SI 7315 1.5W/MK One Part Moisture Curing Organic thermal conductivity silicone adhesive
 
SI 7315 is hygroscopic curing of neutral dealcoholized silicone, adding special thermal conductive materials made of thermal silica gel, after curing to form a flexible rubber body, fully in line with the EU ROHS directive requirements. The release of alcohols during the curing process is non-corrosive to polycarbonate (PC), copper and other materials, and has good bonding and sealing performance for most materials, protecting electronic products in a stable state under harsh conditions.
The elastomer cured by SI 7315 silicone adhesive sealant has the following characteristics:
It has a high thermal conductivity
The rubber layer is elastic, not yellow, not oil infiltration, excellent comprehensive performance 
Resistant to moisture, dirt and other atmospheric components
Reduces mechanical stress and tension caused by mechanical, thermal shock and vibration
Excellent electrical insulation and corona resistance
Excellent outdoor aging, service life of up to 20-30 years
Stable mechanical and electrical properties between -60 and 200℃
Fields of Application
LED lighting seal; Automotive electronic components cooling; PCB board and electronic components cooling positioning seal;
High power transistor, thyristor diode and substrate (aluminum, copper) gap filling.
PC Components: Attaching small heat sinks to VRAM, VRM, and MOSFET chips on graphics cards or motherboards.
LED Lighting: Securing high-power LED arrays to aluminum base plates or cooling channels.
Electronics: Potting, sealing, and protecting power supplies, chargers, and small automotive modules.
 
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