Ep3225(#4)Epoxy Adhesives / Potting Compound with high thermal conductivity

EP3225(4#) A/B is a two-component solvent-free room temperature curing epoxy potting-sealing material, suitable for motors, automotive electronics, power tools, reactors, instruments have high thermal conductivity requirements of the product packaging protection, and has excellent adhesion and insulation properties.

MDEP 3225(4#)A/B has the following characteristics:

l Excellent bond and cracking resistance

l Low CTE linear expansion coefficient

l High thermal conductivity

l Excellent electrical insulation and stability

l It is used in the temperature range of -50℃-180℃

l Water absorption is very low, good water and moisture resistance

l Excellent adhesion to metals (iron, aluminum and copper)

.Operation processl Glue:

Because the filler contained in component A will precipitate with the time of placement, so before use, the A component is stirred evenly in the original package, and then the A and B components are weighed according to the weight ratio of 100:7, and can be potting after mixing evenly.l Component B in the storage process may appear crystallization or agglomeration (belongs to the normal situation), if the crystallization needs to be placed in the 80℃ oven to melt it before use, and then cold to room temperature after use, this will not affect its performance.l Exposed in the air, component B will react with moisture to produce hydrolysis, and the hydrolysis product is a white powdery substance.

Ep3225(#4)Epoxy Adhesives / Potting Compound with high thermal conductivity

11,50 $

每 30 公斤之價格為 345,00 $

Color

數量

Test items   Test Standard   Units   Part A   Part B

Colour
Visual
---   White or black
paste   Colorless or light yellow
clear liquid
Viscosity   GB/T 2794-2022   25℃ , mPa·s   135,000±35,000   100±20
Density   GB/T 13354-1992   25℃ , g/cm3   1.83±0.05   0.96±0.05
Mixing ratio   Mass ratio   Ratio=A:B   100 ：7

Mixing viscosity

GB/T 10247-2008

160g, mPa·s   25℃ , 23,000±5,000
40℃ , 10,000± 2,000
60℃ , 5,000± 1,000
80℃ , 1,000± 300

Operating time

GB/T 10247-2008

A+B= 160g, min   25℃ , 50±15 mins 40℃ , 30 mins 60℃ , 15 mins 80℃ , 10 mins
Gel time   GB/T 10247-2008   25℃ , hr   4-5 hr

Hardness
GB/T 531.1-2008
Shore D   25℃ , 90±5
           130℃ , 80
           150℃ , 76
Thermal conductivity   GB/T 10297-2015   W/mK   0.7
Glass transition   GB/T 22567-2008   ℃   120

Coefficient of expansion   GB/T 20673-2006   μm/（ m ， ℃)   <Tg, 25
>Tg, 65
Impact strength   GB/T 1843-2008   KJ/m2   15

Shear strength   GB/T 7124-2008   Mpa, iron-iron
Mpa,   ≥13
11

Cure shrinkage rate   HG/T 2625-1994   %   0.83
Dielectric strength   GB/T 1693-2007   kV/mm（ 25℃)   ≥18
Loss factor   GB/T 1693-2007   （ 1MHz） (25℃)   0.005
Dielectric constant   GB/T 1693-2007   （ 1MHz） (25℃)   2.8
Volume resistance   GBT 20028-2005   DC500V,Ω · cm   1.0E +15
Operation process

lGlue: Because the filler contained in component A will precipitate with the time of placement, so before use, the A component is stirred evenly in the original package, and then the A and B components are weighed according to the weight ratio of 100:7, and can be potting after mixing evenly.

l Component B in the storage process may appear crystallization or agglomeration (belongs to the normal situation), if the crystallization needs to be placed in the 80℃ oven to melt it before use, and then cold to room temperature after use, this will not affect its performance.

l Exposed in the air, component B will react with moisture to produce hydrolysis, and the hydrolysis product is a white powdery substance. Try to avoid pouring white material when weighing.

l When AB material is mixed, many bubbles will be included in the mixing, and vacuum defoaming is required, which is conducive to increasing the electrical performance of the device.

l Material A viscosity is high, can be pre-baked at 40℃ , and then take out and B material according to the weight ratio of 100:7 mixed.l Initial curing condition: Tg100℃ can be obtained by curing at 25℃*24 hours.

To obtain higher temperature resistance and stronger toughness, please warm up 130 ℃ after curing at room temperature for 1 hour; Or design the curing process according to 80℃*2 hours +130℃*1 hour after potting.

l Customers can adjust the curing temperature and time according to the actual size of the potting object, the size is about small, and the curing time can be short.

l If you need to use glue filling equipment, please consult our Marketing Department.l To use the equipment for filling sealing, it is necessary to heat the A\B cylinder separately to reduce the viscosity. The decrease in the viscosity of the mixed adhesive material will improve the permeability in the glue filling object.

l The amount of curing agent B component more or less than the normal ratio will reduce the hardness of the product at high temperature.

l The greater the difference in the amount of curing agent B component, the greater the change in the hardness of the colloid, and the worse the temperature resistance.

Packaging and storage

EP 3225(4#) Black , Order code: A: 2KEP6682; B: 2KEP6684l Components A and B should be kept away from light and heat and sealed (can be transported and stored as non-dangerous goods); The storage period is one year.l Component A :10kg/ plastic bucket; ComponentB: 0.7kg/bottle
l This product should be stored in A cool and    dry environment below 25℃ , and the storage period of A/B below 25℃ is 1 year.

l The products that exceed the storage period should be tested to confirm whether there is  any abnormality before use.

l Such products are classified as     non-dangerous goods and can be

transported as general chemicals. Be careful of leaks during transportation!
As a manufacturer, we would like to share with you what we have learned about the different types of potting compounds and their characteristics.
The potting compounds on the market vary in viscosity, requirements for cure conditions, among other factors. Compounds such as polyurethane, silicone, and epoxy are widely used in a variety of applications.
Silicone Potting Compounds are soft and flexible, silicone potting compounds and encapsulating materials possess a good level of elongation.Silicone potting compound can also withstand a wide range of temperatures. Most silicone materials are able to operate at temperatures between -40°C and 200°C.
Epoxy potting compounds generally perform as a better adhesive, high-temperature resistance, and chemical resistance and have better adhesion to a wide variety of substrates and typically do not need primers.
Polyurethane Potting Compounds generally have better flexibility, elongation, and abrasion resistance.
Acrylic Potting Compounds are UV and heat-hardening materials, with fast hardening, adequate chemical resistance, and clear appearance.

Ep3225(#4)Epoxy Adhesives / Potting Compound with high thermal conductivity

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