Two Component Epoxy Potting Sealant
 
EP 3113A/B is a two-component solvent-free, room temperature curing epoxy potting-sealing material, suitable for motors, automotive electronics, power tools, reactors, instruments with high thermal conductivity requirements of the product packaging protection, and has excellent adhesion and temperature resistance.
EP 3113 has the following characteristics:
Excellent adhesion and cracking resistance
Low CTE linear expansion coefficient
High thermal conductivity 
Excellent electrical insulation and stability
It can be used for a long time at 150℃-180℃
Water absorption is very low, good water and moisture resistance
 
Operation process 
Mixing: Because the filler contained in component A will precipitate with the time of placement, it is necessary to mix component A in the original package before use, and then weigh component A and component B according to the weight ratio of 100:8, and then potting can be done after mixing evenly. 
Component B in the storage process may appear crystallization or agglomeration (belongs to the normal situation), if the crystallization needs to be placed in the 80℃ oven to melt it before use, and then cold to room temperature after use, this will not affect its performance.
Exposed in the air, component B will react with moisture to produce hydrolysis, and the hydrolysis product is a white powdery substance. Try to avoid pouring white material when weighing.
If necessary, the potting device can continue to be vacuumed, which is conducive to increasing the electrical performance of the device.
Curing condition: 25℃*24 hours. For better performance, please follow the curing process of 100℃*2 hours or 80℃*3 hours.
If you need to use glue filling equipment, please consult our Marketing Department.
Precautions
A:B ratio
Hardness at room temperature after curing at 80℃ for 2h
Hardness after curing at 80℃ for 2h, after cooling to room temperature, and then heating to 120℃ temperature point
100:2
Soft, no hardness
-
100:4
D-85
D-25
100:6
D-88
D-78
100:8
D-88
D-82
100:10
D-88
D-80
100:12
D-85
D-14
100:14
D-88
D-14
100:16
D-89
D-14
Conclusion: The amount of curing agent B component more or less than the normal ratio will reduce the hardness of the product at high temperature.
The greater the difference of the addition of B component of curing agent, the greater the change of hardness of colloid and the worse the temperature resistance.
Packaging and storage
EP 3113 High temperature resistant potting 
Order Code:A: 2KEP6172; B: 2KEP6173
Components A and B should be kept away from light and heat and sealed (can be transported and stored as non-dangerous goods); The storage period is one year. 
Component A :20kg/ plastic drum; Component B :0.8kg or 2.4kg/ pot

  We supply OEM & ODM service, You are welcome to test the samples!
As a manufacturer, we would like to share with you what we have learned about the different types of potting compounds and their characteristics.
The potting compounds on the market vary in viscosity, requirements for cure conditions, among other factors. Compounds such as polyurethane, silicone, and epoxy are widely used in a variety of applications.
Silicone Potting Compounds are soft and flexible, silicone potting compounds and encapsulating materials possess a good level of elongation.Silicone potting compound can also withstand a wide range of temperatures. Most silicone materials are able to operate at temperatures between -40°C and 200°C.
Epoxy potting compounds generally perform as a better adhesive, high-temperature resistance, and chemical resistance and have better adhesion to a wide variety of substrates and typically do not need primers.
Polyurethane Potting Compounds generally have better flexibility, elongation, and abrasion resistance.
Acrylic Potting Compounds are UV and heat-hardening materials, with fast hardening, adequate chemical resistance, and clear appearance.