EP3005 Fast cured Epoxy structural adhesive

Test items    Test standard    Unit    EP3005    EP 3005(11#)

A    
Appearance    
Visual    
---    Colorless  or  light  yellow transparent     liquid,     or black paste    Colorless   or   light   yellow transparent liquid
    Viscosity    GB/T 2794-2022    cps（25℃)    13,000±2,000    13,000±2,000
    Density    GB/T 13354-1992    g/ml（25℃)    1.15±0.05    1.15±0.05
    Appearance    Visual    
---    Colorless  or  light  yellow transparent liquid    Colorless   or   light   yellow transparent liquid
B    Viscosity    GB/T 2794-2022    cps（25℃)    15,000±5,000    13,000±2,000
    Density    GB/T 13354-1992    g/ml（25℃)    1.02±0.05    1.02±0.05
Before cured

Items    Units or conditions    EP3005    EP3005(11#)
Mix ratio    Weight ratio    100:100    100:100
Mix ratio    Volume ratio    100:100    100:100
Blend viscosity    cps（25℃)    13,000±2,000    13,000±2,000
Mixed density    g/ml（25℃)    1.10    1.10
Operating time (1)    min（25℃)    2-3    3-5
Table dry time (1)    min（25℃)    5±2    9±3
Initial curing time    25℃/min    10    15

(1) The operating time is tested by the amount of glue dispensed 2g. Take out the ratio of A and B components in proportion, stir and mix evenly, quickly apply to the part that needs bonding, and cure quickly in a short time.

After cured

Items    Test standard    Unit    EP 3005    EP3005(11#)
Appearance    Visual        Clear/Black    Clear
Hardness    GB/T 531.1-2008    Shore D    80±5    80±5
Shear strength    GB/T 7124-2008    Mpa ，Al/Al    ≥10    ≥10
Shear strength    GB/T 7124-2008    Mpa , Fe/ Fe    ≥10    ≥10
Shear strength    GB/T 7124-2008    Mpa, Fe/ Fe,
After grinding    18    18
Coefficient of expansion    GB/T 1036-2008    μm/（ m ， ℃)    100    105
Water absorption    GB/T 8810-2005    24h ，25℃ , %    <0.3    <0.3
Dielectric strength    GB/T 1692-2008    kV/m（25℃)    >20    >20
Loss factor    GB/T 1693-2007    (1MHz）(25℃)    0.014    0.014
Dielectric constant    GB/T 1693-2007    (1MHz）(25℃)    3.0    3.0
Volume resistance    GB/T 1692-2008    (DC500V）Ω · cm    1.2 × 1015    1.2 × 1015

50ml and double-barrel support, the use of 1:1 mixing glue gun construction, the glue of the first extrusion of the mixing tube is discharged, in order to prevent the uneven initial mixing resulting in poor bonding effect. Double barrel packaging should pay attention to the sealing of the material port, and replace the mixing hose in time.
l Manual  use of bulk  packaging,  mixing  adhesive  materials  need to  be  quickly weighed and stirred, this method is suitable for places with low bonding requirements; Otherwise, you need to use a two-component dispensing machine to mix and apply glue.
l The temperature is too low will cause the curing speed to be slow, and when the initial strength cannot be reached, it needs to be controlled at the site by constant temperature.
l Care needs to be taken to keep the Cartridge mouth sealed during use of cartridge packaging.
l This glue curing process is an exothermic reaction, and the amount of glue will affect the length of operation time, so the operation time under the amount of glue 2g is only a reference time.

• Components A and B should be kept away from light and heat and sealed (can be transported and stored as non-dangerous goods);
• Storage period Component A: 1 year, Component B: 1 year (25℃);
• Beyond the validity period, if you need to continue to use, please first test whether it can be cured normally.

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As a manufacturer, we would like to share with you what we have learned about the different types of potting compounds and their characteristics.
The potting compounds on the market vary in viscosity, requirements for cure conditions, among other factors. Compounds such as polyurethane, silicone, and epoxy are widely used in a variety of applications.
Silicone Potting Compounds are soft and flexible, silicone potting compounds and encapsulating materials possess a good level of elongation.Silicone potting compound can also withstand a wide range of temperatures. Most silicone materials are able to operate at temperatures between -40°C and 200°C.
Epoxy potting compounds generally perform as a better adhesive, high-temperature resistance, and chemical resistance and have better adhesion to a wide variety of substrates and typically do not need primers.
Polyurethane Potting Compounds generally have better flexibility, elongation, and abrasion resistance.
Acrylic Potting Compounds are UV and heat-hardening materials, with fast hardening, adequate chemical resistance, and clear appearance.