Shanghai Max Tech Co.,Ltd’s adhesive sealant products are widely used in wind power photovoltaic, new energy vehicles, industrial electronics, home appliances, lighting and other industries.
Whatever products you are looking for ? Potting sealants, bonding adhesives, thermally conductive adhesives or waterproofing coatings, we have the product that best suits your needs.
Our products have excellent performance and can meet the requirements of various environments to provide reliable protection for your products.
Our current common electronic component potting glue has epoxy resin potting sealant glue, polyurethane potting sealant glue, silicone potting sealant glue, etc., they have their own advantages and disadvantages, application scenarios are also different.
In the era of rapid development of science and technology, the protection of electronic components is crucial, especially in harsh environments, potting material chambers are an effective way to tightly encapsulate electronic components, resist moisture, chemicals, thermal fluctuations and mechanical stress, provide a solid barrier for electronic components, and ensure their longevity and high reliability.
Silicone potting adhesives are well known for their flexibility and ability to withstand extremely low temperatures.
Today we are going to introduce thermal silicone potting sealant materials.
Thermal silicone potting adhesive is a potting material specially designed for electronic components, which combines the excellent performance and thermal conductivity characteristics of silicone to improve the heat dissipation efficiency of electronic devices, extend their service life, and provide additional protection
First, the characteristics of thermal silicone potting glue
· Good thermal conductivity: can effectively transfer the heat generated during the work of electronic components, for example, in the module power supply of high-power electronic components, it can prevent heat accumulation from causing damage to the components, such as some high-power automotive HID lamp module power supply, automotive ignition system module power supply and other application scenarios is very key 1.
· insulation performance: after curing, it can provide good electrical insulation, avoid circuit short circuit and other problems, protect electronic components, and ensure the safe and stable operation of electronic equipment.
· waterproof and moisture-proof: it can prevent moisture and moisture from entering the interior of the potting electronic device. In some equipment that may be exposed to wet environment, such as outdoor solar panels, sensors, etc., it can avoid failure caused by moisture
Temperature resistance: maintain stable performance in a wide temperature range, such as in the temperature range of -60℃ -250 ℃ can maintain the elasticity of silicone rubber, adapt to different working environments, will not soften deformation under high temperature environment, low temperature environment will not embrittle fracture.
Flame retardant: some thermal conductive silicone potting glue has flame retardant performance, up to UL94-V0 and other standards, in the case of electronic equipment failure or short circuit may produce fire source, can inhibit the spread of flame, reduce the risk of fire .
Second, the typical use of thermal silicone potting glue
· Electronic components potting:
· Module power supply: The module power supply of high-power electronic components is pot-sealed to ensure that it has good heat dissipation, strong insulation, and is not affected by external environment, such as the internal module power supply of computer power supply 1.
· Circuit board: used on circuit board, can protect the components of circuit board from moisture, dust, mechanical impact, etc., and help heat dissipation, such as mobile phones, computer motherboards and other circuit boards.
· Sensor: Since the sensor may work in different environments, thermal conductive silicone potting adhesive can provide waterproof, moisture, impact and heat dissipation protection for the sensor, such as automotive sensors, environmental monitoring sensors, etc. 1.
· transformer: used in transformer, help transformer heat dissipation, and prevent external factors from causing damage to it, improve the service life and stability of the transformer.
· Automotive electronic Equipment:
· Automotive HID lamp module power supply: provides protection for the module power supply of automotive HID lamp to ensure that it works normally under complex environment such as high temperature and vibration during the driving of the car, and timely heat dissipation to ensure the stable operation of the lighting system 1.
· Auto ignition system module power supply: used in the module power supply of the auto ignition system to enhance its temperature resistance, insulation and other properties to ensure the reliable operation of the auto ignition system.
· New energy field:
· Solar panel: The electronic components of the solar panel are potted and protected to prevent water, moisture and dust, and ensure that the heat can be dissipated in time to improve the power generation efficiency and service life of the solar panel.
Third, the use of thermal silicone potting adhesive technology
· Mix:
· Proportional mixing: Generally according to the specified weight ratio (such as common 1:1), the two components A and B are put into the mixing tank to stir and mix evenly. Before mixing, it may be necessary to perform special treatment for component B, such as the two-component silicone potting glue of SI8230. It is necessary to shake the container fully in the sealed state of component B to make it evenly mixed before taking.
· Avoid bubbles: If high thermal conductivity is required, vacuum defoaming is recommended after mixing. However, in some cases, such as thin filling thickness (less than 3mm), special defoaming may not be necessary, and the adhesive can defoam by itself. If the potting thickness is large, in order to avoid pinholes or bubbles on the surface and inside, the parts of the potting glue should be put into a vacuum container for debubbling, such as debubbling at 700mmHg for at least 5 minutes 3.
· perfusion: Pour the mixed adhesive into the device to be filled.
· curing:
· room temperature curing: can be cured at room temperature, but the curing speed is relatively slow, for example, some thermal silicone potting glue at room temperature generally take about 1 hour to cure, but different products may be different.
· Heat curing: heat can speed up the curing speed, suitable for use in automatic production lines. For example,SI8230 can be cured at 80℃ for 10-20 minutes, and it is recommended to use heating to cure in the case of low room temperature and long curing time such as winter. The higher the ambient temperature, the faster the curing speed, but care should be taken to avoid surface or internal defects caused by excessive heating speed.
Fourth, the use of thermal silicone potting glue precautions
· adhesive storage: Adhesive storage should be sealed to prevent deterioration due to long-term contact with air. After long-term storage, the filler in the glue may settle, and it can be stirred evenly before use, without affecting the performance-1.
· Use of mixed compound: The mixed compound should be used at one time to avoid waste.
· Avoid contact with specific substances: Contact with certain chemicals can affect the curing of the adhesive, such As N, P, S organic compounds, Sn, Pb, Hg, AS plasma compounds, alkynes and polyvinyl compounds can prevent SI8230 from curing .
· Safety matters: Although most of the thermal conductive silicone potting adhesives are non-dangerous goods, do not enter and eyes, and take protective measures during use.
In A word
Thermal silicone potting adhesive is a kind of high-performance material which integrates the functions of efficient heat conduction, electrical insulation, weather resistance and waterproof sealing, etc. It plays a crucial role in the thermal management and protection of modern electronic equipment. By selecting the appropriate thermal silicone potting adhesive, the performance and reliability of electronic components can be significantly improved, and the service life of the equipment can be extended
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