Thermal conductivity	GB/T 10297-1998	W/mK	0.27
Coefficient of expansion	GB/T 20673-2006	μm/ (m, ° C)	65
Water absorption	GB/T 8810-2005	24h, 25 ° C, %	<0.1
Dielectric strength	GB/T 1693-2007	kV/mm (25 ° C)	>20
Loss factor	GB/T 1693-2007	(1MHz) (25 ° C)	0.014
Dielectric constant	GB/T 1693-2007	(1MHz) (25 ° C)	3.53
Volume resistance	GB/T 1692-92	(DC500V) Ω· cm	1.2×1015

Note: All the above data were determined after 7 days of adhesive curing at 25℃, 55%RH.

Purchase code and packaging

EP 3108 transparent epoxy Potting adhesive, order code: A: 2KEP6110; B: 2KEP6111

Component A: 10kg/ pot
Component B: 5kg/ pot

We supply OEM & ODM service, You are welcome to test the samples!

As a manufacturer, we would like to share with you what we have learned about the different types of potting compounds and their characteristics.
The potting compounds on the market vary in viscosity, requirements for cure conditions, among other factors. Compounds such as polyurethane, silicone, and epoxy are widely used in a variety of applications.
Silicone Potting Compounds are soft and flexible, silicone potting compounds and encapsulating materials possess a good level of elongation.Silicone potting compound can also withstand a wide range of temperatures. Most silicone materials are able to operate at temperatures between -40°C and 200°C.
Epoxy potting compounds generally perform as a better adhesive, high-temperature resistance, and chemical resistance and have better adhesion to a wide variety of substrates and typically do not need primers.
Polyurethane Potting Compounds generally have better flexibility, elongation, and abrasion resistance.
Acrylic Potting Compounds are UV and heat-hardening materials, with fast hardening, adequate chemical resistance, and clear appearance.

Ep3108 Clear epoxy potting AdhesiveSealant

$0.00

$0.00 per 30 Kilograms

Color: Black

Quantity

General performance

Testing Items	Units	EP 3108
A	B
Appearance	---	Colorless or light yellow clear liquid	Colorless and clear Liquid
Viscosity	mPa·s, 25℃	440±50	100±20
Density	G/cm3, 25 ℃	1.12±0.05	1.02±0.05

Operation process

Item	Units or conditions	MDEP 3108
Mix ratio	Weight ratio	100：50
Mixing viscosity	mPa·s,25℃	200-300
Mix density	g/cm3,25℃	1.08
Operating time (1)	Hr,25℃	1
Curing time	℃/hr	80/1 or 25/24

Precautions for operation

Stir well before use. A and B should be sealed and stored after use.

When mixing, pay attention to stirring in the same direction, otherwise too many bubbles will be mixed; The container frame and the bottom of the glue should also be stirred evenly, otherwise there will be uneven mixing caused by local non-curing phenomenon.

Pouring onto the product and vacuuming again to remove bubbles can improve the comprehensive performance of the cured product.

Too low temperature will lead to slow curing speed, it is recommended to heat curing; Potting thickness of more than 2cm can not be cured directly at 100℃, so as not to cause detonation.

This glue curing process is exothermic reaction, the amount of glue will affect the length of the operation time, so the operation time under the amount of glue 100g is only a reference time.
l This product should be stored in A cool and    dry environment below 25℃ , and the storage period of A/B below 25℃ is 1 year.

l The products that exceed the storage period should be tested to confirm whether there is  any abnormality before use.

l Such products are classified as     non-dangerous goods and can be

transported as general chemicals. Be careful of leaks during transportation!
As a manufacturer, we would like to share with you what we have learned about the different types of potting compounds and their characteristics.
The potting compounds on the market vary in viscosity, requirements for cure conditions, among other factors. Compounds such as polyurethane, silicone, and epoxy are widely used in a variety of applications.
Silicone Potting Compounds are soft and flexible, silicone potting compounds and encapsulating materials possess a good level of elongation.Silicone potting compound can also withstand a wide range of temperatures. Most silicone materials are able to operate at temperatures between -40°C and 200°C.
Epoxy potting compounds generally perform as a better adhesive, high-temperature resistance, and chemical resistance and have better adhesion to a wide variety of substrates and typically do not need primers.
Polyurethane Potting Compounds generally have better flexibility, elongation, and abrasion resistance.
Acrylic Potting Compounds are UV and heat-hardening materials, with fast hardening, adequate chemical resistance, and clear appearance.

Ep3108 Clear epoxy potting AdhesiveSealant

∎Technical Data Table

Precautions

Storage and Transportation

Order & Shipping

Different potting materials