PUR1660 Optically Clear Polyurethane LED Potting Compound

Product features and applications

PUR1660 is an optically clear resin making it ideal for LED encapsulation, suitable for aesthetic as well as protective application over the top of the luminaire.

PUR 1660A/B is a two-component-free-free room temperature or a heat-curable polyurethane gel for two-component sealing and filling. The raw material does not contain heavy metals, green environmental protection, wide process, high finished physical properties, and good binding properties. The room temperature and heating curing can be deeply cured, and the two groups have a good fluidity after mixing, the hardness is extremely low, the flexibility is excellent, and the low temperature resistance is excellent. It is used in communication equipment, transformers, control power, ignition Pouring and potting of controllers, electronic sensors, medical insoles,LED, PCB etc.

Low viscosity, strong operability

Low hardness and certain toughness

Excellent electrical insulation, stability

Good waterproof, moistureproof, very low water absorption

Good adhesion to most metals and plastics

Optically Clear Polyurethane Encapsulant & Potting Compound PUR1660 is a clear, water-white polyurethane resin designed for the encapsulation of electronics, LEDs, electrical products and other items where high transparency and aesthetics are important. PUR optically clear potting compound has excellent non-yellowing colour stability, due to the incorporation of both UV resistant base materials and the addition of UV stabilisers and antioxidants.

PUR is used for a range of applications from high value LED panels to decorative giftware

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PUR1660 Optically Clear Polyurethane LED Potting Compound

11,00 $

每 27 公斤之價格為 297,00 $

Color

數量

Test items       Unit and condition       Test standard
1660

Appearance   A
B
Visual   Visual   transparent fluid
Visual   transparent fluid

Viscosity   A
B
A+B

25℃ mPa·s   GB/T 10247-2008   250±100
           GB/T 10247-2008   800±400
           GB/T 10247-2008   400±200

Density   A
B
A+B

25℃ g/cm3   GB/T 15223-1994   1.05±0.05
           GB/T 15223-1994   1.05±0.05
           GB/T 15223-1994   1.05±0.05

Operation Time
25℃ , minutes   GB/T 10247-2008   20~40
Mixed ratio   Weight ratio   ----   A ：B=100 ： 100
Curing condition   ℃/h   ----   25℃/ 24 h or 70℃/2h
Characteristics after curing

Items   Unit and condition   Test standard
Color   Visual   Visual   transparent
Hardness   Shore 00   GB/T 4985-2010   60±10
Water absorption rate   24hrs, 25℃ , %   GB/T 8810-2005   <0.2
Tensile Strength   Mpa   GB/T 531-2008   4.0
Elongation   %   GB/T 531-2008   100
Shear Strength   Mpa, Fe-Fe   GB/T 6328-86   1.5
Shear Strength   Mpa, Al-Al   GB/T 6328-86   1.5
Thermal Conductivity   W/m.K   GB/T 10297-1998   0.20
Glass transition temperature, Tg   ℃   GB/T 11998-1989   -30
Volume resistivity   25℃ , Ω·cm   GB/T 1692-92   5*1014
Dielectric strength   25℃ , kV/mm   GB/T 1695-2005   20
Dielectric constant   50Hz ，25℃   GB/T 1693-2007   5.0
Dielectric loss   50Hz ，25℃   GB/T 1693-2007   0.12
Linear thermal expansion   μm/（ m ，℃ )   GB/T 20673-2006   <Tg,50
>Tg,200
Application temperature   ℃   GB/T 20028-2005   -80～100
Resistant to yellowing   \   outdoor   >5years
How to use
a) Use: The raw material of material A contains functional resin, before taking the material, pay attention to the detection package is intact. After the filler is completed, it is sealed to prevent the original packaging to prevent excess of moisture. After the rubber is exposed to the air time, it may cause the AB material to bubbling the phenomenon. If conditions permit, the original packaging of material A can be placed in an insulated environment above 30 degrees.

b) Operation: B material is exposed to water absorption in the atmosphere, and the phenomenon is turbid until agglomeration, and the A material also needs to be stored, so as not to solidify excessive bubbles. The environment in which the curing process needs to control the humidity as low as possible, and the relative humidity should not exceed 60%.
c) Preheat: The cast device is taken from 70 to 80 ° C for 1 to 2 hours. It can also reduce the temperature to extend the heating time to remove the device moisture. At low temperatures
The viscosity will increase. The material can be preheated to 25℃ to 45℃ for easier use.

d) Defoulating: Vacher for A \ B buckets, simultaneously, to ensure that the A \ B glue is vacuum- free.
e) Pouring: Put the mixture into the device through a static mixer, the gel time is approximately within 60 mins.

f) Curing: 25℃ / 24 hrs. The environmental humidity should be controlled at <70%, and the temperature is low to extend the curing time as appropriate.
As a manufacturer, we would like to share with you what we have learned about the different types of potting compounds and their characteristics.
The potting compounds on the market vary in viscosity, requirements for cure conditions, among other factors. Compounds such as polyurethane, silicone, and epoxy are widely used in a variety of applications.
Silicone Potting Compounds are soft and flexible, silicone potting compounds and encapsulating materials possess a good level of elongation.Silicone potting compound can also withstand a wide range of temperatures. Most silicone materials are able to operate at temperatures between -40°C and 200°C.
Epoxy potting compounds generally perform as a better adhesive, high-temperature resistance, and chemical resistance and have better adhesion to a wide variety of substrates and typically do not need primers.
Polyurethane Potting Compounds generally have better flexibility, elongation, and abrasion resistance.
Acrylic Potting Compounds are UV and heat-hardening materials, with fast hardening, adequate chemical resistance, and clear appearance.

PUR1660 Optically Clear Polyurethane LED Potting Compound

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