SI 7316 0.5W/MK White/Black thermal conductivity silicone adhesive

SI 7316 Silicone thermal conductive adhesive is a neutral silicone thermal conductive adhesive that absorbs moisture in the air and cures at room temperature. It has good bonding and sealing performance for most plastics, metals and other materials, and protects electronic products in a stable state under harsh conditions. During the curing process, trace methanol is released, which has no corrosion on polycarbonate (PC), copper and other materials, and no irritating gas release.
Its cured elastomer has the following properties:
Excellent chemical resistance and good adhesion
Resistance to moisture, dirt and other atmospheric components az
Reduce mechanical stress and tension caused by mechanical, thermal shock and vibration
Excellent outdoor aging, service life of up to 20-30 years
Earthquake resistance, corona resistance, leakage resistance, good insulation
Stable mechanical and electrical properties between -60 and 200℃
Fields of Application
Power supply components; Inkjet printer; Dot printer needle; ECU; Driver IC heat sink; Thermistor; Power IC; Power module; CPU peripheral; Transistors; Diode; Rectifiers; BMS PCB board and thermal aluminum shell bonding

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SI 7316 0.5W/MK White/Black thermal conductivity silicone adhesive

Name: SI 7316 0.5W/MK White/Black thermal conductivity silicone adhesive
Brand: Max Tech
Price: 7 USD
Availability: InStock

‏7.00 US$

Color

packing

Electronic Industry silicone sealant for for household appliance, engineering machinery, PV modules, (اختياري)

0/500

الكمية

Technical parameters before and after curing

Test items	Test standard	Units	7316
Color	Visual	---	White/Black
Appearance	Visual	---	Slightly drippy paste
Density	GB/T 13354-1992	25℃, g/cm3	1.65±0.05
Tack-free Time	GB/T 13477.5-2002	25℃, 55%RH,min	≤ 5
Hardness	GB/T 531.1-2008	Shore A	50± 5
Thermal conductivity	GB/T 10297-2015	W/m.K	0.5 ±0.05
Elongation at break	GB/T 528-2009	%	≥200
Tensile strength	GB/T 528-2009	Mpa	≥ 1
Shear strength	GB/T 7124-2008	Mpa, Steel/steel	≥ 1

All the above data were determined or further experimental tested after 7 days of adhesive curing at 25℃, 55%RH.

Operation process

Clean the surface: the surface of the sticky or coated material is cleaned, and the rust, dust and oil are removed with cleaning agent.

Sizing: Cut the nozzle to the required size and load it into the glue gun. Squeeze the glue solution onto the cleaned surface for an even distribution. When bonding, the adhesive surface can be closed and fixed.

Curing: curing process is a curing process from the surface to the inside, within 24 hours (room temperature and 55% relative humidity) glue will cure 2 ~ 4mm depth, if the glue position is deep, especially not easy to access to the air, the full curing time will be extended, if the temperature is low, curing time will also be extended, It takes more than 3 days for the 6mm thick sealant to fully cure.

Precautions: use as much as possible once after opening, once not used up, when used again, squeeze out the cured part, continue to use, does not affect normal use.

Please consult MAXTECH Marketing Department for dispensing equipment.
Fields of Application

Power supply components; Inkjet printer; Dot printer needle; ECU; Driver IC heat sink; Thermistor; Power IC; Power module; CPU peripheral; Transistors; Diode; Rectifiers; BMS PCB board and thermal aluminum shell bonding
SI 7316 white thermal conductivity silicone adhesive Order code: 1KSI1090

l 100ml/ PCS, 100 PCS/box;

l 300ml/ PCS, 25 PCS/box

l 2.6L/ PCS, 6 PCS/box

MDSI 7316 black thermal conductivity silicone adhesive Order code: 1KSI1091

l 100ml/ PCS, 100 PCS/box;

l 300ml/ PCS, 25 PCS/box

l 2.6L/ PCS, 6 PCS/box l

Storage and transportation

l Store away from light and heat and in tight seal.

l This product is non-dangerous goods, transported and stored as general chemicals.

l The storage period is 9 months at 25℃ . After the storage period, please take a sample for testing.

SI 7316 0.5W/MK White/Black thermal conductivity silicone adhesive

∎Technical Data Table

∎Directions for Use

Usage

∎Transport &Storage