Ep3209 Black High temperature resistant epoxy structural adhesive

EP 3209A/B Epoxy adhesive is a room temperature/heat curing resin adhesive. This two-component bonding adhesive is designed for metal bonding, bonding of cube or SMC fiberglass parts, aluminum honeycomb plate splicing and magnetic steel tile bonding of motor products, ceramic film component sealing, internal structure bonding of lithium battery module, soft magnetic unit potting, high temperature sensor potting, etc.

EP 3209A/B epoxy adhesive can cure in both room temperature and heating environment. After thoroughly mixing component A and component B at 100:50 (weight ratio), the product cures within a certain period of time to form protection.

The cured glue has the following properties:

Resistance to moisture, dirt, and other atmospheric components
High strength, excellent adhesion
Good pollution resistance, low surface pretreatment requirements
No solvent, no curing byproducts
Excellent high and low temperature resistance, -50℃-180℃
Transformer oil resistance, low attenuation
It has good adhesion to glass fiber cloth, aluminum and plastic, aluminum and aluminum and steel plate

Ep3209 Black High temperature resistant epoxy structural adhesive

12,00 $

每 400 毫升之價格為 12,00 $

Color

EP 3090 epoxy structure adhesive is a two-component room temperature curing epoxy resin. (選填)

0/500

數量

Test items   Test standard   Unit   Part A   Part B
Appearance   Visual   ---   Black paste   Beige paste
Viscosity   GB/T 2794-2022   25 ° C, mPa·s   350,000±10,000   30,000±70,000
Density   GB/T 13354-1992   25 ° C, g/cm3   1.12±0.05   1.03±0.05
Mixing ratio   Mass ratio   Ratio=A:B   100:50
Mixing ratio   Volume ratio   Ratio=A:B   100:50
Mixing viscosity   GB/T 2794-2022   25 ° C, Pa·s   150,000±30,000
Operating time   GB/T 2794-2022   25 ° C, 100g, min   70±10
Hardness   GB/T 531.1-2008   Shore D   85±5
Peel strength   GB/T 528-2009   Kgf/cm2, Fe/Fe   240
       Kgf/cm2, AI/AI   226
T-peel strength   GB/T 2791-1995   N/mm(25℃)   6
Shear strength   GB/T 7124-2008   mPa·s   ≥20
Impact strength   GB/T 1843-2008   KJ/m2   15
Glass transition temperature   GB/T 22567-2008   ℃   110
Coefficient of thermal expansion   GB/T 1036-2008   U m/m / ℃   <Tg, 45
>Tg, 152
Thermal cracking temperature   TGA 10℃/min   ℃   290
Water absorption   GB/T 8810-2005   24h, 25 ° C, %   0.45
Dielectric strength   GB/T 1692-2008   kV/mm (25 ° C)   22
Dielectric loss   GB/T 1693-2007   (1MHz) (25 ° C)   0.006
Dielectric constant   GB/T 1693-2007   (1MHz) (25 ° C)   3.1
Volume resistance   GB/T 1692-2008   DC500V,Ω· cm   5.20E +14

Gluing: After stirring the A component in the original package, the A and B components are weighed according to the weight ratio of 100:50.
After the vacuum defoaming is stirred evenly, it will be used up within 80 minutes.
The potting device can continue to be vacuumed if necessary, which is conducive to increasing the electrical performance of the device.
Curing conditions: 120℃*2 hour, 40℃*16 hours or 25℃*24 hours.
If you need to use glue filling equipment, please consult our Marketing Department.
Double tube packaging (2:1 volume ratio), directly use the glue gun for sizing, 5-10 cm glue liquid at the front of the mixing tube is squeezed out before normal use.

The linear expansion coefficient of the adhesive changes with temperature. The hardness of the adhesive changes with temperature

Temperature ° C Temperature ° C

Then the strength is shear strength of aging test: Al-Al as the test blueprint

The curing condition of the adhesive test piece is 120 degrees for 2 hour.

The thickness of adhesive layer is 0.25mm

1. Shear strength MPa at different temperatures after curing

Temperature: ℃

2, double 85 wet heat aging 1000 hours of shear strength MPa

Hour t

3, the bonding effect of different adhesive thickness

Thickness of adhesive layer mm

4, high and low temperature impact -40-120℃ alternating cycle, temperature point stay 30mins, temperature change switching time 3mins.

Number of cycles

5, low temperature storage -40℃ for 2000 hours of stability index

Hour (s) t

6, high temperature storage 85℃ for 2000 hours of stability index

Hour (s) t

A list of different substrate adhesive relays

Types of substrate	Shear strength Mpa
ABS	4.2	Substrate destruction
PVC	2.5	Substrate destruction
PET	2.1	Substrate damage
Nylon PA	3.8	Substrate destruction
Epoxy plate	24.5	Substrate destruction

Components A and B should be kept away from light and heat and sealed (can be transported and stored as non-dangerous goods);

Storage period Component A: 1 year, Component B: 1 year (25℃);

Beyond the validity period, if you need to continue to use, please first test whether it can be cured normally.
As a manufacturer, we would like to share with you what we have learned about the different types of potting compounds and their characteristics.
The potting compounds on the market vary in viscosity, requirements for cure conditions, among other factors. Compounds such as polyurethane, silicone, and epoxy are widely used in a variety of applications.
Silicone Potting Compounds are soft and flexible, silicone potting compounds and encapsulating materials possess a good level of elongation.Silicone potting compound can also withstand a wide range of temperatures. Most silicone materials are able to operate at temperatures between -40°C and 200°C.
Epoxy potting compounds generally perform as a better adhesive, high-temperature resistance, and chemical resistance and have better adhesion to a wide variety of substrates and typically do not need primers.
Polyurethane Potting Compounds generally have better flexibility, elongation, and abrasion resistance.
Acrylic Potting Compounds are UV and heat-hardening materials, with fast hardening, adequate chemical resistance, and clear appearance.
EP 3209 black heat resistant epoxy structural adhesive

Order code A: 2KEP6740; B: 2KEP6741

Component B should be kept away from light and heat and sealed (can be transported and stored as non-dangerous goods); AB storage period is one year.

Component A: 20kg/ plastic drum; Component B: 10kg/ plastic bucket

50ml double tube (2:1 volume ratio), black;

400ml double tube (2:1 volume ratio), black;

This glue is not dangerous and can be transported as a general chemical

Ep3209 Black High temperature resistant epoxy structural adhesive

∎Technical Data Table

Process of use

Storage and Transportation

Order & Shipping

Different potting materials

Order packing