Two-Part A/B Electronic Grade Flexible Silicone Potting Compound for Electronics,Silicone Encapsulating Potting Mix,Glue,PCB,Waterproof for Circuit Board

Two-Part A/B Electronic Grade Flexible Silicone Potting Compound for Electronics,Silicone Encapsulating Potting Mix,Glue,PCB,Waterproof for Circuit Board

High thermal conductivity potting adhesive is mainly used for electrical potting with high heat output and strict sealing. Simply requiring high thermal conductivity may affect other performance indicators of potting adhesive. Therefore, it is still necessary to consider comprehensively in combination with its own potting process, equipment structure design, temperature resistance during later use, and sealing requirements of electronic components. With regard to the selection of high thermal conductivity potting adhesive, the hard or soft high thermal conductivity potting adhesive should be selected according to the device and purpose to be potted. We produce high thermal conductivity and high temperature resistant epoxy resin potting adhesive (hard), with thermal conductivity of 0.8-3.0. In terms of high temperature resistance, there are many application cases in potting process, high temperature resistant potting adhesive and high thermal conductivity potting adhesive, which can be discussed at any time. +8618321208486 ##electronicindustry #doublecomponentsealant #junctionboxes #silicone #pouring #Compounds #leddisplay #sealantapplication #glue #pusealants #electronicsealantgel