EP3211 High strength Epoxy structure adhesive

Maxtech Ep3211 Epoxy adhesive is a room temperature/heat curing resin adhesive. This two-component adhesive is designed for metal bonding, SMC FRP parts bonding, aluminum honeycomb plate splicing and Nomex paper bonding for motor products.

Maxtech Ep3211 Epoxy bonding adhesive can cure at room temperature and heating environment. After thoroughly mixing component A and component B at 1:1 (weight ratio), the product solidifies within a certain time to form protection.

The cured glue has the following properties:

Resistance to moisture, dirt, and other atmospheric components

High strength, excellent adhesion

Good pollution resistance, low surface pretreatment requirements

No solvent, no curing byproducts

Excellent high and low temperature resistance, -50℃-150℃

It has good adhesion to glass fiber cloth and steel plate

For bonding metal, SMC, FRP, aluminum honeycomb cores, and Nomex paper, you need a high-strength, two-component toughened structural epoxy. These adhesives deliver exceptional shear and peel strength while resisting impact and vibration, making them ideal for aerospace, automotive, and industrial composite manufacturing.

Typical application

Used for SMC FRP parts bonding, aluminum honeycomb plate splicing and transformer motor core bonding, Nomex paper bonding, high-speed rail track repair,

Rail transit metal and plastic, metal and composite bonding, etc.

Important Application Considerations

Surface Preparation: Metals and SMC surfaces require thorough degreasing and abrasion (e.g., sanding followed by solvent wiping) for maximum adhesion.
Curing Process: Depending on your production throughput, you can use room-temperature curing (usually taking 24 hours to reach full handling strength) or heat-accelerated curing (e.g., 60 °C for 60 minutes) to significantly expedite the process.

Mix Ratio & Work Life: Most two-part epoxies require an exact 1:1 ratio. Take into account the operating/working time (often 80 to 110 minutes depending on the specific product) to ensure proper alignment before the curing process begins.

EP3211 High strength Epoxy structure adhesive

‏15.00 US$

‏15.00 US$ لكل 600 مللي لتر

Color

EP 3090 epoxy structure adhesive is a two-component room temperature curing epoxy resin. (اختياري)

0/500

الكمية

Conventional properties

			EP 3211 Gray	EP 3211 Black
Test item	Test standard	Unit	Part A	Part B	Part A	Part B
Color	Visual	---	Black colloid	Beige colloid	Black paste	Beige paste
Viscosity	GB/T 2794-2013	mPa.s	The paste is slightly collapsed	The paste is slightly collapsed	170,000±30,000	200,000±50,000
Density	GB/T 13354-1992	g/cm3 (25 ° C)	1.50±0.05	1.30±0.05	1.60±0.05	1.50±0.05

Operation process

Item	Units or conditions	MDEP 3211 Grey	MDEP 3211 Black
Mix ratio	Weight ratio	100:100	100:100
Mix ratio	Volume ratio	100:100	100:100
Mix density	g/cm3 (25 ° C)	1.40±0.05	1.55±0.05
Operating time (1)	min (25 ° C)	80mins	110mins
Curing time	℃/min	60 ° C / 60 mins or 25 ° C 24 hrs

Surface treatment. Use sandpaper or solvent to clean the sticky surface, remove the surface grease and dirt, and improve the bonding environment.
Barrel A, B material is recommended before use, please first stir A/B components, A, B should pay attention to sealed storage after use.
When mixing, attention should be paid to stirring in the same direction, otherwise too many bubbles will be mixed; The container frame and the bottom of the glue should also be stirred evenly, otherwise there will be uneven mixing caused by local non-curing phenomenon.
The temperature is too low will lead to slow curing speed, when the initial strength can not be reached, the need for constant temperature control in the field.
Care needs to be taken to keep the Cartridge mouth sealed during use of cartridge packaging.
This glue curing process is an exothermic reaction, and the amount of glue will affect the length of operation time, so the operation time under the amount of glue 100g is only a reference time.

Curing speed
EP 3211 Black
Temperature, C   0   5   15   25   35   60   80
Operating time, h   8   5   1   0.5   0.3   0.1   0.05
Time to reach 50% bonding strength, h   72   48   24   12   8   0.5   0.1
Time to reach 100% bonding strength, h   240   96   48   30   16   2   0.5
The ambient temperature below 5℃ is not recommended to use, if used, it is necessary to warm the AB glue to more than 20℃ before construction, in order to obtain the best mixing effect. For the best curing speed, you can choose the method of heating curing or pre-drying the product of dispensing glue.
Typical performance
Item   Test standard   Unit   Numerical value
Hardness   GB/T 531.1-2008   Shore D   83
Shear strength   GB 7124-2008   Mpa, Fe/Fe   ≥15
Thermal conductivity   GB/T 10297-1998   W/mK   0.4
Coefficient of expansion   GB/T 20673-2006   μm/ (m, ° C)   55
Water absorption   GB/T 8810-2005   24h, 25 ° C, %   < 0.3
Dielectric strength   GB/T 1693-2007   kV/mm (25 ° C)   > 20
Loss factor   GB/T 1693-2007   (1MHz) (25 ° C)   0.014
Dielectric constant   GB/T 1693-2007   (1MHz) (25 ° C)   3.53
Volume Resistance   GB/T 1692-92   (DC500V) Ω· cm   1.2 x 1015
Note: All the above data were determined after 7 days of adhesive curing at 25℃, 55%RH.
Item   Test standard   Unit   Numerical value
Compressive strength   12hr   GB 11837-89   MPa   ≥30
   24hr   GB 11837-89   MPa   ≥55
Tensile strength   2hr   GB/T 528-2009   MPa   ≥3
   24hr   GB/T 528-2009   MPa   ≥30
Bonding strength   GB/T 7124-2008   Mpa, 8-figure mortar   > 8
Shrinkage rate   GBT15585-1995   %   < 1.5
Elongation at break   GB/T 528-1998   %   > 3
Temperature range    GBT 20028-2005   ℃   -40 to 150
Burn-in performance
Curing Conditions   Substrate   Aging conditions   Shear strength MPa   Mode of destruction
Room temperature
7 days   SMC/SMC   High and low temperature impact
(-40 ° C /30mins,
80 ° C /30mins, repeat 10 times)   9.2   90% substrate damage
   Al/Al       15.8   90% substrate damage
   Nomex paper /Nomex paper       4.6   80% substrate damage
80 ℃ /
2 hours   SMC/SMC   150° C /1 hour   8.5   100% substrate destruction
   Al/Al       12.6   100% substrate destruction
   Nomex paper /Nomex paper       2.3   48% substrate damage
Components A and B should be kept away from light and heat and sealed (can be transported and stored as non-dangerous goods);

Storage period Component A: 1 year, Component B: 1 year (25℃);

Beyond the validity period, if you need to continue to use, please first test whether it can be cured normally.
As a manufacturer, we would like to share with you what we have learned about the different types of potting compounds and their characteristics.
The potting compounds on the market vary in viscosity, requirements for cure conditions, among other factors. Compounds such as polyurethane, silicone, and epoxy are widely used in a variety of applications.
Silicone Potting Compounds are soft and flexible, silicone potting compounds and encapsulating materials possess a good level of elongation.Silicone potting compound can also withstand a wide range of temperatures. Most silicone materials are able to operate at temperatures between -40°C and 200°C.
Epoxy potting compounds generally perform as a better adhesive, high-temperature resistance, and chemical resistance and have better adhesion to a wide variety of substrates and typically do not need primers.
Polyurethane Potting Compounds generally have better flexibility, elongation, and abrasion resistance.
Acrylic Potting Compounds are UV and heat-hardening materials, with fast hardening, adequate chemical resistance, and clear appearance.
EP 3211 Gray two-component epoxy structural adhesive Order code:

A: 2KEP6180; B: 2KEP6181;

A+B: 2KEP6182

EP 3211 Black two-component epoxy structural adhesive Order Code:

A: 2KEP6645; B: 2KEP6646

Component A: 20 kg/barrel; Component B: 20kg/ barrel;

Cartridge (A 300ml/B 300ml) Cartridge

50ml double tube:

Custom packaging is also available

This glue is not dangerous and can be transported as a general chemical

EP3211 High strength Epoxy structure adhesive

∎Technical Data Table

Process of use

Storage and Transportation

Order & Shipping

Different potting materials

Order packing