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High Thermal Conductivity Flame Retardant Silicone Potting Adhesive SI8230ZN


Product Description

SI8230ZN is a two-component silicone based thermal conductive potting adhesive. It has a good fluidity after mixing, can vulcanize to a deep layer in room temperature. The operation time can be adjusted according to the temperature. Used to potting protection of varied heat dissipation and temperature resistance components. Fully compliant with RoHS and SVHC REACH standards.


Typical Applications

Used for encapsulation of various modules, automotive module, LED Power driver modules, Solar panel junction box, EV charging column module, Lithium battery pack, Capacitor banks, Magnetic induction coils, Power inverters, etc.


Key Features


  • Two-part 1:1 mixture addition type silicone adhesive
  • Low hardening shrinkage
  • Excellent electrical insulation in high temperature and stability
  • Good waterproof and moisture resistance 
  • Excellent flame resistance, UL No: E340199


Packing Specification

●●SI8230ZN,Gray Silicone Potting SealantProduct code: Part A, 0104014,25kg/DrumPart B, 0105015,25kg/Drum


Transport &Storage

When stored at or below 35°C in the original unopened containers, this product has a usable life of 12 months from the date of production. Sampling test is necessary for products which exceed shelf life before taking use. During storage may have little settlement stratification, stirring evenly when use, does not affect performance.

It’s non-dangerous goods, can be transported as normal chemicals, CAUTION leakage during transport.


.Directions for Use

  • Mixing uniformity in the packing before using, as there’s part of filler sedimentation happens during storage.

    Mix Part A and Part B by 1:1 mass ratio, after evenly mixed, pouring directly into the components or modules as per requirements. It’s recommended to slowly pour along the walls of the implements, so as to reduce the bubbles happens.

    Still the potted component to let out the bubbles. Can be cured by heat, about 30 minutes in 80°C. If cured under room temperature, about 4 hours.

  • Vacuum defoaming can improve the performance of the cured products.
  • Seal the remaining products tightly after use.
  • Low temperature will slow the curing speed, overheating will lead to curing speed too fast. Keep a constant temperature in the workshop is recommended.
  • It's hard for SI8230-1 to cure if contact with sulfur, amine, organotin and unsaturated hydrocarbon plasticizer. Common substances like rosin, natural rubber. For these should do test before application.

High Thermal Conductivity Flame Retardant Silicone Potting Adhesive SI8230ZN



    Part A

    Part B


    Visual inspection

    Black viscous liquid

    White viscous liquid

    Viscosity, cps , 25

    GB/T 10247-2008



    Density,,g/cm3, 25℃

    GB/T 15223-1994



    Mixture ratio

    Weight Ratio

    A:B = 100:100

    Viscosity of mixture,4#rotor,cps , 25℃

    GB/T 10247-2008


    Operation time,mins , 25℃

    GB/T 10247-2008


    Cure condition

    GB/T 10247-2008

    25℃/8 hr or 70℃/ 50mins, 80℃/ 30mins

    Characteristics after curing

    Cured appearance

    Visual inspection

    Gray elastomer

    Hardness, Shore A

    GB/T 531-2008


    Thermal conductivity,W/mK

    GB/T 10297-1998


    Linear expansion,K-1,ppm

    HGT 2625-1994


    Dielectric strength ,kV/mm, 25℃

    GB/T 1695-2005


    Volume resistance,DC 500V, Ω·CM

    GB/T 1692-92


    Loss factor(1 MHz)

    GB/T 1693-2007


    Dielectric constant(1 MHz)

    GB/T 1693-2007


    Application temperature,  ℃

    GBT 20028-2005

    - 60 ∽ 250

    Flame resistance



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