PU 8603 Polyurethane potting compound Material

Product features and applications

PU 8603A/B is a two-component solvent-free room temperature or heat curing resin elastomer combination material, used for two-component sealing, filling, flame retardant, heat conduction and other fields. The raw material does not contain heavy metals, green environmental protection, wide process operability, high physical properties of the finished product, and good adhesion to the substrate. Room temperature and heating can be cured, can be deeply cured, two components after mixing has good fluidity, excellent flexibility after curing, used in communication equipment, transformers, control power, ignition controller, electronic sensors, etc. Pouring and pooping.

Low viscosity, long operation time
Excellent mechanical properties, good toughness
Excellent low temperature characteristics, excellent weather resistance
Excellent electrical insulation and stability
Good waterproof, moisture-proof, water absorption is very low
Good adhesion to most metals and plastics
Introducing the PU 8603 Polyurethane Potting Compound, a high-quality sealant designed for a wide range of applications. With its low viscosity and long operation time, it is easy to work with and provides ample time for precise placement. This compound boasts excellent mechanical properties and good toughness, making it ideal for use in demanding environments. In addition, the PU 8603 features excellent low temperature characteristics and weather resistance, ensuring reliable performance in any conditions. Its superb electrical insulation and stability make it suitable for use in electronic and electrical applications. Furthermore, its good waterproof and moisture-proof properties, combined with very low water absorption, provide added protection. With good adhesion to most metals and plastics, the PU 8603 ensures a secure and lasting seal. Whether used for electronic encapsulation, circuit board protection, or other applications, this polyurethane potting compound is a reliable choice.

PU 8603 Polyurethane potting compound Materials

7,00 US$

210,00 US$ por 30 Kilogramos

Color

Cantidad

Test items   Units and Conditions   Test standard   Beige color   Black   White
Appearance   A   Visual   Visual   Beige fluid   Black fluid   White fluid
   B       Visual   Transparent to translucent,
Colorless to light yellow fluid   Transparent to translucent,
Colorless to light yellow fluid   Transparent to translucent,
Colorless to light yellow fluid
Viscosity   A   25℃, mPa·s   GB/T 2794-2022   600±300   600±300   600±300
   B       GB/T 2794-2022   1,000±400   1,000±400   1,000±400
   A+B       GB/T 2794-2022   800±400   800±400   800±400
Density   A   25 ° C, g/cm3   GB/T 13354-1992   1.00±0.05   1.00±0.05   1.00±0.05
   B       GB/T 13354-1992   1.15±0.05   1.15±0.05   1.15±0.05
   A+B       GB/T 13354-1992   1.10±0.05   1.10±0.05   1.10±0.05
Operational time   150g, 25℃, min   GB/T 2794-2022   ≥40   ≥40   ≥40
Gel Time   150g, 25℃, min   GB/T 2794-2022   100 mins   100 mins   100 mins
Ratio   Weight ratio   ----   A: B=100:100   A: B=100:100   A: B=100:100
Initial curing conditions   150g, ℃/h   ----   25℃/10hr   25℃/10hr   25℃/10hr
* Note: The operation time can be adjusted according to the ambient temperature, the size of the original and other conditions.
Post-curing characteristics
Items   Units or conditions   Test standard   Beige    Black   White
Hardness   Shore-A   GB/T 531.1-2008   60±10   60±10   60±10
Volume Resistance   25°C, Ω·cm   GB/T 1692-2008   1 * 1015   1 * 1015   1 * 1015
Water absorption   24hrs, 25°C, %   GB 8810-2005   < 0.2   < 0.2   < 0.2
Dielectric strength   25°C, kV/mm   GB/T 1695-2005   22   22   22
Application temperature   ℃   GBT 20028-2005   -60 ~ 120   -60 ~ 120   -60 ~ 120
Tensile strength   Mpa   GB/T 528-2009   > 5   > 5   > 5
Elongation at break   %   GB/T 528-2009   > 200   > 200   > 200
Shear strength   Mpa, iron/iron   GB/T 7124-2008   2.2   2.2   2.2
Thermal conductivity   W/m·K   GB/T 10297-2015   0.25   0.25   0.25
Glass transition temperature Tg   ℃   GB/T 22567-2008   - 30   - 30   - 30
Dielectric constant   50Hz, 25 ° C   GB/T 1693-2007   2.8   2.8   2.8
Linear contraction   %   HGT 2625-1994   1.2   1.2   1.2
Linear thermal expansion   μm/ (m, ° C)   GBT 20673-2006   200   200   200
Process of use

Preheating: Please bake the poured device at 70~80℃ for 1~2 hours, which can also reduce the temperature and extend the heating time to remove the moisture of the device. Bepu 6603 at low temperature, the viscosity will become high, can preheat the material to 25℃~45℃ for easy use.

Mixing: Stir well in the original package of A, and then weigh. Weigh A and B materials in proportion, stir vertically with the mixing rod, and stir clockwise (or counterclockwise) in the same direction for 2 to 3 minutes to minimize the mixing of air. Pay attention to the bottom of the container, the edge of the part should also be stirred evenly, otherwise there will be local non-curing phenomenon.

Defoaming: For those who require smooth and no bubbles on the potting surface, the mixture should be vacuumed (≤-0.1mpa) to remove bubbles. Stirring while vacuuming dynamic debubbling, more conducive to the removal of bubbles. If mechanical metering is used for mixed potting, steps 2 and 3 are omitted.

Pouring: Pour the mixture into the device, the device structure is complex, large volume, should be divided pouring. The pouring bubbles can be blown with a hot air gun. Surface bubbles can be eliminated.

Curing: 25℃/24h or 80℃/1h can be cured. The ambient humidity should be controlled at <70%, and the curing time should be extended when the temperature is low.

In the case of insufficient curing time or low room temperature environment, the surface will be sticky the next day is normal, and it will gradually disappear after a few days.

The curing condition of potting glue is affected by temperature and glue amount, high temperature is short curing time, more glue amount is fast curing speed, and vice versa.
Unused raw materials should be stored in a well-sealed bucket to avoid moisture intrusion and affect the quality of raw materials. The opened materials should be kept sealed and used up as soon as possible.

It is recommended to store in a cool area, away from direct sunlight;

Storage temperature: 10-30℃, A material storage period of 12 months; Material B is 6 months.
As a manufacturer, we would like to share with you what we have learned about the different types of potting compounds and their characteristics.
The potting compounds on the market vary in viscosity, requirements for cure conditions, among other factors. Compounds such as polyurethane, silicone, and epoxy are widely used in a variety of applications.
Silicone Potting Compounds are soft and flexible, silicone potting compounds and encapsulating materials possess a good level of elongation.Silicone potting compound can also withstand a wide range of temperatures. Most silicone materials are able to operate at temperatures between -40°C and 200°C.
Epoxy potting compounds generally perform as a better adhesive, high-temperature resistance, and chemical resistance and have better adhesion to a wide variety of substrates and typically do not need primers.
Polyurethane Potting Compounds generally have better flexibility, elongation, and abrasion resistance.
Acrylic Potting Compounds are UV and heat-hardening materials, with fast hardening, adequate chemical resistance, and clear appearance.
Packing Specifications

PU 8603 Black Two-component polyurethane potting compound Order Code:

A: 2KPU2016; B: 2KPU2014

PU 8603 Natural two-component polyurethane potting compound Order Code:

A: 2KPU2013; B: 2KPU2014

PU 8603 White two-component polyurethane potting compound Order Code:

A: 2KPU2015; B: 2KPU2014

Component A: 10kg/ pot

Component B: 10kg/ pot

PU 8603 Polyurethane potting compound Materials

∎Technical Data Table

Process of use

Storage and Transportation

Order & Shipping

Different potting materials

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