Max Tech SI8230(#20)2.0 W/MK Thermal Conductivity Silicone Potting Compound Sealant

A 2.0 W/m·K silicone potting sealant is a high-performance thermal interface material (TIM) that efficiently transfers heat from electronic components, offering excellent electrical insulation, environmental protection, and flexibility for applications in automotive electronics, power supplies, sensors, and LED lighting, often in two-component liquid or gel forms for easy dispensing and reworkability. These compounds fill irregular gaps, reduce thermal resistance, and protect devices from shock, moisture, and dust, improving reliability and lifespan. 

Used for encapsulation of various modules,

automotive module,

LED Power driver modules,

Solar panel junction box,

EV charging column module,

Lithium battery pack,

Capacitor banks, Magnetic

induction coils,

Power inverters, etc.

2W/MK thermal conductivity silicone potting compound materials

Key Characteristics

Thermal Performance: Transfers heat effectively with a 2.0 W/m·K thermal conductivity.

Material Type: Silicone-based, offering flexibility, durability, and resistance to extreme temperatures.

Formulation: Often two-component (A+B), low viscosity, allowing for bubble-free, gap-filling encapsulation.

Electrical Properties: High dielectric strength provides excellent electrical insulation.

Application: Used for potting (encapsulating) components like power modules, batteries, sensors, and circuit boards. 

TESTING ITEM	ESTING STANDARD	Part A	Part B
Color	Visual inspection	Gray viscous liquid	White viscous liquid
Viscosity, cps , 25℃	GB/T 10247-2008	6000±1000	5000±1000
Density,,g/cm3, 25℃	GB/T 15223-1994	2.65±0.05	2.65±0.05
Mixture ratio	Weight Ratio	A：B = 100：100
Viscosity of mixture,4#rotor,cps , 25℃	GB/T 10247-2008	5000±1000
Operation time,mins , 25℃	GB/T 10247-2008	30-50
Initial Setting time, hrs	GB/T 10247-2008	3-5
Cure condition	GB/T 10247-2008	25℃/12 hr or 70℃/ 60mins, 80℃/ 30mins
Characteristics after curing
Cured appearance	Visual inspection	Gray elastomer
Hardness, Shore A	GB/T 531-2008	32 （ Shore 0085）
Thermal conductivity，W/mK	GB/T 10297-1998	2.0±0.1
Tensile strength , Mpa	GB/T 528-1998	>0.3
Elongation , %	GB/T 528-1998	>50
Linear expansion，K-1，ppm	HGT 2625-1994	150
Dielectric strength ,kV/mm, 25℃	GB/T 1695-2005	≥15
Volume resistance,DC 500V， Ω·CM	GB/T 1692-92	1.2×1013
Loss factor(1 MHz)	GB/T 1693-2007	0.01
Dielectric constant(1 MHz)	GB/T 1693-2007	5.8
Application temperature,  ℃	GBT 20028-2005	- 60 ∽ 200

Benefits

Improved Efficiency: Dissipates heat from components, preventing overheating. Durability: Protects against vibration, moisture, dust, and thermal cycling.

Reworkability: Some formulations allow for easy removal and repair.

Ease of Use: Low viscosity and good flow properties enable automated dispensing and filling of complex shapes. 

Examples of Use

Automotive: Battery packs, electric vehicle (EV) electronics, automotive sensors.

Power Electronics: LED drivers, power supplies, motor controllers.

Sensors & Modules: Protecting sensors and electronic modules in harsh environments. 

Where to Find It

You can find these products from various manufacturers and suppliers specializing in thermal management materials, often listed as "thermal conductive potting compound, with a 2.0 W/m·K .

Contact Max Teach, factory directly sales !

2.0 W/M K Thermal Conductivity PCB Thermal Conductive Silicone Gel Potting Glue

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