Ep6102Flame Retardant Epoxy Potting Compound

PROPERTY    STANDARD/UNITS    Ep6102 Black    Ep6102 White
----    ----    PART A    PART B    PART A    PART B
Appearance    Visual inspection    Black thick liquid    Brown liquid    White thick liquid    Colorless liquid
Viscosity    25°C, cps    20000 ～30000    100~200    20000 ～30000    100~200
Density    25°C, g/cm3    1.85±0.05    1.05±0.05    1.85±0.05    1.05±0.05
Mixture ratio    Mass ratio    A:B=100:20
Viscosity of mixture    25°C, cps    1000~1500
Mixture density    25°C, g/cm3    1.65±0.10
Operation time    25°C, min    60
Preliminary Cured    25°C, hours    4~6
Cure condition    RTV/HEAT    25°C/ 24 hour; 80°C/ 2~3 hour
Curing shrinkage rate    %    ＜2
Hardness    Shore D    ＞85
Water absorption    25°C, 24hrs, %    ＜0.3
Thermal conductivity    W/mK    0.35
Dielectric strength    kV/mm, 25°C    ≥30
Dielectric constant    1.2MHz, 25°C    3.1±0.1
Volume resistance    DC500V, ohm-cm    2.8×1015
Shear strength    Fe-Fe, MPa    ＞10
Application temperature    °C    -40~120
 

• Mixing: Because the filler contained in component A will precipitate with the time of placement, it is necessary to mix component A in the original package before use, and then weigh component A and component B according to the weight ratio of 100:8, and then potting can be done after mixing evenly.
• Component B in the storage process may appear crystallization or agglomeration (belongs to the normal situation), if the crystallization needs to be placed in the 80℃ oven to melt it before use, and then cold to room temperature after use, this will not affect its performance.
• Exposed in the air, component B will react with moisture to produce hydrolysis, and the hydrolysis product is a white powdery substance. Try to avoid pouring white material when weighing.
• If necessary, the potting device can continue to be vacuumed, which is conducive to increasing the electrical performance of the device.
• Curing condition: 25℃*24 hours. For better performance, please follow the curing process of 100℃*2 hours or 80℃*3 hours.
• If you need to use glue filling equipment, please consult our Marketing Department.

l This product should be stored in A cool and    dry environment below 25℃ , and the storage period of A/B below 25℃ is 1 year.

l The products that exceed the storage period should be tested to confirm whether there is  any abnormality before use.

l Such products are classified as     non-dangerous goods and can be

transported as general chemicals. Be careful of leaks during transportation!

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As a manufacturer, we would like to share with you what we have learned about the different types of potting compounds and their characteristics.
The potting compounds on the market vary in viscosity, requirements for cure conditions, among other factors. Compounds such as polyurethane, silicone, and epoxy are widely used in a variety of applications.
Silicone Potting Compounds are soft and flexible, silicone potting compounds and encapsulating materials possess a good level of elongation.Silicone potting compound can also withstand a wide range of temperatures. Most silicone materials are able to operate at temperatures between -40°C and 200°C.
Epoxy potting compounds generally perform as a better adhesive, high-temperature resistance, and chemical resistance and have better adhesion to a wide variety of substrates and typically do not need primers.
Polyurethane Potting Compounds generally have better flexibility, elongation, and abrasion resistance.
Acrylic Potting Compounds are UV and heat-hardening materials, with fast hardening, adequate chemical resistance, and clear appearance.